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STM8L151G6U7

STMicroelectronics

STM8L151G6U7 by STMicroelectronics

STM8L151G6U7 by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz, 32768 ROM words, and 2048 RAM bytes. It is suitable for industrial applications requiring a wide temperature range (-40 to 105 °C) and features ADC and DMA channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,468 parts In-Stock

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5,468

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Digiode

USA . 3,040 parts In-Stock

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Anansix

USA . 964 parts In-Stock

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964

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Distributors (Availability)

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AZTECH Wire

Italy . 163 parts In-Stock

1+ parts

$8.750

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163

$8.750

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IDEA Electronic Components Group

UK . 1,563 parts In-Stock

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$13.935

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$12.542

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1,563

$13.935

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$12.542

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Microchip USA

USA . 2,127 parts In-Stock

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$19.500

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2,127

$19.500

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MKK Technologies

India . 2,207 parts In-Stock

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$26.204

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2,207

$26.204

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DigiPath Technology Company

USA . 2,207 parts In-Stock

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$26.204

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2,207

$26.204

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$39.071

100+ parts

$35.555

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$32.038

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500

$39.071

$35.555

$32.038

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iodParts Technologies Inc.

India . 8,018 parts In-Stock

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Corphita

USA . 2,601 parts In-Stock

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Parana Technologies

USA . 451 parts In-Stock

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$16.662

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$16.662

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Overview

Unlock the limitless possibilities with the STM8L151G6U7 microcontroller by STMicroelectronics. This cutting-edge device boasts unparalleled quality and reliability from a trusted manufacturer, making it ideal for a wide range of applications. Whether you're looking to optimize your industrial processes or enhance your IoT devices, this microcontroller offers unmatched value, efficiency, and performance. Experience seamless integration and superior functionality with the STM8L151G6U7 - the ultimate solution for all your embedded system needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology makes it easy to integrate into compact electronic designs and reduces assembly time.

Maximum Supply Voltage: 3.6 V

Supports a relatively high supply voltage range, increasing flexibility in power supply options.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy alignment during assembly.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost for many embedded system applications.

Power Supplies (V): 1.8/3.3

Support for low voltage operation at 1.8V and standard 3.3V allows for power-efficient designs.

No. of Terminals: 28

Ample number of terminals for connecting various peripherals and external components, enhancing versatility.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier package with a thin profile enables compact overall device size and efficient thermal management.

Minimum Supply Voltage: 1.65 V

Support for low supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

High operating temperature range makes this microcontroller suitable for industrial applications where temperature variations occur.

CPU Family: ST8

ST8 CPU family offers reliable performance and compatibility with various software tools and development environments.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40 °C to 105°C) allows for reliable operation in extreme cold conditions.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, enabling sensor interfacing and data acquisition capabilities.

DMA Channels: YES

Support for direct memory access (DMA) channels enhances data transfer efficiency and reduces CPU load.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing, improving overall system design.

ROM Words: 32768

Large ROM capacity of 32K words provides ample space for program storage and firmware updates.

Width: 4 mm

Compact 4mm width saves board space and enables designs with tight dimensional constraints.

Maximum Clock Frequency: 16 MHz

High clock frequency of 16MHz allows for fast execution of instructions and efficient real-time processing.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable and stable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers efficient data processing and power management for embedded applications.

RAM Bytes: 2048

Generous RAM capacity of 2KB enables efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall performance and reliability.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and assembly processes, reducing overall production cost and time.

Maximum Supply Current: 4.87 mA

Low maximum supply current consumption of 4.87mA contributes to energy efficiency and extended battery life.

Nominal Supply Voltage: 3 V

Stable 3V nominal supply voltage ensures consistent performance and reliable operation of the microcontroller.

PWM Channels: YES

Support for PWM channels enables precise control of pulse-width modulation signals for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization of the device's functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm facilitates high-density PCB layouts and improves signal integrity in compact designs.

Speed: 16 rpm

Operates at a speed of 16rpm, providing fast data processing and response times for real-time applications.

No. of I/O Lines: 26

Abundance of 26 I/O lines offers flexible interfacing options with external devices and peripherals.

Technical Specifications

Microcontrollers STM8L151G6U7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N28

Length:

4 mm

No. of I/O Lines:

26

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.87 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Trade Compliance

STM8L151G6U7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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