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STM32L562VET6TR

STMicroelectronics

STM32L562VET6TR by STMicroelectronics

STM32L562VET6TR by STMicroelectronics is a low-power 32-bit microcontroller featuring a Cortex-M33 CPU, with a max clock frequency of 48 MHz. It supports up to 16 ADC channels and includes integrated DACs for versatile applications. Ideal for industrial use, it operates b/w -40 °C to 85 °C.

Median Price

$6.117

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip1Stop

Japan . 2,000 parts In-Stock

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$6.510

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Arrow

USA . 1,000 parts In-Stock

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$6.117

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Verical

USA . 1,000 parts In-Stock

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$6.117

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Vyrian

USA . 4,522 parts In-Stock

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Anansix

USA . 2,421 parts In-Stock

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Digiode

USA . 1,999 parts In-Stock

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AZTECH Wire

Italy . 1,115 parts In-Stock

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$10.100

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$10.100

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IDEA Electronic Components Group

UK . 301 parts In-Stock

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$46.736

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$42.062

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301

$46.736

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$42.062

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MKK Technologies

India . 1,402 parts In-Stock

1+ parts

$87.884

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$87.884

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DigiPath Technology Company

USA . 1,402 parts In-Stock

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$87.884

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$87.884

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Lixinc

USA . 15,753 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 3,070 parts In-Stock

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3,070

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Parana Technologies

USA . 1,906 parts In-Stock

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$55.880

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$55.880

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Glotronic Ltd.

UK . 1,600 parts In-Stock

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1,600

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Overview

Unlock limitless possibilities with the STM32L562VET6TR from STMicroelectronics—a leading name in microcontroller innovation. This versatile, low-power 32-bit MCU is engineered for a wide array of applications, from industrial automation to wearable tech, offering exceptional performance and reliability. Experience seamless connectivity, advanced analog functionality, and robust processing power that elevate your designs while ensuring energy efficiency. Choose STM32L562VET6TR for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and helps protect against environmental factors, making it suitable for industrial applications.

Integrated Cache: YES

Integrated cache enhances processing speed and performance, allowing for more efficient execution of applications and reducing latency.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating easier integration into smaller devices and saving space on PCBs.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage enables compatibility with a wide range of power management systems, making it flexible for various power applications.

On Chip Data RAM Width: 8

With 8-bit RAM width, data handling can be efficient for applications that do not require wide data paths, optimizing performance and resource utilization.

Package Shape: SQUARE

The square package shape aids in space-efficient layouts and more straightforward heat dissipation, making it ideal for complex designs.

Bit Size: 32

A 32-bit architecture allows for efficient processing of integer and floating-point operations, providing powerful computational capabilities.

DAC Channels: YES

Having DAC channels facilitates analog output, which is crucial for various applications such as signal generation and audio processing.

No. of Terminals: 100

A higher number of terminals allows for extensive connectivity options, accommodating complex peripheral interfacing needs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile design is ideal for space-constrained applications while ensuring robust connectivity and reliability.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage makes the microcontroller power-efficient, ideal for battery-operated devices and low-power applications.

Maximum Operating Temperature: 85 °C

This temperature tolerance allows the microcontroller to operate reliably in harsh conditions, enhancing its applicability in industrial environments.

CPU Family: CORTEX-M33

The Cortex-M33 family offers advanced performance and energy efficiency, making it suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

An extended temperature range allows for deployment in extreme conditions, ensuring reliability in various operational environments.

ADC Channels: YES

With integrated ADC channels, the microcontroller can handle multiple analog input signals, making it versatile for sensor applications.

DMA Channels: YES

The availability of DMA channels ensures efficient data transfer between peripherals without CPU intervention, enhancing system performance.

Terminal Position: QUAD

Quad terminal positioning promotes better signal integrity and mechanical stability, ideal for high-density designs.

ROM Words: 524288

A substantial ROM capacity allows for extensive program storage, supporting complex applications with rich feature sets.

Maximum Seated Height: 1.6 mm

Low seated height reduces PCB height profiles, offering design flexibility for compact devices while maintaining performance.

Digital To Analog Converters: 2-Ch 12-Bit

Equipped with 2-channel 12-bit DACs, this microcontroller ensures accurate analog signal generation, crucial for high-fidelity outputs.

RAM Words: 262144

The large amount of RAM provides sufficient memory for complex applications, enabling smooth multitasking and efficient processing.

Width: 14 mm

A compact width allows for integration into smaller devices, making this microcontroller suitable for portable applications.

Boundary Scan: YES

Boundary scan capability simplifies debugging and testing processes, ensuring quick fault detection and improving product reliability.

Peripherals: BOR, COMPARATOR(2), RTC, TIMER(14), WDT(2)

The extensive peripheral features enhance the microcontroller's functionality, making it suitable for a wide range of applications.

Maximum Clock Frequency: 48 MHz

A clock frequency of 48 MHz ensures responsive performance suitable for real-time applications, allowing quick processing of tasks.

Length: 14 mm

The length complements the width for a compact footprint, making it ideal for designs where space-saving is crucial.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees reliability and performance in demanding environments, suitable for robust applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller enhances operation efficiency and speed, making it optimal for high-performance tasks.

No. of Timers: 14

With 14 timers, the microcontroller can manage multiple timing and scheduling tasks effortlessly, beneficial for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the microcontroller's efficiency in battery-operated systems.

Terminal Form: GULL WING

Gull wing terminals enable easy handling and soldering, which simplifies manufacturing processes for high-volume production.

Analog To Digital Converters: 16-Ch 12-Bit

The presence of 16-channel 12-bit ADCs enables the microcontroller to interface with multiple sensors, making it ideal for data acquisition applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V makes this microcontroller suitable for standard low-power operations, enhancing its versatility for various applications.

No. of DMA Channels: 14

Having 14 DMA channels maximizes data transfer efficiency among peripherals, reducing CPU load and improving overall system performance.

No. of Serial I/Os: 15

A high number of serial I/Os allows extensive connectivity options, facilitating communication with multiple devices and enhancing system integration.

PWM Channels: YES

PWM channels support a variety of applications including motor control and signal modulation, providing enhanced control over analog outputs.

Connectivity: I2C(4), LPUART, SAI(2), SPI(3), UART(2), USART(3)

Diverse connectivity options ensure ease of integration with various peripherals, enhancing the versatility of the microcontroller for different use cases.

ROM Programmability: FLASH

Flash programmability allows for firmware updates and modifications, providing flexibility to upgrade functionality without hardware changes.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density mounting on PCBs, optimizing space utilization in sophisticated project designs.

Format: FLOATING POINT

Floating point format capabilities allow for complex mathematical calculations to be performed efficiently, expanding applications in digital signal processing.

Speed: 110 rpm

Operational speed of 110 rpm indicates efficiency in executing tasks, essential for time-sensitive applications.

Low Power Mode: YES

The availability of a low power mode extends battery life in portable applications, making it ideal for IoT devices.

On Chip Program ROM Width: 8

With an 8-bit ROM width, the microcontroller can efficiently manage smaller programs and applications, keeping resource usage optimal.

No. of I/O Lines: 83

A significant number of I/O lines enhances the versatility of interfacing with numerous sensors, actuators, and communication devices.

Technical Specifications

Microcontrollers STM32L562VET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of I/O Lines:

83

No. of Serial I/Os:

15

No. of Terminals:

100

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

262144

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

110 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C(4), LPUART, SAI(2), SPI(3), UART(2), USART(3)

Peripherals:

BOR, COMPARATOR(2), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L562VET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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