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STM32L100C6U6TR

STMicroelectronics

STM32L100C6U6TR by STMicroelectronics

STM32L100C6U6TR by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 24 MHz. It features 2 DAC and 14 ADC channels, suitable for industrial applications requiring low power consumption and high performance. With a wide range of peripherals including USB, USART, and SPI connectivity options, it offers versatile solutions for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 8,545 parts In-Stock

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Digiode

USA . 3,929 parts In-Stock

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Vyrian

USA . 2,427 parts In-Stock

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Anansix

USA . 2,048 parts In-Stock

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AZTECH Wire

Italy . 101 parts In-Stock

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$13.120

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Microchip USA

USA . 4,610 parts In-Stock

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$24.693

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IDEA Electronic Components Group

UK . 249 parts In-Stock

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$55.696

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$50.126

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249

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MKK Technologies

India . 490 parts In-Stock

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$104.732

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DigiPath Technology Company

USA . 490 parts In-Stock

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$104.732

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Corphita

USA . 4,723 parts In-Stock

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Parana Technologies

USA . 478 parts In-Stock

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$66.593

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Overview

Unlock the power of innovation with the STM32L100C6U6TR microcontroller by STMicroelectronics. This cutting-edge device offers unmatched quality, reliability, and efficiency, making it ideal for a wide range of applications. With a 32-bit CPU, advanced peripherals, and low power consumption, this microcontroller delivers exceptional performance while minimizing energy usage. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, the STM32L100C6U6TR provides the perfect balance of features and value to bring your projects to life. Elevate your designs to the next level with STMicroelectronics' industry-leading technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for use in various applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy placement on the PCB.

Bit Size: 32

32-bit architecture provides high computational power and performance.

DAC Channels: YES

Digital-to-analog converters enable the microcontroller to interface with analog devices and sensors.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages offers flexibility in design and compatibility with various systems.

No. of Terminals: 48

A high number of terminals provide ample connectivity options for peripherals and external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles cater to different design requirements, providing options for heat dissipation and space-saving.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications where temperature variations are common.

CPU Family: CORTEX-M3

Based on the efficient Cortex-M3 architecture, offering high performance and energy efficiency.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, ideal for applications in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

ADC Channels: YES

Analog-to-digital converters enable the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: QUAD

Quad terminal position facilitates easy mounting and soldering on the PCB.

ROM Words: 32768

Large ROM size allows for storing firmware and program data.

Maximum Seated Height: 0.65 mm

Low seated height is ideal for applications with space constraints.

Digital To Analog Convertors: 2-Ch 12-Bit (2)

Dual 12-bit DACs provide accurate analog output for precise control and signal generation.

Width: 7 mm

Compact width allows for space-efficient PCB layout and integration into small form factor devices.

Data EEPROM Size: 2K

On-chip EEPROM memory provides non-volatile data storage for critical parameters and calibration values.

Peripherals: BOR, COMPARATOR(2), CRC, DMA(7), LCD, POR, PWM(4), RTC, TIMER(9), WDT(2)

A wide range of peripherals offer enhanced functionality and connectivity options for diverse applications.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperature for a sufficient amount of time during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable solder joints during assembly.

Length: 7 mm

Compact length suits applications with space constraints and small form factor designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and power efficiency, ideal for embedded applications.

RAM Bytes: 4096

Adequate RAM size for storing data and variables during program execution.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures reliability in solder joints.

Analog To Digital Convertors: 14-Ch 12-Bit

Multiple high-resolution ADC channels enable precise analog signal acquisition from various sensors and sources.

Maximum Supply Current: 11 mA

Low supply current consumption for efficient power management and extended battery life in portable applications.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance and operation of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels for controlling analog devices and motors with variable speed and precision.

Connectivity: I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Versatile connectivity options for interfacing with sensors, peripherals, and communication devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Speed: 32 rpm

Fast processing speed of 32 RPM for efficient execution of tasks and real-time applications.

On Chip Program ROM Width: 8

8-bit width for on-chip program ROM provides sufficient storage capacity for program code.

No. of I/O Lines: 37

Abundance of I/O lines for versatile interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32L100C6U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(7), LCD, POR, PWM(4), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit (2)

Trade Compliance

STM32L100C6U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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