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STM32L496WGY6PTR

STMicroelectronics

STM32L496WGY6PTR by STMicroelectronics

STM32L496WGY6PTR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 1.32V, and includes 16 ADC channels. Ideal for low-power applications, it supports various connectivity options like CAN and I2C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,680 parts In-Stock

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8,680

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Digiode

USA . 4,805 parts In-Stock

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4,805

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Anansix

USA . 2,460 parts In-Stock

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2,460

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 547 parts In-Stock

1+ parts

$15.560

100+ parts

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547

$15.560

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Microchip USA

USA . 8,617 parts In-Stock

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$24.226

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8,617

$24.226

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IDEA Electronic Components Group

UK . 274 parts In-Stock

1+ parts

$62.172

100+ parts

-

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$55.955

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274

$62.172

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$55.955

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MKK Technologies

India . 1,457 parts In-Stock

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$116.910

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1,457

$116.910

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DigiPath Technology Company

USA . 1,457 parts In-Stock

1+ parts

$116.910

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1,457

$116.910

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Parana Technologies

USA . 616 parts In-Stock

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$74.336

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616

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$74.336

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Corphita

USA . 59 parts In-Stock

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59

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Overview

Unlock unparalleled efficiency and versatility with the STM32L496WGY6PTR from STMicroelectronics, a leader in innovation. Crafted for low-power applications, this microcontroller seamlessly integrates advanced features, ensuring reliability in everything from IoT devices to smart home solutions. Experience the benefits of a robust design that excels in performance while minimizing energy consumption, empowering your projects to thrive effortlessly. Choose quality, choose ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials enhance the microcontroller's reliability in various applications.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency, making it suitable for complex tasks.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern electronic devices.

Maximum Supply Voltage: 1.32 V

Low maximum voltage levels ensure compatibility with low-power applications, enhancing energy efficiency.

On Chip Data RAM Width: 8

8-bit RAM width allows for efficient data handling suited for various processing and control tasks.

Address Bus Width: 13

A wider address bus enables the handling of larger memory sizes, beneficial for demanding applications.

Package Shape: RECTANGULAR

Rectangular package shape helps in maximizing the use of PCB space for various designs.

Bit Size: 32

A 32-bit architecture provides significant computing power, capable of handling complex algorithms.

DAC Channels: YES

Integrated Digital-to-Analog Converters allow for versatile output options in control applications.

No. of Terminals: 115

A higher number of terminals facilitates more connections for complex devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style reduces space consumption and supports high-density applications without compromising performance.

Minimum Supply Voltage: 1.08 V

Low minimum voltage supports operation in battery-powered devices, enhancing overall efficiency.

Maximum Operating Temperature: 85 °C

This temperature range makes the microcontroller suitable for various industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 provides advanced DSP capabilities, making it ideal for real-time applications.

No. of External Interrupts: 16

Multiple external interrupts allow the microcontroller to handle multiple inputs effectively.

Minimum Operating Temperature: -40 °C

The extended temperature range allows for usage in extreme environments, broadening application scope.

ADC Channels: YES

Integrated Analog-to-Digital Converters enable precise sensor data processing, enhancing functionality.

DMA Channels: YES

Direct Memory Access channels improve system performance by allowing peripherals to access memory without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning is optimal for PCB design, ensuring efficient layout and connectivity.

ROM Words: 1048576

High ROM capacity supports complex firmware and algorithms, suitable for advanced applications.

Maximum Seated Height: 0.59 mm

A low seated height allows for slim device designs and enhances overall integration into compact systems.

Digital To Analog Converters: 2-Ch 12-Bit

Having dual-channel DACs ensures versatility in output and control applications.

Width: 4.15 mm

Compact width allows for high-density designs, making it an excellent choice for space-constrained applications.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, improving reliability during development.

External Data Bus Width: 16

16-bit data bus width facilitates efficient data transfer between components, enhancing overall performance.

Peripherals: BOR, COMPARATOR(2), DMA(14), LCD, PWM(2), RTC, TIMER(14), WDT(2)

Multiple integrated peripherals provide extensive functionality, making it adaptable for various applications.

Maximum Clock Frequency: 48 MHz

A high clock frequency increases processing speed, making it suitable for demanding applications.

Length: 4.63 mm

Compact length enables effective space management in electronic boards.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and lower power consumption, ideal for embedded systems.

No. of Timers: 14

Multiple timers allow for precise control in time-sensitive applications, enhancing performance.

RAM Bytes: 327680

Ample RAM enhances multitasking capabilities, which is crucial for complex applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, ideal for battery-operated devices.

Terminal Form: BALL

Ball form factor improves thermal and electrical performance, suitable for high-frequency operations.

Analog To Digital Convertors: 16-Ch 12-Bit

16-channel ADC allows for comprehensive sensor integration and data processing capabilities.

Nominal Supply Voltage: 1.1 V

A nominal voltage of 1.1 V contributes to overall energy efficiency and low power consumption.

No. of DMA Channels: 14

Multiple DMA channels allow for efficient data handling, freeing up CPU resources for other tasks.

No. of Serial I/Os: 8

Having 8 serial I/Os maximizes connectivity options for various peripherals and devices.

PWM Channels: YES

Integrated PWM channels enable precise control in various applications, including motor control.

Connectivity: CAN(2), I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

A wide range of connectivity options ensures compatibility with a variety of devices and systems.

ROM Programmability: FLASH

Flash ROM allows for easy updates and modifications, enhancing flexibility in design.

Terminal Pitch: 0.4 mm

A small terminal pitch enables high-density designs, ideal for compact devices.

Format: FLOATING POINT

Floating-point format allows for complex mathematical operations, improving processing capabilities.

Speed: 80 rpm

High-speed performance ensures rapid operation, making it suitable for modern applications.

Low Power Mode: YES

Low power mode extends battery life in portable applications, enhancing overall efficiency.

On Chip Program ROM Width: 8

Optimized ROM width supports efficient program storage, enhancing processing capabilities.

No. of I/O Lines: 86

With 86 I/O lines available, this microcontroller can interface with a wide array of external devices.

Technical Specifications

Microcontrollers STM32L496WGY6PTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B115

Length:

4.63 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

86

No. of Serial I/Os:

8

No. of Terminals:

115

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

WLCSP115(UNSPEC)

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

327680

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.59 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

4.15 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), LCD, PWM(2), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L496WGY6PTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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