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STM32L452VEI3TR

STMicroelectronics

STM32L452VEI3TR by STMicroelectronics

STM32L452VEI3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w 1.71V and 3.6V, and supports up to 48 MHz clock speed. With integrated DAC, ADC channels, and low power modes, it's ideal for automotive applications. Its compact design includes 100 terminals in a thin profile package for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,524 parts In-Stock

1+ parts

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6,524

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Anansix

USA . 2,580 parts In-Stock

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2,580

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Digiode

USA . 1,328 parts In-Stock

1+ parts

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1,328

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 301 parts In-Stock

1+ parts

$8.120

100+ parts

-

1k+ parts

-

10k+ parts

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301

$8.120

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Microchip USA

USA . 5,319 parts In-Stock

1+ parts

$20.152

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5,319

$20.152

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IDEA Electronic Components Group

UK . 1,794 parts In-Stock

1+ parts

$58.383

100+ parts

-

1k+ parts

$52.545

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1,794

$58.383

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$52.545

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MKK Technologies

India . 2,109 parts In-Stock

1+ parts

$109.786

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2,109

$109.786

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DigiPath Technology Company

USA . 2,109 parts In-Stock

1+ parts

$109.786

100+ parts

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2,109

$109.786

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Corphita

USA . 3,657 parts In-Stock

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3,657

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Parana Technologies

USA . 2,234 parts In-Stock

1+ parts

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100+ parts

$69.806

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2,234

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$69.806

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Overview

Unlock the potential of your next project with the STM32L452VEI3TR microcontroller from STMicroelectronics—where quality meets innovation. Engineered for efficiency, this versatile device excels in low-power applications, making it ideal for wearables, IoT devices, and automotive solutions. With robust connectivity options and an impressive temperature range, it empowers developers to create cutting-edge solutions that enhance performance and reliability, driving success in any application!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Integrated Cache: YES

Having integrated cache improves processing efficiency, allowing quicker access to frequently used data, which enhances overall performance.

Surface Mount: YES

Surface mount technology enables compact design and simplified manufacturing, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources, providing flexibility in design.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data handling, balancing speed and resource allocation.

Package Shape: SQUARE

Square package shape facilitates efficient layout and design, making it easier to integrate into a printed circuit board (PCB).

Bit Size: 32

The 32-bit architecture supports advanced computing tasks and higher precision calculations, making it suitable for complex applications.

DAC Channels: YES

Integrated DAC channels provide enhanced processing capabilities for applications requiring analog output, such as audio and sensor interfacing.

No. of Terminals: 100

Having 100 terminals allows for extensive connectivity and interfacing options, accommodating more peripherals and functionalities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style allows for efficient thermal management and helps in high-density designs, perfect for modern electronics.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage of 1.71 V makes it power-efficient and suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

Operating at high temperatures up to 125 °C makes this microcontroller suitable for automotive and industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 family is known for its high performance and efficiency, providing powerful processing capabilities for embedded systems.

No. of External Interrupts: 16

With 16 external interrupts, the microcontroller can efficiently respond to various external events, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliable performance in harsh environments, essential for automotive and industrial applications.

ADC Channels: YES

Integrated ADC channels allow for accurate digital conversion of analog signals, crucial for sensors and data acquisition applications.

DMA Channels: YES

DMA channels facilitate efficient data movement with minimal CPU intervention, significantly improving performance for data-intensive tasks.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB design and assembly, allowing for efficient use of space.

ROM Words: 524288

With 524288 ROM words, the microcontroller offers ample memory for application storage, accommodating complex firmware.

Maximum Seated Height: 0.6 mm

A maximum seated height of 0.6 mm contributes to a compact design, aiding in the development of smaller electronic devices.

RAM Words: 163840

This large RAM capacity allows for efficient multitasking and reduces the latency of data access, crucial for complex applications.

Width: 7 mm

The compact width of 7 mm makes it suitable for space-constrained applications, facilitating modern design trends.

Boundary Scan: YES

Boundary scan support helps in testing and debugging circuits with ease, enhancing reliability and reducing time-to-market.

Peripherals: ANALOG COMPARATOR(2), BOR, CRC, DMA(14), PVD, PWM, RTC, TIMER(8), WDT(2)

A rich set of peripherals enhances the microcontroller's capability to interface with various sensors and control mechanisms.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides adequate processing speed for many applications, making it responsive and efficient.

Length: 7 mm

The short length contributes to a compact footprint, making the microcontroller ideal for portable and space-constrained devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring durability and reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures efficient instruction execution, enhancing performance and power efficiency.

No. of Timers: 8

With 8 timers available, this microcontroller can handle multiple timing operations simultaneously, beneficial for complex tasks.

RAM Bytes: 163840

This generous RAM size allows for better handling of multitasking and multiple data streams, enhancing performance.

Technology: CMOS

CMOS technology enables low power consumption while maintaining performance, making it suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form facilitates efficient heat dissipation and a compact design for circuit boards.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V implies better power efficiency, enhancing the battery life of portable applications.

No. of DMA Channels: 14

Having 14 DMA channels allows for extensive data handling capabilities without taxing the CPU, improving efficiency.

PWM Channels: YES

Integrated PWM channels support precise control over analog signals, crucial for motor control and similar applications.

Connectivity: CAN, I2C(4), IRDA, LIN, LPUART, SAI, SDMMC, SPI(3), QSPI, UART, USART(3), USB

Diverse connectivity options enhance versatility, enabling communication with various devices and sensors, ideal for IoT applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing the longevity and flexibility of applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density designs and minimizes the space required for mounting on PCBs.

Format: FLOATING POINT

Floating point format allows for more complex calculations necessary for advanced applications, including digital signal processing.

Speed: 80 rpm

This low operational speed is suitable for power-sensitive applications, ensuring efficient energy use during operation.

Low Power Mode: YES

Low power mode capabilities extend battery life and reduce energy consumption, making it perfect for portable devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides efficient data handling while supporting a wide range of applications.

No. of I/O Lines: 83

With 83 I/O lines, the microcontroller allows extensive interfacing options, accommodating complex functionalities and peripheral connections.

Technical Specifications

Microcontrollers STM32L452VEI3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

100

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

163840

RAM Words:

163840

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(4), IRDA, LIN, LPUART, SAI, SDMMC, SPI(3), QSPI, UART, USART(3), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, CRC, DMA(14), PVD, PWM, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L452VEI3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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