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STM8AL3188TAY

STMicroelectronics

STM8AL3188TAY by STMicroelectronics

STM8AL3188TAY from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 16 MHz. It features 41 I/O lines, ADC, and PWM channels, making it ideal for low-power applications in consumer electronics. Its compact FLATPACK design ensures efficient space utilization.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,070 parts In-Stock

1+ parts

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4,070

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Vyrian

USA . 1,917 parts In-Stock

1+ parts

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1,917

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Anansix

USA . 829 parts In-Stock

1+ parts

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829

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 9,190 parts In-Stock

1+ parts

$1.830

100+ parts

-

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9,190

$1.830

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Microchip USA

USA . 4,173 parts In-Stock

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$15.849

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4,173

$15.849

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AZTECH Wire

Italy . 134 parts In-Stock

1+ parts

$16.870

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134

$16.870

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IDEA Electronic Components Group

UK . 1,936 parts In-Stock

1+ parts

$69.746

100+ parts

-

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$62.772

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1,936

$69.746

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$62.772

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MKK Technologies

India . 1,389 parts In-Stock

1+ parts

$131.153

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1,389

$131.153

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DigiPath Technology Company

USA . 1,389 parts In-Stock

1+ parts

$131.153

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1,389

$131.153

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,111 parts In-Stock

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2,111

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Parana Technologies

USA . 1,720 parts In-Stock

1+ parts

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100+ parts

$83.392

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1,720

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$83.392

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Overview

Unlock the power of innovation with the STM8AL3188TAY microcontroller from STMicroelectronics, a leader in quality and reliability. This compact powerhouse is designed for versatile applications, ensuring seamless integration into your projects while delivering exceptional performance. With its advanced features, including multiple ADC and PWM channels, it empowers developers to create efficient, cutting-edge designs. Experience unparalleled support and trust in STMicroelectronics' expertise, elevating your solutions to new heights!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact PCB layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The relatively low maximum supply voltage ensures compatibility with battery-operated devices, enhancing energy efficiency.

Package Shape: SQUARE

The square package shape optimizes space usage on the PCB, facilitating a more efficient arrangement of components.

Bit Size: 8

An 8-bit microcontroller is well-suited for simple control applications and cost-sensitive designs.

No. of Terminals: 48

With 48 terminals, this microcontroller provides ample connectivity options for peripheral devices, enhancing its versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style allows for low-profile designs, suitable for portable electronics and applications with height constraints.

Minimum Supply Voltage: 1.8 V

The minimum supply voltage of 1.8 V allows for operation in low-power environments, which is ideal for battery-powered designs.

ADC Channels: YES

The inclusion of ADC channels allows for the direct reading of analog signals, making it suitable for sensor applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer without CPU intervention, improving system performance in data-heavy applications.

Terminal Position: QUAD

Quad terminal positioning provides an efficient layout for connections, enhancing signal integrity and reducing noise.

Width: 7 mm

A 7 mm width allows for compact designs, suitable for modern applications requiring small footprints.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures adequate processing speed for a wide range of applications without excessive power consumption.

Length: 7 mm

With a length of 7 mm, this microcontroller promotes compact circuit board designs, maximizing available space.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is designed for integration of multiple functionalities, reducing the need for additional components.

Technology: CMOS

CMOS technology ensures low power consumption and high integration capabilities, beneficial for energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and are suitable for automated assembly processes.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is optimal for many low-power devices, enhancing battery life in portable applications.

PWM Channels: YES

PWM channels allow for precise control of motors and other devices, making the microcontroller great for automation and control tasks.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables a finer layout of the components, allowing for more complex circuit designs in smaller areas.

Speed: 16 rpm

Operating at 16 rpm indicates suitability for low-speed applications, providing adequate control for various tasks.

No. of I/O Lines: 41

Having 41 I/O lines offers extensive flexibility for interfacing with various components, making it adaptable for diverse applications.

Technical Specifications

Microcontrollers STM8AL3188TAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

41

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3188TAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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