Loading...

STM32L072KBU3TR

STMicroelectronics

STM32L072KBU3TR by STMicroelectronics

STM32L072KBU3TR from STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring a max supply voltage of 3.6V and operating temp range of -40 °C to 125 °C. It includes dual DACs, 10 ADC channels, and supports multiple connectivity options like I2C and SPI. With its low power consumption and compact design, it's perfect for energy-efficient embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,957

-

-

-

-

Digiode

USA . 1,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,390

-

-

-

-

Anansix

USA . 959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

959

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 972 parts In-Stock

1+ parts

$14.870

100+ parts

-

1k+ parts

-

10k+ parts

-

972

$14.870

-

-

-

Microchip USA

USA . 4,322 parts In-Stock

1+ parts

$23.356

100+ parts

-

1k+ parts

-

10k+ parts

-

4,322

$23.356

-

-

-

IDEA Electronic Components Group

UK . 1,219 parts In-Stock

1+ parts

$65.748

100+ parts

-

1k+ parts

$59.173

10k+ parts

-

1,219

$65.748

-

$59.173

-

MKK Technologies

India . 1,511 parts In-Stock

1+ parts

$123.634

100+ parts

-

1k+ parts

-

10k+ parts

-

1,511

$123.634

-

-

-

DigiPath Technology Company

USA . 1,511 parts In-Stock

1+ parts

$123.634

100+ parts

-

1k+ parts

-

10k+ parts

-

1,511

$123.634

-

-

-

Corphita

USA . 2,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,104

-

-

-

-

Parana Technologies

USA . 499 parts In-Stock

1+ parts

-

100+ parts

$78.612

1k+ parts

-

10k+ parts

-

499

-

$78.612

-

-

Overview

Unlock innovation with the STM32L072KBU3TR from STMicroelectronics, a powerhouse microcontroller designed for high-performance applications while ensuring energy efficiency. Its exceptional 32-bit architecture and versatile features make it ideal for smart devices, IoT solutions, and automotive systems. With ST's renowned commitment to quality and reliability, this microcontroller empowers engineers to bring their creative visions to life, driving faster development and enhanced functionality in various projects.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs and easy integration into various applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCB layouts, accommodating dense configurations.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and support advanced algorithms.

DAC Channels: YES

Integrated DAC channels provide the ability to produce analog signals, essential for many sensor applications.

No. of Terminals: 32

The 32 terminals allow for flexible connectivity and the implementation of multiple peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The slim profile and heat sink design enhances thermal management, critical for automotive environments.

Minimum Supply Voltage: 1.8 V

A low minimum supply voltage of 1.8 V supports energy-efficient designs, making it suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliable performance in harsh automotive environments.

CPU Family: CORTEX-M0

Based on the Cortex-M0 core, it provides low power consumption and efficient processing capabilities.

Minimum Operating Temperature: -40 °C

A wide temperature range enhances reliability for products used in extreme conditions.

ADC Channels: YES

Having ADC channels allows for precise digital representation of analog signals, essential for sensor interfacing.

DMA Channels: YES

DMA channels facilitate data transfer without CPU intervention, optimizing performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal arrangements provide better performance in signal integrity and ease of routing on PCBs.

ROM Words: 131072

A substantial ROM capacity allows for significant program storage, suitable for sophisticated applications.

Maximum Seated Height: 0.6 mm

The low seating height aids in reducing the overall footprint of the device on printed circuit boards.

Digital To Analog Converters: 2-Ch 12-Bit

These DACs enable high-resolution signal outputs, ideal for applications requiring precise control.

Width: 5 mm

A compact width enables integration into space-constrained electronic designs, enhancing versatility.

Data EEPROM Size: 6K

A dedicated EEPROM of 6K provides persistent data storage, necessary for retaining configuration settings.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Rich peripheral support enhances functionality, enabling versatile application designs for control and monitoring.

Maximum Clock Frequency: 32 MHz

The 32 MHz clock frequency ensures swift operation, catering to performance-sensitive applications.

Length: 5 mm

A compact length complements its width, ensuring optimal use of limited PCB space while maintaining performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring durability and reliability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture maximizes performance per watt, ideal for low-power and efficient applications.

No. of Timers: 8

Multiple timers enhance the device's capability for timed operations, essential for various control tasks.

RAM Bytes: 20480

Ample RAM allows for complex data handling, accommodating applications requiring significant computational power.

Technology: CMOS

CMOS technology ensures low power consumption, contributing to energy efficiency in designs.

Terminal Form: NO LEAD

No lead terminals reduce environmental impact and enhance soldering ease, promoting cleaner design practices.

Analog To Digital Converters: 10-Ch 12-Bit

The 10-channel ADCs support multiple analog inputs, allowing the microcontroller to interface with a variety of sensors.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V strikes a balance between performance and power efficiency for diverse applications.

No. of DMA Channels: 7

The availability of multiple DMA channels enhances data management capabilities, streamlining system performance.

PWM Channels: YES

PWM capabilities allow for precise control of motors and other components in various automation scenarios.

Connectivity: I2C(3), IRDA, PMBUS, SMBUS, SPI(4), UART, USART(3), USB

A wide array of connectivity options ensures compatibility with various devices and ease of integration into systems.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications of firmware, facilitating rapid development cycles.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density connections, beneficial in compact circuit designs.

Speed: 32 rpm

Speed capability is suitable for applications requiring responsive outputs, beneficial in automation.

On Chip Program ROM Width: 8

The 8-bit program ROM width supports efficient data handling and processing, optimizing performance.

No. of I/O Lines: 23

With 23 I/O lines, the microcontroller supports diverse interfacing needs, enhancing its versatility.

Technical Specifications

Microcontrollers STM32L072KBU3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

23

No. of Terminals:

32

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), IRDA, PMBUS, SMBUS, SPI(4), UART, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072KBU3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20