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STM32G0C1REI6N

STMicroelectronics

STM32G0C1REI6N by STMicroelectronics

STM32G0C1REI6N microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 17 ADC channels. Ideal for industrial applications, it supports low power modes and extensive connectivity options. With a compact design and high performance, it's perfect for embedded systems.

Median Price

$5.330

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 200 parts In-Stock

1+ parts

$5.330

100+ parts

$3.409

1k+ parts

$3.063

10k+ parts

$2.976

200

$5.330

$3.409

$3.063

$2.976

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,251

-

-

-

-

Digiode

USA . 4,617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,617

-

-

-

-

Anansix

USA . 2,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,699

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,100 parts In-Stock

1+ parts

$15.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

$15.780

-

-

-

IDEA Electronic Components Group

UK . 2,229 parts In-Stock

1+ parts

$20.268

100+ parts

-

1k+ parts

$18.241

10k+ parts

-

2,229

$20.268

-

$18.241

-

MKK Technologies

India . 224 parts In-Stock

1+ parts

$38.112

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$38.112

-

-

-

DigiPath Technology Company

USA . 224 parts In-Stock

1+ parts

$38.112

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$38.112

-

-

-

Corphita

USA . 4,511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,511

-

-

-

-

Parana Technologies

USA . 795 parts In-Stock

1+ parts

-

100+ parts

$24.233

1k+ parts

-

10k+ parts

-

795

-

$24.233

-

-

Overview

Unlock the potential of your projects with the STM32G0C1REI6N microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. Engineered for versatility and efficiency, this 32-bit powerhouse excels across diverse applications—from industrial automation to smart home devices. Experience exceptional performance, low power consumption, and robust connectivity that empowers you to create smarter solutions, ensuring reliability and longevity in every design. Embrace quality and drive your success forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, essential for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This voltage range ensures compatibility with common power supplies and battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit data width supports a variety of applications, facilitating efficient data processing.

Package Shape: SQUARE

The square shape is optimal for consistent thermal and electrical performance across the chip.

Bit Size: 32

A 32-bit architecture enhances processing power and enables handling of complex calculations efficiently.

DAC Channels: YES

The inclusion of DAC channels allows for better analog signal processing, vital for applications like audio or control systems.

No. of Terminals: 64

More terminals provide flexibility in interfacing with multiple peripherals, expanding the microcontroller's capabilities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style promotes efficient thermal dissipation and reduces overall footprint on the PCB.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage helps in deploying the microcontroller in low-power applications.

Maximum Operating Temperature: 85 °C

This high temperature rating makes it suitable for industrial applications where equipment can be subjected to extreme conditions.

CPU Family: CORTEX-M0

The ARM Cortex-M0 core offers high performance and low energy consumption, making it ideal for embedded system applications.

Minimum Operating Temperature: -40 °C

Capability to operate at low temperatures increases the reliability of the product in harsh environmental conditions.

ADC Channels: YES

Having ADC channels enables precise analog signal measurement, crucial for data acquisition applications.

DMA Channels: YES

Direct Memory Access channels allow for faster data transfers, reducing CPU load and improving system efficiency.

Terminal Position: BOTTOM

Bottom terminal positioning is beneficial for routing in PCB design, optimizing space and connectivity.

ROM Words: 524288

A substantial number of ROM words provides ample space for application programming, allowing for complex software implementations.

Maximum Seated Height: 0.6 mm

A low seated height is ideal for compact devices, ensuring a thin profile suitable for mobile applications.

Digital To Analog Convertors: 2-Ch 12-Bit

High bit resolution in DACs allows for precise control in applications requiring high-quality analog output.

Width: 5 mm

This compact width makes the microcontroller suitable for space-sensitive designs.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

A rich peripheral set enhances functionality, allowing for versatile applications in control and automation.

Maximum Clock Frequency: 48 MHz

The higher clock frequency provides improved processing speed, essential for time-sensitive applications.

Length: 5 mm

Compact length enables the microcontroller to fit into smaller devices while maintaining high performance.

Temperature Grade: INDUSTRIAL

Industrial grade components are designed to withstand challenging environments, ensuring long-term reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for efficient instruction execution, optimizing performance and power usage.

No. of Timers: 14

Multiple timers enable precise timing control for various functions like event-driven operations and pulse generation.

RAM Bytes: 147456

A significant amount of RAM supports complex operations and multiple concurrent tasks, enhancing multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, which is critical in embedded designs.

Terminal Form: BALL

Ball grid array (BGA) provides excellent thermal and electrical performance while optimizing space on the PCB.

Analog To Digital Convertors: 17-Ch 12-Bit

Having numerous ADC channels with high resolution is ideal for applications that require detailed analog signal analysis.

Maximum Supply Current: 9.4 mA

Low supply current promotes energy efficiency, making it suitable for battery-powered devices.

Nominal Supply Voltage: 3 V

A standard nominal voltage simplifies design and integration with existing systems.

No. of DMA Channels: 12

With multiple DMA channels, the microcontroller can handle several simultaneous data transfers efficiently.

No. of Serial I/Os: 8

Multiple serial interfaces increase communication options with other devices, improving system integration.

PWM Channels: YES

Pulse Width Modulation (PWM) capabilities enable efficient motor control and other applications requiring variable output.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options ensure compatibility with a wide range of devices and systems.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, making it adaptable for different applications.

Terminal Pitch: 0.5 mm

A fine terminal pitch is advantageous for high-density PCB designs, maximizing component placement.

Format: FIXED POINT

A fixed point format offers predictable performance in digital signal processing applications.

Speed: 64 rpm

Designed for low-speed applications, this feature is suitable for specific control systems and low-speed motors.

Low Power Mode: YES

Low power mode enhances battery life in portable applications, proving its efficiency in energy management.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates effective programming and data handling, enhancing processing capabilities.

No. of I/O Lines: 58

A large number of I/O lines allows for extensive interfacing options with other components in a system.

Technical Specifications

Microcontrollers STM32G0C1REI6N attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

0

No. of I/O Lines:

58

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

9.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0C1REI6N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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