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STM8AF52AATDY

STMicroelectronics

STM8AF52AATDY by STMicroelectronics

STM8AF52AATDY by STMicroelectronics is an 8-bit microcontroller with 32768 ROM words, 6144 RAM bytes, and 16-Ch 10-Bit ADC channels. Ideal for automotive applications, it offers a max clock frequency of 24 MHz, connectivity options like CAN and SPI, and features BOD and POR peripherals.

Median Price

$8.870

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 535 parts In-Stock

1+ parts

$8.870

100+ parts

$6.640

1k+ parts

$5.380

10k+ parts

$5.030

535

$8.870

$6.640

$5.380

$5.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,840 parts In-Stock

1+ parts

$8.426

100+ parts

-

1k+ parts

-

10k+ parts

-

2,840

$8.426

-

-

-

Vyrian

USA . 8,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,743

-

-

-

-

Anansix

USA . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

950

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,708 parts In-Stock

1+ parts

$4.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1,708

$4.100

-

-

-

Corphita

USA . 3,939 parts In-Stock

1+ parts

$7.983

100+ parts

-

1k+ parts

-

10k+ parts

-

3,939

$7.983

-

-

-

Microchip USA

USA . 1,657 parts In-Stock

1+ parts

$17.624

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

$17.624

-

-

-

IDEA Electronic Components Group

UK . 2,159 parts In-Stock

1+ parts

$58.618

100+ parts

-

1k+ parts

$52.756

10k+ parts

-

2,159

$58.618

-

$52.756

-

MKK Technologies

India . 1,193 parts In-Stock

1+ parts

$110.227

100+ parts

-

1k+ parts

-

10k+ parts

-

1,193

$110.227

-

-

-

DigiPath Technology Company

USA . 1,193 parts In-Stock

1+ parts

$110.227

100+ parts

-

1k+ parts

-

10k+ parts

-

1,193

$110.227

-

-

-

Parana Technologies

USA . 1,525 parts In-Stock

1+ parts

-

100+ parts

$70.086

1k+ parts

-

10k+ parts

-

1,525

-

$70.086

-

-

Overview

Unleash the power of innovation with the STM8AF52AATDY by STMicroelectronics! This cutting-edge microcontroller offers unparalleled quality and reliability, backed by the trusted manufacturer, STMicroelectronics. Ideal for automotive applications, this versatile device provides a wide range of connectivity options and advanced peripherals. With its high-performance capabilities and low power consumption, the STM8AF52AATDY delivers exceptional value and benefits to customers looking to stay ahead in today's competitive market. Experience the difference with this top-of-the-line microcontroller and elevate your next project to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, providing flexibility in power supply options.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and quality, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB real estate.

Bit Size: 8

8-bit architecture is suitable for applications that do not require high computational power, making this microcontroller cost-effective.

Power Supplies (V): 3.3/5

Supports dual power supply options, providing flexibility in voltage selection.

No. of Terminals: 80

With a high number of terminals, this microcontroller offers a wide range of connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE

Flatpack low profile design helps in space-constrained applications.

Minimum Supply Voltage: 3 V

Supports low voltage operation, ideal for battery-powered applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions.

CPU Family: STM8

The STM8 CPU family is known for its efficiency and performance, making this microcontroller a reliable choice.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme cold conditions, expanding the range of applications this microcontroller can be used in.

Terminal Finish: MATTE TIN

Matte Tin finish provides good solderability and corrosion resistance.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing, enabling a wider range of applications.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and routing.

ROM Words: 32768

With a large ROM size, this microcontroller can store a significant amount of program data.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6 mm saves space on the PCB.

Width: 14 mm

Compact width allows for efficient placement on the PCB.

Data EEPROM Size: 1K

1K EEPROM size provides additional storage for non-volatile data, enhancing the capabilities of the microcontroller.

Peripherals: BOD, POR, TIMER(9)

Built-in peripherals like BOD, POR, and Timer(9) enhance the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing speed, making this microcontroller suitable for real-time applications.

Length: 14 mm

Compact length allows for efficient use of PCB space.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, offering dedicated processing capabilities for embedded systems.

RAM Bytes: 6144

Large RAM size allows for efficient data storage and processing, enhancing the performance of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and rework during assembly.

Analog To Digital Convertors: 16-Ch 10-Bit

16-channel 10-bit ADCs allow for precise analog to digital conversion, enabling accurate sensor interfacing.

Maximum Supply Current: 16.8 mA

Low supply current ensures energy efficiency and extends battery life in portable applications.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage ensures consistent performance across varying load conditions.

PWM Channels: YES

PWM channels enable precise control of analog outputs, making this microcontroller suitable for motor control and power management applications.

Connectivity: CAN, I2C, LIN, SPI, UART, USART

Multiple connectivity options allow for versatile communication interfaces, enabling seamless integration with other devices.

ROM Programmability: FLASH

Flash programmable ROM enables easy and quick firmware updates, enhancing flexibility and ease of maintenance.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65 mm allows for high-density PCB design and miniaturization of the overall system.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this microcontroller has moderate sensitivity to moisture, making it suitable for a wide range of environments.

Speed: 24 rpm

With a maximum clock frequency of 24 MHz, this microcontroller can process data at high speeds, enhancing overall system performance.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width is suitable for handling a wide range of instructions efficiently.

No. of I/O Lines: 68

With 68 I/O lines, this microcontroller offers extensive input/output capabilities, enabling versatile interfacing with external devices.

Technical Specifications

Microcontrollers STM8AF52AATDY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, LIN, SPI, UART, USART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STM8AF52AATDY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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