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STM32H7B3QIY6QTR

STMicroelectronics

STM32H7B3QIY6QTR by STMicroelectronics

STM32H7B3QIY6QTR by STMicroelectronics is a 32-bit microcontroller with 3-Ch 12-Bit DAC and 17-Ch 16-Bit ADC channels. It operates at up to 50 MHz, has 18 timers, and supports various connectivity options like CAN, I2C, SPI, UART, USB. Ideal for industrial applications requiring low power mode and high-speed processing in a compact form factor of 4.37mm x 4.57mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,099 parts In-Stock

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7,099

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Digiode

USA . 1,994 parts In-Stock

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1,994

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Anansix

USA . 600 parts In-Stock

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600

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Nova Conductors

Japan . 66 parts In-Stock

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66

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Distributors (Availability)

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Ampacity Inc.

Singapore . 127 parts In-Stock

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$9.000

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127

$9.000

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AZTECH Wire

Italy . 258 parts In-Stock

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$9.606

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258

$9.606

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Semicontronic

India . 1,520 parts In-Stock

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$10.000

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$9.750

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$9.700

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$10.000

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$9.700

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$22.305

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$21.189

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$21.189

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$22.305

$21.189

$21.189

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Aztec Data Supply Inc.

USA . 203 parts In-Stock

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$48.620

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Corohmni

South Africa . 413 parts In-Stock

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$51.283

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413

$51.283

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IDEA Electronic Components Group

UK . 381 parts In-Stock

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$72.955

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$65.660

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381

$72.955

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$65.660

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MKK Technologies

India . 868 parts In-Stock

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$137.187

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868

$137.187

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DigiPath Technology Company

USA . 868 parts In-Stock

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$137.187

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868

$137.187

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Microchip USA

USA . 7,329 parts In-Stock

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Argo Parts USA

USA . 4,738 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,846 parts In-Stock

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Parana Technologies

USA . 1,874 parts In-Stock

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$87.229

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Vigor

Singapore . 1,250 parts In-Stock

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Continental Prestige Electronics

USA . 239 parts In-Stock

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239

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Unlock the potential of your next project with the STM32H7B3QIY6QTR microcontroller by STMicroelectronics. As a trusted leader in the industry, STMicroelectronics delivers top-quality products that guarantee reliability and performance. Ideal for a wide range of applications, this microcontroller offers advanced features and seamless integration to bring your ideas to life. Experience the value and benefits of cutting-edge technology with the STM32H7B3QIY6QTR, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the microcontroller, making it ideal for various applications.

Integrated Cache: YES

Enhances processing speed and efficiency by storing frequently accessed data for quick retrieval.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Offers a wide operating voltage range, making it compatible with different power sources.

On Chip Data RAM Width: 8

Provides ample space for data storage and processing, ensuring smooth operation of the microcontroller.

Address Bus Width: 10

Allows for efficient communication with other devices and peripherals by supporting a wide range of memory addresses.

Package Shape: RECTANGULAR

Offers a compact and space-saving design, ideal for applications where board real estate is limited.

Bit Size: 32

Provides a high level of processing power and data handling capability for demanding tasks.

DAC Channels: YES

Enables analog signal output, expanding the functionality of the microcontroller for diverse applications.

No. of Terminals: 132

Offers a high level of connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Ensures easy installation and excellent electrical performance in a compact form factor.

Minimum Supply Voltage: 1.62 V

Allows for operation in low-power scenarios, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Provides reliable performance even in high-temperature environments, ensuring durability and longevity.

CPU Family: STM32

Represents a reputable and well-established brand known for high-quality microcontrollers and robust performance.

Minimum Operating Temperature: -40 °C

Allows for operation in extremely cold environments, making it versatile for a wide range of applications.

ADC Channels: YES

Enables analog signal input, expanding the range of data that can be processed by the microcontroller.

DMA Channels: YES

Supports direct memory access for efficient data transfer, improving overall system performance.

Terminal Position: BOTTOM

Facilitates easy and convenient connectivity with other components on the circuit board.

ROM Words: 2097152

Offers ample storage space for program code, data, and configurations, accommodating complex applications.

Maximum Seated Height: 0.58 mm

Features a low profile design, ideal for applications with height restrictions.

Digital To Analog Convertors: 3-Ch 12-Bit

Enables precise conversion of digital signals to analog output, ensuring accurate control of external devices.

RAM Words: 1413120

Provides sufficient memory for temporary data storage during operation, enhancing the processing capabilities of the microcontroller.

Width: 4.37 mm

Offers a compact form factor, allowing for easy integration into various electronic devices and systems.

Boundary Scan: YES

Facilitates testing and debugging of the microcontroller during production, ensuring high quality and reliability.

External Data Bus Width: 16

Supports efficient data transfer with external devices, increasing system performance and responsiveness.

Peripherals: BOR, COMPARATOR(2), DMA(5), POR, RTC, TIMER(17), WDT(2)

Offers a wide range of integrated peripherals for enhanced functionality and versatility in different applications.

Maximum Clock Frequency: 50 MHz

Provides high-speed processing capabilities, suitable for real-time applications and tasks requiring quick response times.

Length: 4.57 mm

Features a compact and space-saving design, ideal for applications with limited board space.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a high-performance RISC architecture for efficient processing and execution of commands.

No. of Timers: 18

Offers multiple timer channels for precise timing control and synchronization in various applications.

Technology: CMOS

Employs CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: BALL

Uses ball terminals for reliable and secure connections, ensuring stable operation in rugged conditions.

Analog To Digital Convertors: 17-Ch 16-Bit

Enables accurate conversion of analog signals into digital data, supporting a wide range of sensor inputs and control applications.

Nominal Supply Voltage: 3.3 V

Specifies the standard voltage level for optimal performance and compatibility with power sources.

No. of DMA Channels: 5

Supports multiple DMA channels for efficient data handling and transfer, improving overall system performance.

PWM Channels: YES

Provides pulse-width modulation channels for precise control of digital signals and motor speed, enhancing functionality for various applications.

Connectivity: CAN(2), I2C(4), I2S(4), LPUART, SAI(2), SPI(5), SDMMC(2), SWPMI, UART(5), USART(5), USB

Offers a wide range of connectivity options for interfacing with different devices, expanding compatibility and flexibility.

ROM Programmability: FLASH

Uses flash memory for flexible and easy programmability, allowing for quick updates and modifications to the firmware.

Terminal Pitch: 0.35 mm

Specifies the pitch distance between terminals, facilitating easy soldering and connection to the circuit board.

Format: FIXED POINT

Utilizes fixed-point arithmetic for efficient computation and accurate data processing, suitable for a wide range of applications.

Speed: 280 rpm

Provides high-speed performance for data processing and communication tasks, ensuring responsiveness and efficiency.

Low Power Mode: YES

Supports low-power modes for energy-efficient operation, ideal for battery-powered devices and applications.

On Chip Program ROM Width: 8

Specifies the width of the on-chip program ROM, offering ample space for storing program code and data.

No. of I/O Lines: 87

Provides a high number of input/output lines for versatile connectivity and interfacing options with external devices and peripherals.

Technical Specifications

Microcontrollers STM32H7B3QIY6QTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

10

Bit Size:

32

Boundary Scan:

YES

CPU Family:

STM32

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B132

Length:

4.57 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

87

No. of Terminals:

132

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,11X12,14

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Words:

1413120

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.58 mm

Speed:

280 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Width:

4.37 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(4), LPUART, SAI(2), SPI(5), SDMMC(2), SWPMI, UART(5), USART(5), USB

Peripherals:

BOR, COMPARATOR(2), DMA(5), POR, RTC, TIMER(17), WDT(2)

Analog To Digital Convertors:

17-Ch 16-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

STM32H7B3QIY6QTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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