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STM8L151C8T3TR

STMicroelectronics

STM8L151C8T3TR by STMicroelectronics

STM8L151C8T3TR by STMicroelectronics is an 8-bit microcontroller with 48 terminals, operating at a max frequency of 16 MHz. It features DAC and ADC channels, along with DMA support. Ideal for automotive applications due to its low profile package and wide temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,096 parts In-Stock

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Digiode

USA . 4,099 parts In-Stock

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4,099

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Anansix

USA . 2,518 parts In-Stock

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2,518

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Distributors (Availability)

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AZTECH Wire

Italy . 969 parts In-Stock

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$12.750

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969

$12.750

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Ampacity Inc.

Singapore . 177 parts In-Stock

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$19.000

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177

$19.000

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IDEA Electronic Components Group

UK . 619 parts In-Stock

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$73.380

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$66.042

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619

$73.380

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$66.042

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MKK Technologies

India . 1,606 parts In-Stock

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$137.987

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$137.987

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DigiPath Technology Company

USA . 1,606 parts In-Stock

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$137.987

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$137.987

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QUARKTWIN TECHNOLOGY LTD

USA . 29,175 parts In-Stock

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Microchip USA

USA . 10,284 parts In-Stock

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Corphita

USA . 4,290 parts In-Stock

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4,290

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Vigor

Singapore . 2,524 parts In-Stock

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2,524

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Parana Technologies

USA . 1,077 parts In-Stock

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$87.737

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1,077

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$87.737

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Overview

Unlock limitless possibilities with the STM8L151C8T3TR microcontroller by STMicroelectronics. Crafted with precision and expertise, this powerful device offers unrivaled performance and reliability for a wide range of applications. From automotive to industrial automation, this microcontroller empowers your projects with its advanced features and seamless integration. Experience the future of technology with the STM8L151C8T3TR and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to heat, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V ensures compatibility with various power sources and components.

Package Shape: SQUARE

Square package shape offers efficient use of space on the PCB and facilitates compact designs.

Bit Size: 8

8-bit operation provides a good balance between data processing capabilities and cost-effectiveness for many embedded applications.

DAC Channels: YES

DAC channels enable analog output capabilities, allowing for precise control and monitoring of external devices.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with various power sources.

No. of Terminals: 48

With 48 terminals, the microcontroller can support a wide range of peripherals and interfaces, enhancing connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style allows for high-density mounting on the PCB, saving space and improving signal integrity.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8V ensures compatibility with low-power applications and extends battery life.

Maximum Operating Temperature: 125 °C

Support for a high maximum operating temperature of 125 °C makes the microcontroller suitable for automotive and industrial applications with demanding environmental conditions.

CPU Family: STM8

Being part of the STM8 CPU family ensures compatibility with STM8 development tools and a rich ecosystem for software development.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the microcontroller can operate reliably in harsh cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

ADC channels enable analog input capabilities, allowing the microcontroller to read and process sensor data accurately.

DMA Channels: YES

DMA channels improve data transfer efficiency by offloading data movement tasks from the CPU, enhancing system performance.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and assembly, ensuring proper alignment and connectivity.

ROM Words: 65536

With a ROM capacity of 65,536 words, the microcontroller offers ample storage for program code and data.

Maximum Seated Height: 1.6 mm

Low maximum seated height enables slim and compact device designs, particularly for space-constrained applications.

Width: 7 mm

Compact 7mm width allows for space-efficient placement on the PCB, facilitating tight PCB layouts.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16MHz provides fast processing speeds for real-time applications and high-performance computing tasks.

Maximum Time At Peak Reflow Temperature (s): 40

Support for a peak reflow temperature duration of 40 seconds ensures reliable and consistent solder connections during PCB assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C allows for lead-free soldering, complying with environmental regulations.

Length: 7 mm

With a length of 7mm, the microcontroller offers a compact form factor suitable for space-constrained designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates robustness and reliability for automotive applications subjected to extreme temperature variations.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, the product integrates various peripherals and I/O interfaces, providing a complete solution for embedded system design.

RAM Bytes: 4096

With 4096 bytes of RAM, the microcontroller offers sufficient memory for data storage and processing during runtime.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies PCB mounting and rework processes, ensuring secure and consistent solder joints.

Maximum Supply Current: 180 mA

Support for a maximum supply current of 180mA enables reliable operation of power-hungry peripherals and external components.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V ensures stable and consistent power delivery for the microcontroller and attached devices.

PWM Channels: YES

PWM channels allow for precise control of analog signals, enabling efficient motor control, LED dimming, and other applications requiring pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability enables in-circuit programming and firmware updates, enhancing flexibility and ease of maintenance for the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting on the PCB, facilitating compact designs and signal integrity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand intermediate exposure to moisture during storage and handling, ensuring reliability in varied environmental conditions.

Speed: 16 rpm

Operating speed of 16 revolutions per minute indicates a fast and responsive microcontroller suitable for time-critical applications.

No. of I/O Lines: 41

With 41 I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices and sensors, enhancing system flexibility.

Technical Specifications

Microcontrollers STM8L151C8T3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

180 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8L151C8T3TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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