Loading...

STM6780LWB6F

STMicroelectronics

STM6780LWB6F by STMicroelectronics

STM6780LWB6F from STMicroelectronics is a versatile power management IC with a nominal voltage of 3.3V, adjustable threshold up to +4.625V, and operates in extreme temperatures from -40 °C to 85°C. Its compact design features a low-profile package suitable for space-constrained applications. Ideal for industrial power supply support circuits, it ensures reliable performance with minimal current draw of just 35µA.

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.515

3,000

-

-

-

$0.515

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 10,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,100

-

-

-

-

Vyrian

USA . 8,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,031

-

-

-

-

Bristol Electronics

USA . 4,995 parts In-Stock

1+ parts

-

100+ parts

$0.713

1k+ parts

$0.494

10k+ parts

-

4,995

-

$0.713

$0.494

-

Dan-Mar Components

USA . 4,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,995

-

-

-

-

Digiode

USA . 3,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,154

-

-

-

-

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.722

3,000

-

-

-

$0.722

Anansix

USA . 1,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,036

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,914 parts In-Stock

1+ parts

$0.476

100+ parts

-

1k+ parts

-

10k+ parts

-

2,914

$0.476

-

-

-

Vigor

Singapore . 4,943 parts In-Stock

1+ parts

$0.540

100+ parts

-

1k+ parts

-

10k+ parts

-

4,943

$0.540

-

-

-

Microchip USA

USA . 5,483 parts In-Stock

1+ parts

$5.349

100+ parts

-

1k+ parts

-

10k+ parts

-

5,483

$5.349

-

-

-

AZTECH Wire

Italy . 315 parts In-Stock

1+ parts

$8.440

100+ parts

-

1k+ parts

-

10k+ parts

-

315

$8.440

-

-

-

IDEA Electronic Components Group

UK . 1,245 parts In-Stock

1+ parts

$13.330

100+ parts

-

1k+ parts

$11.997

10k+ parts

-

1,245

$13.330

-

$11.997

-

MKK Technologies

India . 1,709 parts In-Stock

1+ parts

$25.066

100+ parts

-

1k+ parts

-

10k+ parts

-

1,709

$25.066

-

-

-

DigiPath Technology Company

USA . 1,709 parts In-Stock

1+ parts

$25.066

100+ parts

-

1k+ parts

-

10k+ parts

-

1,709

$25.066

-

-

-

Corphita

USA . 4,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,688

-

-

-

-

Perfect Parts

USA . 3,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,447

-

-

-

-

Parana Technologies

USA . 1,529 parts In-Stock

1+ parts

-

100+ parts

$15.938

1k+ parts

-

10k+ parts

-

1,529

-

$15.938

-

-

Overview

Elevate your designs with the STM6780LWB6F from STMicroelectronics—your trusted partner in power management innovation. This compact, high-performance IC boasts superior reliability and efficiency, perfect for industrial applications that demand precision. Its low-profile design and robust temperature range ensure optimal performance even in challenging environments. Experience seamless integration and enhanced functionality, while benefiting from STMicroelectronics’ renowned quality and support. Empower your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental stress, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller designs and easier integration into modern circuit boards, enhancing overall efficiency in assembly.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCB layouts, allowing for more compact circuit designs.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3 V is standard for many digital devices, ensuring wide compatibility in electronic designs.

Power Supplies (V): 0.8/5.5

The ability to support a wide voltage range (0.8V to 5.5V) makes this IC versatile for multiple applications across different power supply systems.

No. of Terminals: 6

With 6 terminals, it offers sufficient connectivity options while maintaining a compact footprint, perfect for space-constrained applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design are ideal for applications where space is a premium, enabling slim profile devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in various environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C provides flexibility in harsh operating environments, making it suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish enhances corrosion resistance and improves solderability, ensuring reliable long-term connections.

Terminal Position: DUAL

The dual terminal position facilitates easier layout designs, which is beneficial for engineers during circuit design and prototyping.

Maximum Seated Height: 1.45 mm

A maximum seated height of 1.45 mm allows this IC to fit in low-profile designs, perfect for slim electronic devices.

Width: 1.6 mm

At a width of 1.6 mm, it provides a compact solution for power management in tight circuit layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is crucial for stabilizing voltage and ensuring efficient power distribution in electronic devices.

Minimum Supply Voltage (Vsup): 0.8 V

Supporting a minimum supply voltage of 0.8 V enables compatibility with low-power devices, catering to modern energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow temperature of 30 seconds optimizes manufacturing processes by minimizing thermal exposure during soldering.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C supports the use of lead-free solder, aligning with environmental standards and regulations.

Length: 2.9 mm

With a length of 2.9 mm, this IC can be easily integrated into compact circuits without taking up excessive board space.

Nominal Threshold Voltage (V): +4.625V

The nominal threshold voltage of +4.625V makes it ideal for applications requiring specific voltage control and management.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in demanding environments, suitable for various industrial applications.

Maximum Supply Current (Isup): 0.035 mA

A maximum supply current of 0.035 mA allows for efficient power usage, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals provide effective surface mounting capabilities that facilitate better solder alignment and connection quality.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm optimizes board space while maintaining ease of soldering, ideal for high-density designs.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5 V, it allows for greater versatility in design for various electronic applications.

Adjustable Threshold: YES

The adjustable threshold feature offers flexibility in voltage settings, making it adaptable for different application requirements.

Technical Specifications

Power Management ICs STM6780LWB6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.625V; MANUAL RESET INPUT

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.035 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.625V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

STM6780LWB6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20