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STM8AF6226TASSSX

STMicroelectronics

STM8AF6226TASSSX by STMicroelectronics

STM8AF6226TASSSX by STMicroelectronics is an 8-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART. With 7 ADC channels and 3 timers, it offers versatile peripheral support for various embedded systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,904 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12,904

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Digiode

USA . 2,794 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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2,794

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-

-

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Anansix

USA . 220 parts In-Stock

1+ parts

-

100+ parts

-

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220

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-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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-

1k+ parts

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10

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,235 parts In-Stock

1+ parts

$1.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

$1.490

-

-

-

AZTECH Wire

Italy . 321 parts In-Stock

1+ parts

$4.880

100+ parts

-

1k+ parts

-

10k+ parts

-

321

$4.880

-

-

-

Ampacity Inc.

Singapore . 346 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

346

$8.000

-

-

-

Microchip USA

USA . 5,120 parts In-Stock

1+ parts

$11.396

100+ parts

-

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-

10k+ parts

-

5,120

$11.396

-

-

-

Aztec Data Supply Inc.

USA . 3,004 parts In-Stock

1+ parts

$24.136

100+ parts

-

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3,004

$24.136

-

-

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IDEA Electronic Components Group

UK . 308 parts In-Stock

1+ parts

$46.592

100+ parts

-

1k+ parts

$41.933

10k+ parts

-

308

$46.592

-

$41.933

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Corohmni

South Africa . 23 parts In-Stock

1+ parts

$56.266

100+ parts

-

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23

$56.266

-

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MKK Technologies

India . 2,366 parts In-Stock

1+ parts

$87.614

100+ parts

-

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2,366

$87.614

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DigiPath Technology Company

USA . 2,366 parts In-Stock

1+ parts

$87.614

100+ parts

-

1k+ parts

-

10k+ parts

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2,366

$87.614

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-

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Continental Prestige Electronics

USA . 3,923 parts In-Stock

1+ parts

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3,923

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Corphita

USA . 3,804 parts In-Stock

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3,804

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Argo Parts USA

USA . 3,259 parts In-Stock

1+ parts

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3,259

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Parana Technologies

USA . 1,594 parts In-Stock

1+ parts

-

100+ parts

$55.708

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1,594

-

$55.708

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Aranea Global

USA . 500 parts In-Stock

1+ parts

-

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500

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Overview

Unlock endless possibilities with the STM8AF6226TASSSX by STMicroelectronics, a top-tier microcontroller designed for industrial-grade applications. Crafted with precision and reliability in mind, this product offers seamless connectivity through I2C, SPI, and UART interfaces, along with advanced features like on-chip data RAM and EEPROM. With low power modes and a maximum clock frequency of 16 MHz, this microcontroller guarantees optimal performance while keeping energy consumption at bay. Trust STMicroelectronics to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material provides durability and cost-effectiveness to the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, making this product ideal for mass production.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle a wide range of power inputs, increasing its versatility.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing and storage, enhancing the overall performance of the product.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures that the microcontroller meets high automotive quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the PCB and making it suitable for small form factor applications.

Bit Size: 8

The 8-bit architecture allows for fast and efficient data processing, making this microcontroller suitable for a wide range of applications.

No. of Terminals: 32

With 32 terminals, this microcontroller offers a sufficient number of I/O options for interfacing with external components, making it versatile.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style provides a space-saving solution, making it suitable for applications with limited space constraints.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V allows for operation in low power environments, making it energy-efficient.

Technical Specifications

Microcontrollers STM8AF6226TASSSX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of External Interrupts:

28

No. of I/O Lines:

28

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

4.75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

640

Connectivity:

I2C, SPI, UART

Peripherals:

BOR, POR, PWM, TIMER(4), WDT(2)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8AF6226TASSSX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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