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STM8L151K3U6

STMicroelectronics

STM8L151K3U6 by STMicroelectronics

STM8L151K3U6 by STMicroelectronics is an 8-bit microcontroller with 32 terminals, operating at a max frequency of 16 MHz. It features 1024 bytes of RAM, 256 bytes of EEPROM, and 23-ch ADCs. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,629 parts In-Stock

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3,629

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Vyrian

USA . 2,672 parts In-Stock

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2,672

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Anansix

USA . 2,408 parts In-Stock

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2,408

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Distributors (Availability)

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Vigor

Singapore . 4,195 parts In-Stock

1+ parts

$0.930

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4,195

$0.930

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Microchip USA

USA . 5,299 parts In-Stock

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$8.110

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5,299

$8.110

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AZTECH Wire

Italy . 400 parts In-Stock

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$11.340

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400

$11.340

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Component Stockers USA

USA . 1,186 parts In-Stock

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$21.740

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1,186

$21.740

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IDEA Electronic Components Group

UK . 1,336 parts In-Stock

1+ parts

$77.628

100+ parts

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$69.865

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1,336

$77.628

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$69.865

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MKK Technologies

India . 957 parts In-Stock

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$145.974

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957

$145.974

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DigiPath Technology Company

USA . 957 parts In-Stock

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$145.974

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957

$145.974

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A-Z Elektronik GmbH

Germany . 5,954 parts In-Stock

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5,954

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Corphita

USA . 1,749 parts In-Stock

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1,749

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Parana Technologies

USA . 1,670 parts In-Stock

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$92.816

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1,670

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$92.816

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Overview

Elevate your projects with the STM8L151K3U6 microcontroller from STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics brings you a powerful 8-bit microcontroller that is perfect for a wide range of applications. With features like ADC channels, DMA channels, and PWM channels, this microcontroller offers unparalleled performance and flexibility. Whether you're working on IoT devices, consumer electronics, or industrial automation, the STM8L151K3U6 provides the value and benefits you need to bring your creations to life. Choose STMicroelectronics for cutting-edge technology that never disappoints.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easier to mount the microcontroller directly onto a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of peripherals and sensors.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, making it suitable for compact designs.

Bit Size: 8

The 8-bit architecture is well-suited for simpler applications and cost-effective solutions.

Power Supplies (V): 2/3.3

Support for multiple power supply options enables compatibility with different voltage requirements and energy-saving operation modes.

No. of Terminals: 32

With a sufficient number of terminals, this microcontroller can easily connect to various external components and interfaces.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package styles offer options for heat dissipation and compact form factor, making it suitable for applications with space constraints and heat dissipation requirements.

Minimum Supply Voltage: 1.8 V

The lower minimum supply voltage allows for power-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can operate reliably in harsh environmental conditions without risk of overheating.

CPU Family: STM8

Being part of the STM8 family ensures compatibility with existing STM8-based projects and tools, simplifying development and integration processes.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold environments, making it suitable for diverse applications.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and enables reliable solder connections for long-term device durability.

ADC Channels: YES

The presence of analog-to-digital converter channels allows for versatile sensor interfacing and data acquisition capabilities.

DMA Channels: YES

Direct Memory Access channels facilitate efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

The quad terminal position enhances PCB layout flexibility and simplifies the routing of signal traces for improved signal integrity.

ROM Words: 8192

With a large ROM capacity, this microcontroller can store complex program code, data tables, and configurations, enabling versatile application functionality.

Maximum Seated Height: 0.6 mm

The low profile height allows for a compact overall device size, making it suitable for slim and space-constrained designs.

Width: 5 mm

The compact width dimension ensures efficient use of PCB space and enables densely packed designs with multiple components.

Data EEPROM Size: 256

The EEPROM size provides non-volatile memory storage for critical data, configurations, and settings, ensuring data retention even during power loss.

Peripherals: BOD, COMPARATOR(2), DMA(5), POR, RTC, TIMER(6)

The diverse set of peripherals offers comprehensive support for system monitoring, communication, data processing, and timing functions, enhancing the microcontroller's versatility.

Maximum Clock Frequency: 16 MHz

The high clock frequency enables fast execution of instructions and data processing tasks, improving overall system performance and responsiveness.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering during the manufacturing process, ensuring robust connections and product quality.

Length: 5 mm

The compact length dimension contributes to a space-efficient layout on the PCB and enables streamlined designs with minimal footprint.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller meets stringent temperature and reliability requirements, making it suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture and comprehensive peripheral integration provide efficient processing capabilities and versatile functionality for a wide range of applications.

RAM Bytes: 1024

The generous RAM size allows for efficient data storage and manipulation during program execution, enabling complex algorithms and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital and analog components, ensuring reliable performance.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and industry standards, promoting sustainability and safe manufacturing practices.

Analog To Digital Convertors: 23-Ch 12-Bit

The multiple ADC channels with high resolution enhance analog signal processing capabilities, enabling precise sensor interfacing and data acquisition.

Maximum Supply Current: 4.88 mA

The low maximum supply current ensures energy-efficient operation and extends battery life in portable and power-constrained devices.

Nominal Supply Voltage: 3 V

The stable nominal supply voltage ensures consistent and reliable operation of the microcontroller across different input power sources.

PWM Channels: YES

The presence of Pulse-Width Modulation channels enables precise control of motor speeds, LED brightness, and other analog output devices, enhancing system flexibility and performance.

Connectivity: I2C, SPI, USART

Support for multiple communication interfaces such as I2C, SPI, and USART allows for seamless connectivity with external devices, sensors, and networks, enhancing system interoperability.

ROM Programmability: FLASH

Flash-based ROM programmability enables convenient firmware updates, customization, and field upgrades without the need for external programming equipment, improving system flexibility.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on the PCB and facilitates precise soldering, ensuring reliable electrical connections and signal integrity.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate moisture sensitivity, making it suitable for standard SMT assembly processes and environments.

Speed: 16 rpm

The 16 MHz speed capability supports fast data processing and real-time control tasks, improving system responsiveness and performance.

On Chip Program ROM Width: 8

The 8-bit ROM width allows for efficient handling of program instructions and data, ensuring streamlined execution and resource utilization.

No. of I/O Lines: 26

With a generous number of I/O lines, this microcontroller offers versatile interfacing options for external devices, sensors, and peripherals, enabling diverse application configurations.

Technical Specifications

Microcontrollers STM8L151K3U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.88 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(5), POR, RTC, TIMER(6)

Analog To Digital Convertors:

23-Ch 12-Bit

Trade Compliance

STM8L151K3U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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