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STM32L4R5ZGY6TR

STMicroelectronics

STM32L4R5ZGY6TR by STMicroelectronics

STM32L4R5ZGY6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 48 MHz clock speed. With 144 terminals and multiple ADC/PWM channels, it's ideal for low-power applications in IoT devices. Its compact design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,736 parts In-Stock

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9,736

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Digiode

USA . 2,004 parts In-Stock

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2,004

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Anansix

USA . 1,590 parts In-Stock

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1,590

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Distributors (Availability)

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Vigor

Singapore . 2,390 parts In-Stock

1+ parts

$9.040

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2,390

$9.040

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AZTECH Wire

Italy . 530 parts In-Stock

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$15.810

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530

$15.810

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Microchip USA

USA . 7,549 parts In-Stock

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$30.316

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7,549

$30.316

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

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$66.838

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$60.154

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1,703

$66.838

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$60.154

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MKK Technologies

India . 1,265 parts In-Stock

1+ parts

$125.684

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1,265

$125.684

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DigiPath Technology Company

USA . 1,265 parts In-Stock

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$125.684

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1,265

$125.684

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Corphita

USA . 2,117 parts In-Stock

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2,117

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Parana Technologies

USA . 1,859 parts In-Stock

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$79.915

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1,859

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$79.915

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Overview

Unlock the potential of your next innovation with the STM32L4R5ZGY6TR microcontroller from STMicroelectronics. Renowned for exceptional quality and reliability, this versatile 32-bit MCU excels in low-power applications, making it perfect for wearables, IoT devices, and smart home solutions. Experience unmatched performance and efficiency, empowering your designs with advanced features like ADC and PWM capabilities, all while enjoying the peace of mind that comes from partnering with a trusted industry leader.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs and efficient use of PCB space, making this microcontroller ideal for modern electronic applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is suitable for low-voltage applications, enhancing energy efficiency.

Address Bus Width: 26

A wide address bus width enables access to larger memory spaces, enhancing the microcontroller's capability to handle complex applications.

Package Shape: SQUARE

The square package shape contributes to uniformity in design, allowing for easier integration into various layouts and thermal management.

Bit Size: 32

The 32-bit architecture allows for better performance in processing and handling complex calculations compared to 8 or 16-bit alternatives.

No. of Terminals: 144

Having 144 terminals affords significant connectivity options, allowing for integration with a wide variety of peripherals and interfaces.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style supports high-density layouts and is suitable for applications requiring a compact footprint and advanced interconnect technology.

Minimum Supply Voltage: 1.8 V

The ability to operate at a minimum of 1.8 V ensures compatibility with a variety of low-power sources, making it versatile for battery-operated devices.

ADC Channels: YES

With integrated ADC channels, this microcontroller can handle analog signals, making it ideal for applications that require sensor interfacing.

DMA Channels: YES

The inclusion of DMA channels greatly enhances data transfer efficiency, freeing up CPU resources for other tasks, which is crucial for performance in resource-intensive applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for a more efficient design in multilayer PCBs and can improve thermal performance.

Width: 5.24 mm

A compact width of 5.24 mm helps in saving PCB space, providing more room for additional components or enhancing device portability.

External Data Bus Width: 16

A 16-bit external data bus width facilitates moderate-speed data transfers which is suitable for many applications without overwhelming the microcontroller's architecture.

Maximum Clock Frequency: 48 MHz

A 48 MHz clock frequency supports efficient processing, making the microcontroller capable of handling various time-critical applications.

Length: 5.24 mm

Similar to the width, the 5.24 mm length contributes to a small overall size, optimizing designs for compact embedded systems.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides a simplified instruction set that can result in higher performance per watt, projecting efficiency in power-sensitive applications.

Terminal Form: BALL

Ball grid array (BGA) terminals enhance electrical performance and thermal management while allowing for higher pin density on the circuit board.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V aligns well with modern battery technologies, enabling prolonged device operation and efficiency.

PWM Channels: YES

Integrated PWM channels allow for precise control of motors and other actuators, making it particularly suited for robotics and automation tasks.

Terminal Pitch: 0.4 mm

A fine terminal pitch of 0.4 mm allows for high-density mounting on PCBs, catering to designs that require numerous connections in limited space.

Speed: 120 rpm

This microcontroller's capability to handle speeds of up to 120 rpm makes it suitable for various control applications, including motors and robotics.

No. of I/O Lines: 115

115 I/O lines provide extensive interfacing possibilities, allowing for complex control schemes and multiple peripheral connections.

Technical Specifications

Microcontrollers STM32L4R5ZGY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

5.24 mm

No. of I/O Lines:

115

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

120 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.24 mm

Peripheral IC Type:

Trade Compliance

STM32L4R5ZGY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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