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STM32L471ZET6TR

STMicroelectronics

STM32L471ZET6TR by STMicroelectronics

STM32L471ZET6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.71V and 3.6V, and supports up to 24 ADC channels. With a max clock frequency of 48 MHz, it's ideal for industrial applications requiring low power consumption. Its compact design includes 144 terminals and multiple connectivity options like CAN and I2C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,486 parts In-Stock

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9,486

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Digiode

USA . 4,209 parts In-Stock

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4,209

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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Anansix

USA . 833 parts In-Stock

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833

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Distributors (Availability)

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Vigor

Singapore . 6,853 parts In-Stock

1+ parts

$7.090

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6,853

$7.090

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AZTECH Wire

Italy . 967 parts In-Stock

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$8.260

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967

$8.260

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Microchip USA

USA . 3,931 parts In-Stock

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$22.704

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3,931

$22.704

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IDEA Electronic Components Group

UK . 272 parts In-Stock

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$70.803

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$63.723

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272

$70.803

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$63.723

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Component Stockers USA

USA . 938 parts In-Stock

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$118.080

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938

$118.080

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MKK Technologies

India . 1,410 parts In-Stock

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$133.141

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$133.141

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DigiPath Technology Company

USA . 1,410 parts In-Stock

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$133.141

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1,410

$133.141

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Corphita

USA . 3,283 parts In-Stock

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3,283

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Parana Technologies

USA . 445 parts In-Stock

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$84.656

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445

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$84.656

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Glotronic Ltd.

UK . 400 parts In-Stock

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Overview

Unlock the potential of your next project with the STM32L471ZET6TR microcontroller from STMicroelectronics. Renowned for their high-quality, innovative solutions, STMicroelectronics brings you a versatile and energy-efficient MCU tailored for diverse applications—from industrial automation to smart wearables. With exceptional performance in a compact design, this microcontroller ensures reliability while maximizing efficiency, empowering you to create cutting-edge products that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and resistance to environmental conditions, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, enabling more compact designs and facilitating automated assembly.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications, enhancing efficiency and battery life.

Address Bus Width: 26

A 26-bit address bus width allows for addressing a large memory space, accommodating complex applications requiring significant data handling.

Package Shape: SQUARE

The square package shape enables easier integration into various circuit layouts and contributes to efficient thermal management.

Bit Size: 32

A 32-bit architecture enhances processing power and allows for more advanced computation capabilities, making it suitable for demanding applications.

DAC Channels: YES

The inclusion of Digital-to-Analog Converter (DAC) channels facilitates direct analog output, ideal for applications requiring precise control of signals.

No. of Terminals: 144

With 144 terminals, this microcontroller provides extensive connectivity options and interfaces, enabling flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack style allows for compact assembly while maintaining reliable connections, ideal for space-constrained applications.

Minimum Supply Voltage: 1.71 V

A minimum supply voltage of 1.71 V allows operation in low-power conditions, which is favorable for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it can function effectively in high-temperature environments, increasing its versatility.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C enables usage in extreme environments, making it suitable for industrial and automotive applications.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows for the monitoring of analog signals, essential for sensor interfacing.

DMA Channels: YES

Dedicated Direct Memory Access (DMA) channels improve data handling efficiency, reducing CPU load during data transfer operations.

Terminal Position: QUAD

Quad terminal positioning ensures better placement and soldering reliability, important for robust PCB designs.

ROM Words: 524288

A considerable ROM size provides ample space for program storage, allowing for complex functionalities within the microcontroller.

Maximum Seated Height: 1.6 mm

Its low seated height allows for an efficient stack within designs, promoting compact layouts.

Digital To Analog Converters: 2 Ch 12-Bit

Two 12-bit DAC channels provide high-resolution analog output, ideal for precision applications in control systems.

Width: 20 mm

A compact width of 20 mm makes it suitable for small form-factor devices and applications.

External Data Bus Width: 16

A 16-bit external data bus width facilitates efficient data transfer between the microcontroller and external peripherals.

Peripherals: BOR, COMPARATOR(2), CRC, DMA(14), PWC, RTC, TIMER(14), TSC, WDT(2)

A rich set of peripherals enhances functionality and versatility, enabling a wide range of applications from monitoring to real-time processing.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures fast data processing and real-time performance, crucial for time-sensitive applications.

Length: 20 mm

At 20 mm long, it maintains a compact design while providing robust performance capabilities.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies suitability for harsh environments, ensuring reliability and longevity in demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing, reducing power consumption and improving performance in embedded applications.

RAM Bytes: 131072

A substantial RAM capacity of 131072 bytes supports complex computing tasks and multitasking in applications.

Technology: CMOS

CMOS technology contributes to low power consumption, high noise immunity, and high density, enhancing overall device efficiency.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering properties and mechanical stability, promoting reliability in interconnections.

Analog To Digital Converters: 24 Ch 12-Bit(3)

With 24 12-bit ADC channels, this microcontroller can effectively handle multiple sensor inputs, advantageous for complex monitoring systems.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is optimal for low power consumption and energy efficiency in portable designs.

PWM Channels: YES

The availability of PWM channels is perfect for motor control and other applications requiring precise signal modulation.

Connectivity: CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3)

Versatile connectivity options facilitate integration with various devices and sensors, enhancing the microcontroller's adaptability.

ROM Programmability: FLASH

The use of FLASH ROM for programmability allows for easy updates and flexibility in application development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density connections, enabling compact designs while maximizing connectivity.

Speed: 80 rpm

Achieving a speed of 80 rpm indicates potential for integration in dynamic applications that require thoughtful modulation and control.

On Chip Program ROM Width: 8

An 8-bit wide on-chip program ROM enables efficient program execution and compatibility with various software systems.

No. of I/O Lines: 114

A high number of I/O lines (114) greatly enhances the microcontroller's ability to interface with multiple peripherals and sensors.

Technical Specifications

Microcontrollers STM32L471ZET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

114

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3)

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(14), PWC, RTC, TIMER(14), TSC, WDT(2)

Analog To Digital Convertors:

24 Ch 12-Bit(3)

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L471ZET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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