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STM32L151VBT6

STMicroelectronics

STM32L151VBT6 by STMicroelectronics

STM32L151VBT6 by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 16384 RAM bytes, and 24-Ch 12-Bit ADC. It operates at a max clock frequency of 32 MHz and has various peripherals like BOD, RTC, and USB. Ideal for industrial applications requiring high-speed processing and multiple connectivity options.

Median Price

$29.902

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 540 parts In-Stock

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540

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Avnet

USA . 180 parts In-Stock

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180

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Digiode

USA . 2,968 parts In-Stock

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$8.274

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2,968

$8.274

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Ozdisan Elektronik

Türkiye . 60 parts In-Stock

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$51.529

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$51.529

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Chip Stock

USA . 14,300 parts In-Stock

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14,300

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Vyrian

USA . 5,123 parts In-Stock

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Anansix

USA . 2,555 parts In-Stock

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Cyclops Electronics Ltd

UK . 319 parts In-Stock

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ComSIT Distribution GmbH

Germany . 180 parts In-Stock

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Vigor

Singapore . 1,531 parts In-Stock

1+ parts

$7.580

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$7.580

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Corphita

USA . 1,214 parts In-Stock

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$7.839

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IDEA Electronic Components Group

UK . 145 parts In-Stock

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$35.345

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$31.811

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$35.345

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$31.811

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MKK Technologies

India . 1,666 parts In-Stock

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$66.465

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DigiPath Technology Company

USA . 1,666 parts In-Stock

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$66.465

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Perfect Parts

USA . 6,366 parts In-Stock

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Parana Technologies

USA . 1,617 parts In-Stock

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$42.261

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Eastek

USA . 360 parts In-Stock

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Authorized Procurement Solutions

USA . 60 parts In-Stock

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GreenTree Electronics

Israel . 60 parts In-Stock

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Overview

Discover the STM32L151VBT6 microcontroller by STMicroelectronics, a high-quality product designed for a wide range of applications. With its advanced features and reliable performance, this microcontroller offers unmatched value to customers looking for efficient solutions. Benefit from the cutting-edge technology and innovative design of STMicroelectronics, a trusted manufacturer known for delivering top-notch products. Whether you're working on industrial projects or consumer electronics, the STM32L151VBT6 is the perfect choice for your next venture. Unlock endless possibilities with this versatile microcontroller and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power sources and compatibility with a range of voltage levels.

Bit Size: 32

Offers a relatively large bit size, allowing for complex data processing and handling capabilities.

Power Supplies (V): 2/3.3

Provides multiple power supply options for different voltage requirements in various applications.

ADC Channels: YES

Supports analog-to-digital conversion, enabling the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Enables direct memory access for efficient data transfer and processing, enhancing overall system performance.

ROM Words: 131072

Offers a large ROM capacity for storing program instructions and data, accommodating complex software requirements.

RAM Bytes: 16384

Provides a sufficient amount of memory for data storage and manipulation, supporting multitasking and complex algorithms.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient instruction processing and execution, enhancing overall system performance.

Connectivity: I2C(2), SPI(2), USART(3), USB

Offers versatile connectivity options for communication with external devices, expanding the range of applications for the microcontroller.

Technical Specifications

Microcontrollers STM32L151VBT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

83

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), SPI(2), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L151VBT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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