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STM32G0C1RCI6NTR

STMicroelectronics

STM32G0C1RCI6NTR by STMicroelectronics

STM32G0C1RCI6NTR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 17 ADC channels. Ideal for industrial applications, it supports various connectivity options like CAN and USB. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,333 parts In-Stock

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2,333

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Vyrian

USA . 2,099 parts In-Stock

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2,099

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Digiode

USA . 1,355 parts In-Stock

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1,355

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Distributors (Availability)

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AZTECH Wire

Italy . 310 parts In-Stock

1+ parts

$14.470

100+ parts

-

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310

$14.470

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IDEA Electronic Components Group

UK . 292 parts In-Stock

1+ parts

$54.067

100+ parts

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$48.661

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292

$54.067

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$48.661

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MKK Technologies

India . 1,986 parts In-Stock

1+ parts

$101.670

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1,986

$101.670

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DigiPath Technology Company

USA . 1,986 parts In-Stock

1+ parts

$101.670

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1,986

$101.670

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Corphita

USA . 1,905 parts In-Stock

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1,905

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Parana Technologies

USA . 1,091 parts In-Stock

1+ parts

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$64.646

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1,091

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$64.646

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Overview

Elevate your projects with the STM32G0C1RCI6NTR microcontroller from STMicroelectronics—an industry leader in semiconductor solutions. With its robust 32-bit Cortex-M0 architecture, this versatile device combines exceptional performance with energy efficiency, making it ideal for a wide range of applications from industrial automation to consumer electronics. Experience reduced time-to-market, reliability, and an extensive ecosystem that empowers developers to innovate effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material enhances reliability and eases integration in various applications.

Surface Mount: YES

Allows for compact designs and easier assembly on PCBs, making it suitable for modern electronic applications.

Maximum Supply Voltage: 3.6 V

Flexibility in voltage compatibility with existing low-power designs ensures efficient operation.

On Chip Data RAM Width: 8

8-bit RAM width optimizes data handling for a range of applications while maintaining simplicity in processing.

Package Shape: SQUARE

The square form factor aids in effective use of PCB space and supports uniform component layouts.

Bit Size: 32

A 32-bit architecture provides enhanced processing power, allowing for more complex applications and tasks.

DAC Channels: YES

Includes digital-to-analog conversion, making it suitable for audio and signal processing applications.

No. of Terminals: 64

64 terminals provide multiple I/O options, offering versatility for diverse interfacing and control needs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch contribute to high-density packing, essential for space-constrained applications.

Minimum Supply Voltage: 1.7 V

Low minimum voltage allows for energy efficiency and extended battery life in portable devices.

Maximum Operating Temperature: 85 °C

High temperature tolerance enables reliable performance in industrial and harsh environments.

CPU Family: CORTEX-M0

This efficient CPU family ensures low power consumption while providing adequate performance for most applications.

Minimum Operating Temperature: -40 °C

Wide temperature range supports operation in demanding conditions, making it ideal for automotive and outdoor applications.

ADC Channels: YES

Integrated ADC channels facilitate seamless sensor interfacing, enhancing the microcontroller's adaptability.

DMA Channels: YES

DMA support boosts data transfer rates by offloading CPU, improving overall system efficiency.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies component assembly and enhances thermal management on the PCB.

ROM Words: 262144

A significant ROM size accommodates ample firmware, essential for complex application requirements.

Maximum Seated Height: 0.6 mm

Compact height allows for low-profile designs, perfect for portable and space-sensitive applications.

Digital To Analog Converters: 2-Ch 12-Bit

High precision DACs enable accurate signal representation, important for audio and control applications.

Width: 5 mm

The small width contributes to compact designs, facilitating integration into limited spaces.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

An extensive peripheral set enhances functionality, allowing varied applications from timing to power management.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz balances processing power with power consumption, suitable for most embedded tasks.

Length: 5 mm

Short length allows for integration into compact devices while maintaining a robust connectivity framework.

Temperature Grade: INDUSTRIAL

Industrial grade components ensure reliability and durability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient instruction execution and improves performance over complex architectures.

No. of Timers: 14

Multiple timers facilitate advanced timing control, essential for managing various tasks within embedded systems.

RAM Bytes: 147456

Ample RAM allows for efficient data handling and smoother operation of complex applications.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form ensures reliable solder connections while enabling effective heat dissipation.

Analog To Digital Converters: 17-Ch 12-Bit

High-channel ADCs provide the capacity to connect multiple sensors, enhancing application versatility.

Maximum Supply Current: 9.4 mA

Low supply current improves power efficiency, especially critical for battery-powered applications.

Nominal Supply Voltage: 3 V

Standard nominal voltage aligns with many common power supplies, simplifying design integration.

No. of DMA Channels: 12

Numerous DMA channels support extensive data handling, crucial for high-performance operations.

No. of Serial I/Os: 8

Eight serial I/O lines bolster communication capability, enabling interoperability with various devices.

PWM Channels: YES

PWM support allows for motor control and other applications requiring variable signal generation.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

A diverse array of connectivity options ensures broad compatibility and integration with existing systems.

ROM Programmability: FLASH

Flash programmability simplifies updates and alterations, enhancing long-term utility of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density applications, maximizing PCB space usage.

Format: FIXED POINT

Fixed point format supports efficient numerical calculations essential for many embedded applications.

Speed: 64 rpm

Provides adequate speed for various low to moderate speed applications such as motor control.

Low Power Mode: YES

The availability of low power modes significantly enhances battery life for portable devices.

On Chip Program ROM Width: 8

An 8-bit ROM width complements a range of applications, ensuring optimal data processing efficiency.

No. of I/O Lines: 58

A high number of I/O lines supports extensive interfacing options, making it ideal for complex systems.

Technical Specifications

Microcontrollers STM32G0C1RCI6NTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

0

No. of I/O Lines:

58

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

9.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0C1RCI6NTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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