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STM6821LWY6F

STMicroelectronics

STM6821LWY6F by STMicroelectronics

STM6821LWY6F by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a voltage range of 1.2V to 5.5V, with a nominal threshold of +4.63V and supports temperatures from -40 °C to 85 °C. Its small outline package ensures efficient surface mounting in space-constrained designs.

Median Price

$0.485

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 522 parts In-Stock

1+ parts

$0.423

100+ parts

-

1k+ parts

-

10k+ parts

-

522

$0.423

-

-

-

Chip1Stop

Japan . 522 parts In-Stock

1+ parts

$0.655

100+ parts

-

1k+ parts

-

10k+ parts

-

522

$0.655

-

-

-

DigiKey

USA . 9 parts In-Stock

1+ parts

$1.230

100+ parts

$0.711

1k+ parts

$0.618

10k+ parts

$0.571

9

$1.230

$0.711

$0.618

$0.571

Avnet

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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9,000

-

-

-

-

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.485

3,000

-

-

-

$0.485

Verical

USA . 522 parts In-Stock

1+ parts

-

100+ parts

$0.423

1k+ parts

-

10k+ parts

-

522

-

$0.423

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,095 parts In-Stock

1+ parts

$0.385

100+ parts

-

1k+ parts

-

10k+ parts

-

1,095

$0.385

-

-

-

Vyrian

USA . 6,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,182

-

-

-

-

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.702

3,000

-

-

-

$0.702

Anansix

USA . 359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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359

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 837 parts In-Stock

1+ parts

$0.344

100+ parts

-

1k+ parts

-

10k+ parts

-

837

$0.344

-

-

-

Corphita

USA . 430 parts In-Stock

1+ parts

$0.364

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$0.364

-

-

-

Continental Prestige Electronics

USA . 2,840 parts In-Stock

1+ parts

$1.010

100+ parts

$0.731

1k+ parts

$0.605

10k+ parts

$0.535

2,840

$1.010

$0.731

$0.605

$0.535

Vigor

Singapore . 2,981 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,981

$1.400

-

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Microchip USA

USA . 4,234 parts In-Stock

1+ parts

$5.936

100+ parts

-

1k+ parts

-

10k+ parts

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4,234

$5.936

-

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IDEA Electronic Components Group

UK . 2,135 parts In-Stock

1+ parts

$8.210

100+ parts

-

1k+ parts

$7.389

10k+ parts

-

2,135

$8.210

-

$7.389

-

MKK Technologies

India . 511 parts In-Stock

1+ parts

$15.439

100+ parts

-

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-

10k+ parts

-

511

$15.439

-

-

-

DigiPath Technology Company

USA . 511 parts In-Stock

1+ parts

$15.439

100+ parts

-

1k+ parts

-

10k+ parts

-

511

$15.439

-

-

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Assy Fe

Spain . 30,000 parts In-Stock

1+ parts

-

100+ parts

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30,000

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-

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A-Z Elektronik GmbH

Germany . 6,224 parts In-Stock

1+ parts

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6,224

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Perfect Parts

USA . 5,443 parts In-Stock

1+ parts

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5,443

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-

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

-

-

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Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.390

10k+ parts

-

3,000

-

-

$0.390

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GreenTree Electronics

Israel . 2,430 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,430

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-

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Parana Technologies

USA . 2,036 parts In-Stock

1+ parts

-

100+ parts

$9.816

1k+ parts

-

10k+ parts

-

2,036

-

$9.816

-

-

Overview

Elevate your designs with the STM6821LWY6F from STMicroelectronics, a leader in power management solutions. This compact IC ensures reliable operation across diverse applications, from automotive to industrial automation. With its robust temperature range and low power consumption, it enhances efficiency while maximizing system performance. Trust in STMicroelectronics’ proven expertise to deliver innovative, high-quality products that empower your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures that the Power Management IC can withstand varying environmental conditions, making it reliable for industrial applications.

Surface Mount: YES

The surface-mount design allows for efficient use of space on PCBs, facilitating easier and faster assembly.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout possibilities on circuit boards, enhancing design flexibility.

Power Supplies (V): 1/5.5

This wide operating voltage range supports various applications, providing versatility in power management solutions.

No. of Terminals: 5

With 5 terminals, this IC can offer multiple functionalities in a compact form, making it suitable for complex designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile design saves space and reduces the overall height of the device, ideal for compact applications.

Maximum Operating Temperature: 85 °C

This high maximum temperature rating ensures reliable operation under demanding conditions, which is crucial for industrial settings.

Minimum Operating Temperature: -40 °C

This low minimum temperature rating means the IC can function in extreme cold, broadening its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality finish enhances solderability and improves the long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for better routing options in PCB design, improving overall layout effectiveness.

Maximum Seated Height: 1.45 mm

A low seated height contributes to a more compact design, essential for space-constrained applications.

Width (mm): 1.6 mm

A slender width facilitates easy integration into tightly designed circuit boards.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This IC is specifically designed for power supply management, optimizing energy delivery and stability in applications.

Minimum Supply Voltage (Vsup): 1.2 V

The low minimum supply voltage allows for compatibility with a broad range of low-power devices.

Maximum Time At Peak Reflow Temperature (s): 30

This specification helps ensure that the IC can withstand common soldering processes without damage.

Peak Reflow Temperature °C: 260

This high peak reflow temperature aligns with standard lead-free soldering processes, enhancing manufacturability.

Length: 2.9 mm

Short length contributes to a compact footprint, making it suitable for small electronic devices.

Nominal Threshold Voltage (V): +4.63V

A precise threshold voltage enhances the accuracy of power management, ensuring consistent device performance.

Temperature Grade: INDUSTRIAL

Grade suitable for industrial use guarantees long-term reliability in harsh environments.

Maximum Supply Current (Isup): 0.017 mA

Extremely low supply current reflects energy efficiency, vital for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals provide optimal soldering characteristics and ease of handling during assembly.

Terminal Pitch: 0.95 mm

An optimal terminal pitch facilitates easier soldering and improves layout flexibility on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V enables compatibility with a wide array of devices, enhancing application versatility.

Technical Specifications

Power Management ICs STM6821LWY6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.63V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.017 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.63V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

STM6821LWY6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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