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STM8AF5268TDY

STMicroelectronics

STM8AF5268TDY by STMicroelectronics

STM8AF5268TDY microcontroller by STMicroelectronics features 24 MHz clock frequency, 10-Ch 10-Bit ADC, and CAN, I2C, LIN connectivity. Ideal for automotive applications due to AEC-Q100 screening level and low power mode support. With a compact package style of flatpack and fine pitch, it offers high performance in a small form factor.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,049 parts In-Stock

1+ parts

-

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6,049

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Anansix

USA . 1,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,295

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-

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Digiode

USA . 567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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567

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 9,190 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

9,190

$2.500

-

-

-

AZTECH Wire

Italy . 1,006 parts In-Stock

1+ parts

$10.650

100+ parts

-

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-

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-

1,006

$10.650

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Microchip USA

USA . 3,652 parts In-Stock

1+ parts

$21.641

100+ parts

-

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3,652

$21.641

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Component Stockers USA

USA . 1,000 parts In-Stock

1+ parts

$45.830

100+ parts

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1,000

$45.830

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IDEA Electronic Components Group

UK . 1,091 parts In-Stock

1+ parts

$52.699

100+ parts

-

1k+ parts

$47.429

10k+ parts

-

1,091

$52.699

-

$47.429

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MKK Technologies

India . 2,270 parts In-Stock

1+ parts

$99.098

100+ parts

-

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2,270

$99.098

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DigiPath Technology Company

USA . 2,270 parts In-Stock

1+ parts

$99.098

100+ parts

-

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2,270

$99.098

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

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6,000

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Corphita

USA . 2,807 parts In-Stock

1+ parts

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2,807

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Parana Technologies

USA . 77 parts In-Stock

1+ parts

-

100+ parts

$63.010

1k+ parts

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10k+ parts

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77

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$63.010

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Overview

Unlock the endless possibilities with the STM8AF5268TDY microcontroller by STMicroelectronics. Crafted with precision and expertise, this innovative device is designed to revolutionize the automotive industry with its cutting-edge technology. With a wide range of connectivity options and low power modes, this microcontroller offers optimal performance and efficiency. Experience seamless operation and enhanced functionality with the STM8AF5268TDY, setting new standards in the realm of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package body ensures portability and protection of the microcontroller.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power input and compatibility with a wide range of applications.

ROM Words: 32768

Large ROM capacity allows for storing a significant amount of program data for complex applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, providing optimal performance and functionality.

Connectivity: CAN, I2C, LIN, SPI, UART, USART

Multiple connectivity options enhance the communication capabilities of the microcontroller, making it suitable for a variety of IoT and embedded systems.

Speed: 24 rpm

Fast operating speed of 24 MHz allows for efficient processing and execution of tasks.

Low Power Mode: YES

Enables energy-efficient operation and prolongs battery life in power-sensitive applications.

On Chip Data RAM Width: 8

Wider data RAM width facilitates faster data processing and manipulation.

ADC Channels: YES

Integrated Analog to Digital Converters enable accurate conversion of analog signals to digital data for sensor interfacing.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, providing optimal performance and functionality.

Technical Specifications

Microcontrollers STM8AF5268TDY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

48

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, LIN, SPI, UART, USART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

STM8AF5268TDY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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