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STM32L486VGT3TR

STMicroelectronics

STM32L486VGT3TR by STMicroelectronics

STM32L486VGT3TR microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.71V and 3.6V, and supports up to 48 MHz clock speed. It includes multiple ADC channels and connectivity options like CAN and USB. Ideal for low-power applications in IoT devices, wearables, and industrial controls.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,335 parts In-Stock

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8,335

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Digiode

USA . 2,262 parts In-Stock

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2,262

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Anansix

USA . 1,223 parts In-Stock

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1,223

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Distributors (Availability)

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Vigor

Singapore . 3,956 parts In-Stock

1+ parts

$8.960

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-

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3,956

$8.960

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AZTECH Wire

Italy . 197 parts In-Stock

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$14.610

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197

$14.610

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IDEA Electronic Components Group

UK . 1,367 parts In-Stock

1+ parts

$47.827

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$43.044

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1,367

$47.827

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$43.044

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MKK Technologies

India . 758 parts In-Stock

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$89.936

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758

$89.936

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DigiPath Technology Company

USA . 758 parts In-Stock

1+ parts

$89.936

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758

$89.936

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Corphita

USA . 3,059 parts In-Stock

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Parana Technologies

USA . 213 parts In-Stock

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$57.185

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213

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$57.185

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Overview

Unlock the potential of your next project with the STM32L486VGT3TR microcontroller from STMicroelectronics, a leader in innovation and quality. This versatile powerhouse is perfect for low-power applications in healthcare, IoT, and smart devices, offering seamless connectivity and advanced features that enhance performance and efficiency. Experience exceptional reliability and superior support, ensuring your designs reach new heights with unmatched value and benefits.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient PCB layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources and low-power applications.

Address Bus Width: 26

The 26-bit address bus width allows for a larger addressable memory space, supporting complex applications.

Package Shape: SQUARE

The square package shape facilitates easier handling and placement on PCBs, enhancing manufacturing efficiency.

Bit Size: 32

The 32-bit architecture enables handling of larger data types and improved performance in computational tasks.

No. of Terminals: 100

With 100 terminals, this microcontroller can accommodate various peripherals and interfaces, providing flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack and low-profile style is suitable for high-density applications and promotes efficient thermal management.

Minimum Supply Voltage: 1.71 V

A minimum supply voltage of 1.71 V allows for operation with low-voltage power supplies, increasing energy efficiency.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog devices, making it suitable for mixed-signal applications.

DMA Channels: YES

Dedicated DMA channels enhance data transfer efficiency, allowing for non-blocking operations which improve overall system performance.

Terminal Position: QUAD

The quad terminal position simplifies PCB routing and improves accessibility for soldering.

Digital To Analog Convertors: 2-Ch 12-Bit

The presence of dual 12-bit DACs allows precise analog output, suitable for applications requiring accurate control signals.

Width: 14 mm

A compact width of 14 mm aids in minimizing the overall footprint of the final device design.

External Data Bus Width: 16

A 16-bit external data bus enhances data throughput, making it efficient for applications requiring high-speed processing.

Peripherals: BOR, COMPARATOR(2), DMA(14), LCD, RTC, TIMER(14), WDT(2)

The extensive list of integrated peripherals reduces the need for additional components, facilitating simpler and more compact designs.

Maximum Clock Frequency: 48 MHz

Operating at a maximum clock frequency of 48 MHz allows for high-speed computations and quicker response times in applications.

Length: 14 mm

The 14 mm length complements the width, supporting compact arrangements in miniaturized electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient instruction execution, promoting lower power consumption and higher performance.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, ideal for battery-powered and sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide better mechanical strength and are easier to solder, supporting reliability in connections.

Analog To Digital Convertors: 16-Ch 12-Bit

The availability of 16 ADC channels enhances the product's utility in applications that require multiple sensor inputs.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V balances performance and power efficiency, suitable for a range of embedded systems.

PWM Channels: YES

Inclusion of PWM channels allows for precise control in applications such as motor control and dimming LED lights.

Connectivity: CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3), USB

The diverse connectivity options ensure versatile interoperability with various modules and devices, enhancing the microcontroller's application range.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports higher density designs, allowing more I/O connections on a smaller footprint.

Speed: 80 rpm

The operational speed of 80 rpm indicates suitability for real-time applications like robotics and automation.

No. of I/O Lines: 82

With 82 I/O lines available, the microcontroller provides ample GPIO options for interfacing with sensors, actuators, and other devices.

Technical Specifications

Microcontrollers STM32L486VGT3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

14 mm

No. of I/O Lines:

82

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), LCD, RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L486VGT3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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