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STM32L010R8T6TR

STMicroelectronics

STM32L010R8T6TR by STMicroelectronics

STM32L010R8T6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 32 MHz clock frequency. With 25 I/O lines and integrated ADC/DMA channels, it's ideal for low-power applications in IoT devices. Its compact flatpack design ensures efficient space utilization in embedded systems.

Median Price

$3.580

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,644 parts In-Stock

1+ parts

$3.580

100+ parts

$1.890

1k+ parts

$1.380

10k+ parts

$1.280

2,644

$3.580

$1.890

$1.380

$1.280

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,773 parts In-Stock

1+ parts

$2.375

100+ parts

-

1k+ parts

-

10k+ parts

-

2,773

$2.375

-

-

-

Vyrian

USA . 3,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,649

-

-

-

-

Anansix

USA . 1,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,884

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,474 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1,474

$2.250

-

-

-

Microchip USA

USA . 3,850 parts In-Stock

1+ parts

$10.399

100+ parts

-

1k+ parts

-

10k+ parts

-

3,850

$10.399

-

-

-

IDEA Electronic Components Group

UK . 887 parts In-Stock

1+ parts

$30.285

100+ parts

-

1k+ parts

$27.256

10k+ parts

-

887

$30.285

-

$27.256

-

MKK Technologies

India . 1,543 parts In-Stock

1+ parts

$56.948

100+ parts

-

1k+ parts

-

10k+ parts

-

1,543

$56.948

-

-

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DigiPath Technology Company

USA . 1,543 parts In-Stock

1+ parts

$56.948

100+ parts

-

1k+ parts

-

10k+ parts

-

1,543

$56.948

-

-

-

Parana Technologies

USA . 378 parts In-Stock

1+ parts

-

100+ parts

$36.210

1k+ parts

-

10k+ parts

-

378

-

$36.210

-

-

Overview

Unlock innovation with the STM32L010R8T6TR microcontroller from STMicroelectronics, a leader in quality and reliability. Designed for low-power applications, this versatile chip delivers exceptional performance while maximizing efficiency. Ideal for wearables, IoT devices, and sensor applications, it empowers developers to create smart solutions with ease. Enhance your projects with cutting-edge technology that combines value, flexibility, and effortless integration into your designs!

Feature Benefit Bullets

Surface Mount: YES

The surface mount configuration allows for compact design and easy integration into modern PCBs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is versatile and can be used in a range of battery-powered devices.

Package Shape: SQUARE

The square package shape provides efficient space utilization on PCBs, enhancing design flexibility.

Bit Size: 32

As a 32-bit microcontroller, it offers enhanced processing capabilities, allowing for more complex applications and faster performance.

No. of Terminals: 32

Having 32 terminals provides a good number of I/O options, making it suitable for various interfacing needs.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design minimizes height, allowing for effective use in slim devices and saving precious board space.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8 V allows operation in low-power applications, enabling energy-efficient designs.

ADC Channels: YES

The inclusion of ADC channels allows for direct interaction with analog signals, broadening application possibilities in sensor interfacing.

DMA Channels: YES

DMA channels enhance data transfer efficiency by allowing peripheral devices to communicate directly with memory, reducing CPU overhead.

Terminal Position: QUAD

The quad terminal positioning facilitates better soldering and improved connectivity, enhancing reliability in electronic assemblies.

Width: 7 mm

A compact width of 7 mm contributes to saving space without compromising performance, making it ideal for miniaturized devices.

Maximum Clock Frequency: 32 MHz

The maximum clock frequency of 32 MHz enables the microcontroller to execute instructions quickly, improving overall responsiveness.

Length: 7 mm

Like the width, the length of 7 mm ensures a small footprint, suitable for applications requiring compact component sizes.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller denotes a simplified instruction set, leading to lower power consumption and higher performance.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical strength and ease of soldering, contributing to long-lasting performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V makes this microcontroller compatible with common digital circuitry, enhancing interoperability.

PWM Channels: YES

Availability of PWM channels enables precise signal modulation, making this microcontroller ideal for motor control and other applications requiring variable outputs.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch is suitable for modern PCB designs, allowing for dense layouts and increased I/O density.

Speed: 32 rpm

The operational speed of 32 rpm indicates potential for low power and continuous operations in applications such as sensors and low-speed controls.

No. of I/O Lines: 25

With 25 I/O lines, this microcontroller provides ample opportunities for interfacing with various devices, sensors, and modules.

Technical Specifications

Microcontrollers STM32L010R8T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

25

No. of Terminals:

32

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L010R8T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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