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STM32L021G4U6

STMicroelectronics

STM32L021G4U6 by STMicroelectronics

STM32L021G4U6 microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 32 MHz clock speed. With 24 I/O lines and integrated ADC/DMA channels, it's ideal for low-power applications in IoT devices. Its compact design ensures efficient use in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,668 parts In-Stock

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4,668

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Vyrian

USA . 3,511 parts In-Stock

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3,511

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Anansix

USA . 746 parts In-Stock

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746

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Vigor

Singapore . 2,350 parts In-Stock

1+ parts

$1.270

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2,350

$1.270

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Microchip USA

USA . 4,355 parts In-Stock

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$10.437

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4,355

$10.437

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IDEA Electronic Components Group

UK . 1,566 parts In-Stock

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$14.607

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$13.146

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1,566

$14.607

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$13.146

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Component Stockers USA

USA . 7,801 parts In-Stock

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$19.180

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7,801

$19.180

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AZTECH Wire

Italy . 910 parts In-Stock

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$20.910

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910

$20.910

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MKK Technologies

India . 2,065 parts In-Stock

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$27.467

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$27.467

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DigiPath Technology Company

USA . 2,065 parts In-Stock

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$27.467

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$27.467

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QUARKTWIN TECHNOLOGY LTD

USA . 22,914 parts In-Stock

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Corphita

USA . 4,828 parts In-Stock

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4,828

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Parana Technologies

USA . 202 parts In-Stock

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$17.465

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$17.465

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Overview

Unlock the power of innovation with the STM32L021G4U6 microcontroller from STMicroelectronics, designed for ultra-low power applications. Renowned for its exceptional quality and reliability, this 32-bit powerhouse seamlessly integrates advanced features like multiple ADC and PWM channels in a compact, heat-dissipating package. Ideal for IoT devices, wearables, and smart sensors, it delivers unmatched efficiency and performance, empowering you to create tomorrow's cutting-edge solutions today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs and automated assembly processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications.

Package Shape: SQUARE

The square package shape provides uniform dimensions, making it suitable for space-constrained applications.

Bit Size: 32

A 32-bit architecture delivers enhanced processing power, enabling more complex computations and faster performance.

No. of Terminals: 28

With 28 terminals, this microcontroller offers ample connectivity options for multiple peripherals and I/O lines.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink design optimizes space while effectively managing thermal performance.

Minimum Supply Voltage: 1.8 V

Operating down to 1.8 V makes this microcontroller flexible for low-power battery-operated devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and ensures long-term reliability in performance.

ADC Channels: YES

Inclusion of ADC channels allows the microcontroller to interface with analog sensors, broadening its application range.

DMA Channels: YES

DMA channels improve data handling efficiency, enabling faster data transfers without CPU intervention.

Terminal Position: QUAD

Quad terminal position allows for more flexibility in layout design and enhances scalability in multi-device applications.

Width: 4 mm

A compact width of 4 mm is ideal for applications with limited space.

Maximum Clock Frequency: 32 MHz

The 32 MHz clock frequency provides sufficient processing speed for real-time applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern soldering techniques.

Length: 4 mm

The 4 mm length complements the compact design, making it an efficient choice for small electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from a simplified instruction set that enhances processing efficiency.

Terminal Form: NO LEAD

The no-lead design optimizes space and improves thermal performance while allowing for better electrical contact.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V makes it compatible with standard power supplies and lithium batteries.

PWM Channels: YES

PWM channels facilitate motor control and signal modulation, expanding its utility in various applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for denser packing, enabling a more compact PCB design.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for environments requiring standard handling precautions.

Speed: 32 rpm

This speed specification enhances the versatility of the microcontroller in motion control applications.

No. of I/O Lines: 24

Having 24 I/O lines ensures sufficient interfacing capabilities for connecting various devices and sensors.

Technical Specifications

Microcontrollers STM32L021G4U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

28

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

STM32L021G4U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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