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STM690SM6E

STMicroelectronics

STM690SM6E by STMicroelectronics

STM690SM6E by STMicroelectronics is a compact power management IC designed for industrial applications, operating b/w -40 °C to 85 °C. It supports supply voltages from 1.1V to 5.5V and features an ultra-low max supply current of 0.06mA. Its small outline package ensures efficient surface mounting in space-constrained designs.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 590 parts In-Stock

1+ parts

-

100+ parts

$1.050

1k+ parts

$1.000

10k+ parts

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590

-

$1.050

$1.000

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Distributors (In-Stock)

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Digiode

USA . 1,657 parts In-Stock

1+ parts

$1.083

100+ parts

-

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1,657

$1.083

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Vyrian

USA . 7,021 parts In-Stock

1+ parts

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7,021

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Anansix

USA . 1,710 parts In-Stock

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1,710

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R&J Components

USA . 995 parts In-Stock

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995

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Distributors (Availability)

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Corphita

USA . 2,335 parts In-Stock

1+ parts

$1.026

100+ parts

-

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-

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2,335

$1.026

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Component Stockers USA

USA . 810 parts In-Stock

1+ parts

$1.120

100+ parts

$1.100

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-

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810

$1.120

$1.100

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Microchip USA

USA . 235 parts In-Stock

1+ parts

$3.629

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235

$3.629

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IDEA Electronic Components Group

UK . 566 parts In-Stock

1+ parts

$17.605

100+ parts

-

1k+ parts

$15.845

10k+ parts

-

566

$17.605

-

$15.845

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AZTECH Wire

Italy . 939 parts In-Stock

1+ parts

$21.860

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939

$21.860

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MKK Technologies

India . 2,150 parts In-Stock

1+ parts

$33.105

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2,150

$33.105

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DigiPath Technology Company

USA . 2,150 parts In-Stock

1+ parts

$33.105

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2,150

$33.105

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Vigor

Singapore . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 5,600 parts In-Stock

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5,600

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Parana Technologies

USA . 2,358 parts In-Stock

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$21.050

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2,358

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$21.050

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Overview

Elevate your power management solutions with the STM690SM6E from STMicroelectronics, a leader in innovation and reliability. This compact IC boasts exceptional temperature resilience and efficiency, making it ideal for industrial applications and beyond. With its robust design and versatile voltage range, it ensures optimal performance and longevity in your devices. Trust in STMicroelectronics for quality you can rely on, enhancing your projects with cutting-edge technology and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and protects the internal components from environmental factors, making this IC suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact device design and easy integration into automated assembly processes, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape aids in optimized layout for printed circuit boards (PCBs), allowing for better space utilization and improved thermal management.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V makes this IC compatible with many common power sources and operational with various digital logic levels.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, providing flexibility for different application requirements and making it versatile across various platforms.

No. of Terminals: 8

With 8 terminals, the IC allows for sufficient connectivity while maintaining simplicity, which is ideal for low-complexity designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a reduced footprint on PCBs, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can operate at maximum temperatures of 85 °C, making it suitable for industrial applications that may expose it to elevated temperatures.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability in extreme environments, suitable for automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for balanced electrical performance and easy routing on PCBs, enhancing design flexibility.

Maximum Seated Height: 1.75 mm

A low seated height facilitates low-profile designs, ideal for applications where space is at a premium.

Width: 3.9 mm

The compact width allows for close spacing on the PCB, optimizing layout density without compromising performance.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power supply management, ensuring efficiency and performance in energy-sensitive applications.

Minimum Supply Voltage (Vsup): 1.1 V

Operating at a low minimum supply voltage of 1.1 V makes it suitable for battery-powered and ultra-low power applications.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum time of 40 seconds at peak reflow temperatures ensures the IC can withstand typical soldering processes without damage.

Peak Reflow Temperature: 260 °C

The IC's capability to withstand peak reflow temperatures up to 260 °C allows for compatibility with modern surface mount assembly processes.

Length: 4.9 mm

With a length of 4.9 mm, the compact design enhances PCB layout flexibility while fitting within industry standard sizes.

Nominal Threshold Voltage (V): +2.925V

The specific nominal threshold voltage provides accurate voltage regulation, ensuring improved stability and performance of connected devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability and performance across a wide operating temperature range, crucial for industrial applications.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of only 0.06 mA makes this IC ideally suited for energy-efficient designs and battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and provide better mechanical stability on the PCB, ensuring reliable electrical connections.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, the IC provides a balance between ease of hand soldering and compatibility with automated assembly.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle a maximum supply voltage of 5.5 V ensures that it can support a wide range of applications without concerns of damage.

Technical Specifications

Power Management ICs STM690SM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.925V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM690SM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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