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STM32L151C6U6TR

STMicroelectronics

STM32L151C6U6TR by STMicroelectronics

STM32L151C6U6TR by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 32 MHz. It features 14-Ch 12-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring high-speed data processing and connectivity via I2C, SPI, USART, and USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,645 parts In-Stock

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4,645

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Digiode

USA . 1,907 parts In-Stock

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1,907

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Anansix

USA . 781 parts In-Stock

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781

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Distributors (Availability)

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Vigor

Singapore . 4,000 parts In-Stock

1+ parts

$2.620

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-

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4,000

$2.620

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AZTECH Wire

Italy . 503 parts In-Stock

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$8.780

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503

$8.780

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Microchip USA

USA . 3,925 parts In-Stock

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$22.729

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3,925

$22.729

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IDEA Electronic Components Group

UK . 2,302 parts In-Stock

1+ parts

$43.231

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$38.908

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2,302

$43.231

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$38.908

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MKK Technologies

India . 429 parts In-Stock

1+ parts

$81.293

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429

$81.293

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DigiPath Technology Company

USA . 429 parts In-Stock

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$81.293

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429

$81.293

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QUARKTWIN TECHNOLOGY LTD

USA . 18,754 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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Corphita

USA . 2,612 parts In-Stock

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2,612

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Parana Technologies

USA . 156 parts In-Stock

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$51.689

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156

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$51.689

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Overview

Unlock a world of endless possibilities with the STM32L151C6U6TR microcontroller by STMicroelectronics. Designed with precision and quality in mind, this powerful device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this Cortex-M3 based microcontroller provides advanced features such as DAC and ADC channels, DMA support, and a maximum clock frequency of 32 MHz. With a compact square package style and low power consumption, the STM32L151C6U6TR delivers exceptional value and efficiency to customers looking to elevate their projects to the next level. Experience innovation like never before with STMicroelectronics.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making the product suitable for mass production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in powering the microcontroller in various applications.

Package Shape: SQUARE

The square package shape allows for a compact footprint on the PCB, optimizing space utilization.

Bit Size: 32

The 32-bit architecture enables high-performance computing and data processing capabilities.

DAC Channels: YES

The presence of DAC channels allows for analog signal output, enhancing the versatility of the microcontroller.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages offers compatibility with different voltage requirements in various systems.

No. of Terminals: 48

With 48 terminals, the microcontroller provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package styles offer different thermal management options and a slim profile, suitable for space-constrained designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and extends battery life in battery-operated applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows the microcontroller to perform reliably in industrial environments with elevated temperatures.

CPU Family: CORTEX-M3

The Cortex-M3 architecture provides a balance between performance and power efficiency, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The microcontroller can operate in extreme cold conditions, making it suitable for outdoor and industrial applications.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and ensures reliable electrical connections during PCB assembly.

ADC Channels: YES

The availability of ADC channels allows for precise analog-to-digital conversion, enabling accurate sensor data acquisition.

DMA Channels: YES

DMA channels enable efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates easy PCB layout and soldering, enhancing manufacturing efficiency.

ROM Words: 32768

The generous ROM size provides ample storage for program code, data, and configuration settings in the microcontroller.

Maximum Seated Height: 0.6 mm

The low seated height allows for a slim profile in the final product, ideal for applications with space constraints.

Digital To Analog Convertors: 2-Ch 12-Bit

The 2-channel 12-bit DACs enable high-resolution analog signal output for precise control and monitoring applications.

Width: 7 mm

Compact width dimensions allow for efficient PCB layout and integration into space-limited designs.

Data EEPROM Size: 4K

The 4K EEPROM size provides non-volatile data storage for critical information, ensuring data retention even during power loss.

Peripherals: BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

A wide range of integrated peripherals, including Brown-Out Detection, comparators, DMA channels, real-time clock, and timers, enhance the microcontroller's functionality and application versatility.

Maximum Clock Frequency: 32 MHz

The high clock frequency allows for fast execution of instructions and efficient operation in demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures robust solder joints and reliability in lead-free assembly processes.

Length: 7 mm

The compact length dimensions contribute to a space-saving design and easy integration into small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating certifies the microcontroller's reliability and performance in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC-based microcontroller architecture offers high efficiency and performance for a wide range of embedded applications.

RAM Bytes: 10240

The generous RAM size provides ample memory for data storage, variable storage, and buffer operations in the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and scalability for a versatile microcontroller design.

Terminal Form: NO LEAD

The no-lead terminal form enhances solder joint reliability, thermal performance, and PCB space savings in the assembly process.

Analog To Digital Convertors: 14-Ch 12-Bit

The 14-channel 12-bit ADCs enable multiple analog signal inputs for accurate data acquisition and sensor interfacing in complex systems.

Maximum Supply Current: 11 mA

The low maximum supply current consumption ensures energy efficiency and prolonged battery life in power-sensitive applications.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is a common voltage standard, ensuring compatibility with various power sources and peripherals.

PWM Channels: YES

The presence of PWM channels enables precise control of motor speed, LED brightness, and analog signal modulation in applications requiring pulse-width modulation.

Connectivity: I2C(2), SPI(2), USART(3), USB

Multiple connectivity options, including I2C, SPI, USART, and USB interfaces, facilitate seamless communication with external devices and peripherals.

ROM Programmability: FLASH

The flash ROM programmability allows for in-system programming and firmware updates, ensuring flexibility and adaptability in the microcontroller.

Terminal Pitch: 0.5 mm

The narrow terminal pitch provides high-density PCB layout capabilities and enables compact designs in space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, ensuring proper handling and storage of the microcontroller during assembly and rework processes.

Speed: 32 rpm

With a speed of 32 rpm, the microcontroller can efficiently process data and execute instructions at a rapid rate, ideal for real-time applications.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits provides ample storage capacity for firmware, boot code, and program instructions in the microcontroller.

No. of I/O Lines: 37

The 37 I/O lines offer versatile connectivity options for interfacing with external sensors, actuators, displays, and communication modules in the system.

Technical Specifications

Microcontrollers STM32L151C6U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), SPI(2), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L151C6U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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