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STM32L071C8U6

STMicroelectronics

STM32L071C8U6 by STMicroelectronics

STM32L071C8U6 microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and supports up to 40 I/O lines. Ideal for low-power applications, it includes ADC and PWM channels for versatile control. Its compact design makes it suitable for space-constrained projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,887 parts In-Stock

1+ parts

-

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4,887

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Digiode

USA . 3,594 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,594

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Anansix

USA . 112 parts In-Stock

1+ parts

-

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112

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 9,968 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

-

10k+ parts

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9,968

$2.330

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AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$16.260

100+ parts

-

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304

$16.260

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Microchip USA

USA . 3,746 parts In-Stock

1+ parts

$18.642

100+ parts

-

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3,746

$18.642

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IDEA Electronic Components Group

UK . 1,479 parts In-Stock

1+ parts

$54.075

100+ parts

-

1k+ parts

$48.667

10k+ parts

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1,479

$54.075

-

$48.667

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MKK Technologies

India . 1,507 parts In-Stock

1+ parts

$101.684

100+ parts

-

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10k+ parts

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1,507

$101.684

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-

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DigiPath Technology Company

USA . 1,507 parts In-Stock

1+ parts

$101.684

100+ parts

-

1k+ parts

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10k+ parts

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1,507

$101.684

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Parana Technologies

USA . 2,008 parts In-Stock

1+ parts

-

100+ parts

$64.655

1k+ parts

-

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2,008

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$64.655

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Corphita

USA . 1,300 parts In-Stock

1+ parts

-

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1,300

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Overview

Unlock innovation with the STM32L071C8U6 microcontroller from STMicroelectronics, a leader in cutting-edge technology. This compact powerhouse excels in low-power applications, making it ideal for IoT devices, smart sensors, and wearable tech. Experience unmatched reliability and performance, ensuring your projects stand out. With seamless integration and versatile functionalities, elevate your designs while enjoying superior energy efficiency and enhanced user experiences.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for a compact footprint, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This voltage range ensures compatibility with various low-power systems and enhances battery life.

Package Shape: SQUARE

The square package shape facilitates efficient layout on PCBs, aiding in better thermal distribution.

Bit Size: 32

A 32-bit architecture provides high computational capability, allowing for complex applications and more memory addressing.

No. of Terminals: 48

With 48 terminals, this microcontroller supports a wide range of peripherals and functionalities for diverse applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile design aids in heat dissipation, making it suitable for high-performance applications.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage allows operation in ultra-low-power modes, extending battery lifespan in portable devices.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to process analog signals, which is essential for data acquisition applications.

DMA Channels: YES

DMA channels support efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers flexibility in PCB design and easier soldering processes.

Width: 7 mm

A width of 7 mm contributes to a compact design, freeing up space on the PCB for additional components.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz ensures fast processing speeds, enabling responsive applications.

Length: 7 mm

The length of 7 mm complements its width, providing a balanced and compact package for dense PCB layouts.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture allows for streamlined processing and efficient instruction execution, making it power-efficient.

Terminal Form: NO LEAD

The no-lead terminal form enhances design flexibility, reduces parasitic inductance, and improves electrical performance.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V fits well with most low-power systems, enhancing compatibility with other components.

PWM Channels: YES

The presence of PWM channels allows for precise control in applications like motor speed regulation and brightness control.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density layouts, enabling more functionality in smaller board spaces.

Speed: 32 rpm

The specified speed indicates potential application in motor control, providing options for robotics and automation.

No. of I/O Lines: 40

40 I/O lines provide ample connectivity for external devices, expanding the scope of possible applications.

Technical Specifications

Microcontrollers STM32L071C8U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

40

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L071C8U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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