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STM6717SJWY6F

STMicroelectronics

STM6717SJWY6F by STMicroelectronics

STM6717SJWY6F from STMicroelectronics is a versatile power management IC with a nominal voltage of 3.3V, adjustable thresholds, and operates in extreme temperatures from -40 °C to 85°C. Its compact design features a low-profile package with 5 terminals. Ideal for industrial applications requiring reliable power supply support.

Median Price

$0.382

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 17 parts In-Stock

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$0.449

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17

$0.449

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Chip1Stop

Japan . 421 parts In-Stock

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Verical

USA . 417 parts In-Stock

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$0.316

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417

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$0.316

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Distributors (In-Stock)

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Digiode

USA . 4,277 parts In-Stock

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$0.300

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Vyrian

USA . 3,876 parts In-Stock

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3,876

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Netsource Technology, Inc.

USA . 1,725 parts In-Stock

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Anansix

USA . 1,188 parts In-Stock

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Corphita

USA . 2,291 parts In-Stock

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$0.284

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$0.284

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Vigor

Singapore . 98 parts In-Stock

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$0.950

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98

$0.950

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Microchip USA

USA . 4,523 parts In-Stock

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$5.349

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IDEA Electronic Components Group

UK . 1,408 parts In-Stock

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$14.001

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$12.601

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$12.601

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AZTECH Wire

Italy . 792 parts In-Stock

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$16.670

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MKK Technologies

India . 432 parts In-Stock

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$26.329

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DigiPath Technology Company

USA . 432 parts In-Stock

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$26.329

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QUARKTWIN TECHNOLOGY LTD

USA . 5,121 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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2,700

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Parana Technologies

USA . 1,965 parts In-Stock

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$16.741

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$16.741

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Overview

Elevate your designs with the STM6717SJWY6F from STMicroelectronics, a leader in innovative power management solutions. This compact IC delivers exceptional reliability and versatility, making it ideal for industrial applications where precision is key. With a robust temperature range and low power consumption, it ensures efficient performance while maximizing battery life. Trust STMicroelectronics for quality that powers your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and effective protection against environmental factors, making the IC robust for various applications.

Surface Mount: YES

Being a surface mount device allows for easy integration into compact circuit designs, optimizing space and improving manufacturability.

Package Shape: RECTANGULAR

The rectangular package shape enhances PCB layout flexibility and supports easier routing of traces in the design.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3 V is commonly used in many digital circuits, ensuring compatibility with standard logic levels.

Power Supplies (V): 0.8/5.5

The device supports a wide range of supply voltage, making it versatile for various power management applications.

No. of Terminals: 5

With five terminals, the IC allows for a simple yet effective interface for connectivity in compact devices.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile design with a shrink pitch saves valuable PCB space and is ideal for modern compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables reliable performance in a variety of environments, including industrial applications.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures that the IC can operate under harsh conditions, catering to extreme industrial environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Using nickel palladium gold for terminal finish provides excellent corrosion resistance and improved solderability for reliable electrical connections.

Terminal Position: DUAL

The dual terminal position offers flexible design options and simplifies board layout, making it easier to route connections.

Maximum Seated Height: 1.45 mm

A low seated height allows for even more compact designs, fitting into applications with tight height restrictions.

Width (mm): 1.6 mm

The compact width is ideal for space-constrained designs while still maintaining a reliable performance in power management.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Positioned as a power supply support circuit, this IC can provide essential power management functionalities in various applications.

Minimum Supply Voltage (Vsup): 0.8 V

The capability to operate at minimum supply voltage of 0.8 V allows it to be used in low-power applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The tolerance for up to 30 seconds at peak reflow temperature ensures compatibility with various PCB assembly processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates the IC can withstand standard soldering processes without damage.

Length: 2.9 mm

A small length dimension contributes to the overall compactness of the design, ideal for use in high-density applications.

Nominal Threshold Voltage (V): +2.925,0.875V

The adjustable nominal threshold voltages allow for precise control and adaptability in various power management needs.

Temperature Grade: INDUSTRIAL

As an industrial-grade component, this IC is designed for reliability and performance in demanding environments.

Maximum Supply Current (Isup): 0.035 mA

A low maximum supply current ensures minimal power consumption, making it suitable for battery-operated and energy-efficient devices.

Terminal Form: GULL WING

The gull-wing terminal form provides ease of handling during assembly and improves solder joint reliability.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for more compact board designs, facilitating denser packing of components on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle a maximum supply voltage of 5.5 V enhances compatibility with a range of applications from low to higher voltage systems.

Adjustable Threshold: YES

Being adjustable allows users to customize the performance of the IC based on specific application requirements, enhancing its versatility.

Technical Specifications

Power Management ICs STM6717SJWY6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGES ARE 2.925V AND 0.875V; MANUAL RESET INPUT

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.035 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925,0.875V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

STM6717SJWY6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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