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STM6315SGW13F

STMicroelectronics

STM6315SGW13F by STMicroelectronics

STM6315SGW13F from STMicroelectronics is a compact power management IC designed for automotive applications. It operates within a supply voltage range of 1V to 5.5V, with a nominal threshold of +2.93V and supports temperatures from -40 °C to 125 °C. Its small outline package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,032 parts In-Stock

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4,032

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Digiode

USA . 3,233 parts In-Stock

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3,233

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Anansix

USA . 1,333 parts In-Stock

1+ parts

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1,333

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 5,412 parts In-Stock

1+ parts

$4.854

100+ parts

-

1k+ parts

-

10k+ parts

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5,412

$4.854

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AZTECH Wire

Italy . 193 parts In-Stock

1+ parts

$8.720

100+ parts

-

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193

$8.720

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IDEA Electronic Components Group

UK . 98 parts In-Stock

1+ parts

$21.347

100+ parts

-

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$19.212

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98

$21.347

-

$19.212

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MKK Technologies

India . 283 parts In-Stock

1+ parts

$40.141

100+ parts

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283

$40.141

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DigiPath Technology Company

USA . 283 parts In-Stock

1+ parts

$40.141

100+ parts

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283

$40.141

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Metaverse IC Inc.

Canada . 14,970 parts In-Stock

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14,970

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Corphita

USA . 2,831 parts In-Stock

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2,831

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Parana Technologies

USA . 609 parts In-Stock

1+ parts

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$25.523

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609

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$25.523

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Overview

Unlock the potential of your designs with the STM6315SGW13F from STMicroelectronics, a leader in power management solutions. Crafted for reliability and efficiency, this compact IC ensures optimal performance across automotive applications, thriving in extreme temperatures. With its robust build and low supply current, it enhances device longevity while minimizing energy costs. Choose STM6315SGW13F for unmatched quality and innovation that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides enhanced resistance to moisture and environmental stress, making the IC reliable in diverse applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs and automated assembly processes, reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for efficient layout and routing of other components.

Nominal Supply Voltage (Vsup): 3.6 V

With a nominal supply voltage suited for a range of applications, this IC is versatile for various power management scenarios.

Power Supplies (V): 1/5.5

The wide range of power supplies allows for compatibility with multiple systems while maintaining performance across different voltages.

No. of Terminals: 4

The 4-terminal design facilitates simple integration into circuits while ensuring minimum space usage on the PCB.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline, thin profile package is ideal for space-constrained applications, supporting modern, compact electronic designs.

Maximum Operating Temperature: 125 °C

This high operating temperature rating ensures reliability and performance in demanding environments, particularly in automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this IC suitable for extreme conditions, enhancing its applicability in automotive and industrial sectors.

Terminal Finish: MATTE TIN

The matte tin finish provides better solderability and corrosion resistance, ensuring reliability and longevity in electronic connections.

Terminal Position: DUAL

The dual terminal position enhances layout flexibility, allowing for optimal placement on the PCB for efficient routing.

Maximum Seated Height: 1.12 mm

A low seated height increases design flexibility by allowing for slim profile applications, particularly in portable devices.

Width (mm): 1.3 mm

Its narrow width is ideal for high-density circuit designs, enabling manufacturers to maximize PCB space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Serving as a power supply support circuit, it enhances power efficiency in various devices, making it essential for optimal performance.

Minimum Supply Voltage (Vsup): 1 V

The low minimum supply voltage expands compatibility with low-power applications, promoting versatility in design.

Length: 2.92 mm

Compact length allows easy integration into space-critical applications, facilitating design in smaller form factors.

Nominal Threshold Voltage (V): +2.93V

The precise threshold voltage ensures reliable operation within specified limits, crucial for sensitive electronic applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade provides assurance of reliability and performance in harsh automotive environments, meeting stringent industry standards.

Maximum Supply Current (Isup): 0.015 mA

The low maximum supply current enhances power efficiency, making the IC suitable for battery-operated and energy-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form is favored for surface mount applications as it simplifies soldering and improves mechanical strength.

Terminal Pitch: 1.92 mm

A terminal pitch of 1.92 mm enables compatibility with various PCB designs, facilitating diverse and flexible applications.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage allows for application in higher voltage environments, providing robustness in power management scenarios.

Technical Specifications

Power Management ICs STM6315SGW13F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-253

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.015 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.92 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Width (mm):

1.3 mm

Trade Compliance

STM6315SGW13F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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