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STM692AM6E

STMicroelectronics

STM692AM6E by STMicroelectronics

STM692AM6E by STMicroelectronics is a compact power management IC with a nominal voltage of 5V, operating b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports industrial applications. Ideal for efficient power supply management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,091 parts In-Stock

1+ parts

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8,091

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LIBRA Elektronik GmbH

Germany . 2,000 parts In-Stock

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2,000

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Digiode

USA . 988 parts In-Stock

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988

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Anansix

USA . 879 parts In-Stock

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879

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 360 parts In-Stock

1+ parts

$12.390

100+ parts

-

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360

$12.390

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Microchip USA

USA . 442 parts In-Stock

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$12.624

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442

$12.624

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IDEA Electronic Components Group

UK . 2,113 parts In-Stock

1+ parts

$20.997

100+ parts

-

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$18.897

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2,113

$20.997

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$18.897

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MKK Technologies

India . 1,404 parts In-Stock

1+ parts

$39.484

100+ parts

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1,404

$39.484

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DigiPath Technology Company

USA . 1,404 parts In-Stock

1+ parts

$39.484

100+ parts

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1,404

$39.484

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A-Z Elektronik GmbH

Germany . 4,610 parts In-Stock

1+ parts

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4,610

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Vigor

Singapore . 2,298 parts In-Stock

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2,298

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Corphita

USA . 1,612 parts In-Stock

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1,612

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Kepictronics

USA . 875 parts In-Stock

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875

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Parana Technologies

USA . 591 parts In-Stock

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$25.105

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591

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$25.105

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Overview

Unlock the potential of your designs with the STM692AM6E from STMicroelectronics, a leader in power management solutions. This robust IC promises exceptional performance in diverse applications, ensuring reliable operation from -40 °C to 85 °C. With its compact size and surface mount capability, it seamlessly fits into any project. Trust STMicroelectronics for quality and innovation, transforming challenges into opportunities while maximizing efficiency and longevity in your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against moisture and other environmental factors, making the IC suitable for various applications.

Surface Mount: YES

Surface mounting allows for more compact designs, enhancing overall board space utilization and enabling high-density circuit layouts.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout efficiency and contributes to better thermal performance compared to other shapes.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with common digital circuits and power supply designs.

Power Supplies (V): 5

Supports a stable and widely used power supply voltage, which simplifies integration into standard electronic systems.

No. of Terminals: 8

An 8-terminal configuration balances complexity and functionality, making it versatile for a range of applications without excessive pin counts.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and is ideal for compact electronic designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for a wide range of applications, including those in warmer environments.

Minimum Operating Temperature: -40 °C

This low minimum operating temperature makes the IC suitable for industrial and outdoor environments where temperature fluctuations occur.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability in electrical connections.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB layout designs, accommodating various mounting orientations.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to low-profile designs, suitable for space-constrained applications.

Width: 3.9 mm

A compact width of 3.9 mm supports high-density packaging, enhancing space efficiency on the PCB.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC is optimized for efficient power distribution, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 1 V

The ability to operate at a minimum supply voltage of 1V allows for versatility in low-power applications.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum time of 40 seconds at peak reflow temperature ensures reliable solder joint formation during manufacturing.

Peak Reflow Temperature: 260 °C

Supports high-temperature reflow processes, which are crucial in modern surface-mount technology assembly.

Length: 4.9 mm

The length of 4.9 mm, combined with its width and height, makes this IC suitable for compact designs where space is a premium.

Nominal Threshold Voltage: +4.4V

A nominal threshold voltage of +4.4V ensures reliable operation in circuits requiring precise voltage levels.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this IC is built to withstand harsher operating conditions.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current of 0.06 mA contributes to energy efficiency and is ideal for battery-powered applications.

Terminal Form: GULL WING

The gull wing terminal form enhances solder joint accessibility and improves automatic soldering accuracy.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between space-saving and ease of manufacturing, allowing for precision soldering.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the IC accommodates a variety of power sources while protecting against over-voltage scenarios.

Technical Specifications

Power Management ICs STM692AM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.4V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM692AM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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