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STM32L471ZEJ6TR

STMicroelectronics

STM32L471ZEJ6TR by STMicroelectronics

STM32L471ZEJ6TR microcontroller from STMicroelectronics features a 32-bit architecture with a max clock frequency of 48 MHz and operates b/w 1.71V to 3.6V. It includes ADC and PWM channels, making it ideal for low-power applications in IoT devices. Its compact design with a fine pitch grid array ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,735 parts In-Stock

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9,735

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Digiode

USA . 825 parts In-Stock

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825

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Anansix

USA . 369 parts In-Stock

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369

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Distributors (Availability)

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Vigor

Singapore . 1,329 parts In-Stock

1+ parts

$7.520

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1,329

$7.520

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AZTECH Wire

Italy . 174 parts In-Stock

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$13.070

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174

$13.070

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IDEA Electronic Components Group

UK . 348 parts In-Stock

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$64.737

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$58.263

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348

$64.737

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$58.263

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MKK Technologies

India . 1,691 parts In-Stock

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$121.733

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1,691

$121.733

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DigiPath Technology Company

USA . 1,691 parts In-Stock

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$121.733

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1,691

$121.733

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Parana Technologies

USA . 869 parts In-Stock

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$77.403

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869

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$77.403

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Corphita

USA . 715 parts In-Stock

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715

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Overview

Unlock limitless possibilities with the STM32L471ZEJ6TR microcontroller from STMicroelectronics! Designed for low-power applications, this versatile 32-bit MCU ensures unmatched efficiency without compromising performance. Ideal for IoT devices, wearable tech, and smart sensors, it empowers developers to innovate and create with ease. Trust in STMicroelectronics' legacy of quality and excellence, and elevate your projects with cutting-edge technology that delivers exceptional value and reliability.

Feature Benefit Bullets

Surface Mount: YES

Being surface mount allows for a compact design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Supports a wide voltage range, enabling compatibility with various power systems.

Address Bus Width: 26

A wider address bus allows for larger memory addressing, enhancing the microcontroller's capabilities.

Package Shape: SQUARE

Square package offers uniform thermal performance and mechanical stability.

Bit Size: 32

32-bit architecture provides enhanced processing power and efficiency for complex applications.

No. of Terminals: 144

A high number of terminals allows for extensive peripheral connectivity and functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch make it ideal for high-density applications where space is at a premium.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage ensures energy efficiency, extending battery life in portable devices.

ADC Channels: YES

Integrated ADC channels enable seamless conversion from analog to digital signals, essential for sensor applications.

DMA Channels: YES

DMA channels improve data transfer efficiency, freeing the CPU for other tasks and enhancing overall performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB design and improves layout flexibility.

Width: 10 mm

Compact width makes it suitable for small form factor devices, saving valuable PCB space.

External Data Bus Width: 16

A 16-bit external data bus provides a balanced performance for data-intensive operations.

Maximum Clock Frequency: 48 MHz

A clock frequency of 48 MHz allows for efficient processing speeds, suitable for a wide range of applications.

Length: 10 mm

Compact length contributes to the overall small footprint, ideal for embedded systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance with a streamlined instruction set, making it efficient for real-time processing.

Terminal Form: BALL

Ball terminal form offers a reliable connection while minimizing the risk of mechanical failure.

Nominal Supply Voltage: 1.8 V

Nominal voltage of 1.8 V aligns with modern low-power designs, ideal for battery-operated applications.

PWM Channels: YES

Presence of PWM channels makes it versatile for motor control and other applications requiring modulation.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for high-density mounting while still enabling easy soldering.

Speed: 80 rpm

Supports up to 80 rpm operations, suitable for applications requiring moderate speed.

No. of I/O Lines: 114

A high number of I/O lines facilitates connection to multiple peripherals, enhancing versatility and functionality.

Technical Specifications

Microcontrollers STM32L471ZEJ6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

10 mm

No. of I/O Lines:

114

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32L471ZEJ6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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