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STM32L152RBH6A

STMicroelectronics

STM32L152RBH6A by STMicroelectronics

STM32L152RBH6A by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features DAC and ADC channels, PWM support, and DMA capabilities. Ideal for industrial applications requiring a temperature range of -40 to 85 °C, it comes in a compact square package with a low profile of 1.2 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,639 parts In-Stock

1+ parts

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6,639

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Anansix

USA . 1,737 parts In-Stock

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1,737

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Digiode

USA . 1,554 parts In-Stock

1+ parts

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1,554

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,960 parts In-Stock

1+ parts

$3.530

100+ parts

-

1k+ parts

-

10k+ parts

-

3,960

$3.530

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AZTECH Wire

Italy . 280 parts In-Stock

1+ parts

$19.930

100+ parts

-

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280

$19.930

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Microchip USA

USA . 5,570 parts In-Stock

1+ parts

$27.525

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-

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5,570

$27.525

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Component Stockers USA

USA . 1,833 parts In-Stock

1+ parts

$69.730

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1,833

$69.730

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IDEA Electronic Components Group

UK . 121 parts In-Stock

1+ parts

$70.800

100+ parts

-

1k+ parts

$63.720

10k+ parts

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121

$70.800

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$63.720

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MKK Technologies

India . 1,603 parts In-Stock

1+ parts

$133.134

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1,603

$133.134

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DigiPath Technology Company

USA . 1,603 parts In-Stock

1+ parts

$133.134

100+ parts

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1,603

$133.134

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QUARKTWIN TECHNOLOGY LTD

USA . 27,930 parts In-Stock

1+ parts

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27,930

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Perfect Parts

USA . 2,867 parts In-Stock

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2,867

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Corphita

USA . 2,558 parts In-Stock

1+ parts

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2,558

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Parana Technologies

USA . 1,460 parts In-Stock

1+ parts

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100+ parts

$84.652

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1,460

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$84.652

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Overview

Discover the STM32L152RBH6A by STMicroelectronics, a top-tier microcontroller that offers unmatched quality and reliability. With a wide range of applications in various industries, this cutting-edge product provides customers with exceptional value and performance. Benefit from advanced features like DAC and ADC channels, PWM capabilities, and low power consumption. Trust in STMicroelectronics' reputation for excellence in technology to deliver a superior product that meets all your needs. Experience the advantages of the STM32L152RBH6A and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the microcontroller, making it suitable for various industrial and commercial applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6V provides flexibility in power supply options and compatibility with different voltage sources.

Package Shape: SQUARE

Square package shape optimizes space utilization on the PCB and enhances overall aesthetics of the design.

Bit Size: 32

A 32-bit architecture offers high computational capabilities and efficiency, suitable for handling complex tasks and processing large data sets.

DAC Channels: YES

Having Digital-to-Analog Converter (DAC) channels allows for precise control over analog outputs, useful in applications requiring accurate voltage or current control.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The package style of grid array with thin profile and fine pitch offers high density integration, reducing PCB footprint and enabling compact designs.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V ensures efficient power consumption and operation in low power applications or battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C allows the microcontroller to withstand elevated temperatures in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C enables reliable operation in extreme cold conditions or freezer applications.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable electrical connections.

ADC Channels: YES

Having Analog-to-Digital Converter (ADC) channels enables the microcontroller to convert analog signals into digital data, essential for sensing and measurement applications.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and offload the CPU, enhancing overall system performance and multitasking capabilities.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, offering convenience during assembly and allowing for a compact and organized design.

Maximum Seated Height: 1.2 mm

Low maximum seated height of 1.2mm facilitates compact and slim device designs, ideal for applications where space constraints are a concern.

Width: 5 mm

Compact width of 5mm enables space-efficient placement on the PCB board while still providing all the necessary functionalities for the application.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32MHz allows for fast processing speeds and real-time operations, suitable for applications requiring rapid data processing.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures secure and reliable solder joints during assembly, leading to robust and durable connections.

Length: 5 mm

Compact length of 5mm contributes to the overall small form factor of the microcontroller, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions and high temperature ranges commonly found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture offers efficient processing and power consumption, ideal for embedded control applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high noise immunity, and reliable operation, enhancing overall performance.

Terminal Form: BALL

Ball terminal form offers secure and reliable solder connections, suitable for applications where vibration or mechanical stress may occur.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable operation of the microcontroller, preventing potential performance issues.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels enable precise control of digital outputs, useful for adjusting signal levels, generating waveforms, and controlling motor speeds.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, customization, and storage of program code, enhancing the versatility of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and precise solder connections, suitable for compact and miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level (MSL) of 3 indicates the microcontroller's resistance to moisture absorption during storage and handling, ensuring reliability in humid environments.

Speed: 32 rpm

Operating speed of 32 rotations per minute (rpm) denotes the processing speed and performance capabilities of the microcontroller in executing tasks efficiently.

No. of I/O Lines: 50

Abundance of 50 input/output (I/O) lines offers versatile connectivity options for interfacing with sensors, actuators, displays, and other external devices in the system.

Technical Specifications

Microcontrollers STM32L152RBH6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

50

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32L152RBH6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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