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STM32G0C1MCT6

STMicroelectronics

STM32G0C1MCT6 by STMicroelectronics

STM32G0C1MCT6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 19 ADC channels. Ideal for industrial applications, it supports low power modes and offers extensive connectivity options. With a compact design and robust performance, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,105 parts In-Stock

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Digiode

USA . 1,968 parts In-Stock

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1,968

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Anansix

USA . 503 parts In-Stock

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503

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Distributors (Availability)

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AZTECH Wire

Italy . 426 parts In-Stock

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$18.160

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426

$18.160

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Microchip USA

USA . 4,944 parts In-Stock

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$28.737

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4,944

$28.737

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IDEA Electronic Components Group

UK . 2,143 parts In-Stock

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$29.284

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$26.355

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2,143

$29.284

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MKK Technologies

India . 713 parts In-Stock

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$55.066

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713

$55.066

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DigiPath Technology Company

USA . 713 parts In-Stock

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$55.066

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713

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Component Stockers USA

USA . 1,389 parts In-Stock

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$59.540

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Parana Technologies

USA . 2,008 parts In-Stock

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$35.013

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$35.013

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Corphita

USA . 565 parts In-Stock

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Overview

Elevate your projects with the STM32G0C1MCT6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this powerful 32-bit MCU supports a wide range of applications—from industrial automation to consumer electronics—offering exceptional performance at low power consumption. Enjoy seamless connectivity and robust features that streamline development while delivering reliability you can trust. Choose STMicroelectronics for unmatched value and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the microcontroller lightweight and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V makes the microcontroller compatible with low-power applications.

On Chip Data RAM Width: 8

The 8-bit wide on-chip data RAM facilitates easy data handling in various applications.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts, allowing for more components in smaller areas.

Bit Size: 32

A 32-bit architecture provides high performance and is suitable for complex applications requiring more processing power.

DAC Channels: YES

The presence of DAC channels allows for high-quality analog signal generation, enhancing functionality.

No. of Terminals: 80

With 80 terminals, this microcontroller offers extensive connectivity options for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style enhances the design flexibility, making it suitable for low-profile applications.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows for applications in battery-powered devices, improving energy efficiency.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C makes this microcontroller suitable for industrial applications where high temperatures may occur.

CPU Family: CORTEX-M0

The Cortex-M0 family offers energy-efficient performance and compatibility with a wide range of software ecosystems.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is ideal for harsh environmental conditions.

ADC Channels: YES

The presence of ADC channels allows for precise digital representation of analog signals, making it versatile for sensor applications.

DMA Channels: YES

DMA channels enable efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal position enhances the robustness of connections on the PCB, ensuring better electrical performance.

ROM Words: 262144

A substantial ROM size allows for the storage of complex programs, contributing to powerful applications.

Maximum Seated Height: 1.6 mm

A low seated height makes this microcontroller suitable for compact devices where space is a constraint.

Digital To Analog Converters: 2-Ch 12-Bit

12-bit resolution in DACs allows for more precise analog output, enhancing the fidelity of signals.

Width: 12 mm

The compact width enables integration into space-constrained designs while maintaining performance.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

A rich set of peripherals enhances the microcontroller’s capabilities, making it suitable for a wide range of applications.

Maximum Clock Frequency: 48 MHz

With a maximum clock frequency of 48 MHz, this microcontroller can handle fast processing tasks efficiently.

Length: 12 mm

Compact length facilitates easy integration into tight spaces while providing a complete solution.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller provides efficient instruction processing, improving performance.

No. of Timers: 14

A large number of timers allows for multiple timing operations, enhancing functionality in applications.

RAM Bytes: 147456

Substantial RAM ensures that the microcontroller can handle large data while executing complex programs.

Technology: CMOS

CMOS technology ensures low power consumption, making the microcontroller suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form provides reliability in surface-mount technology, ensuring stable connections.

Analog To Digital Converters: 19-Ch 12-Bit

With 19 channels of 12-bit ADCs, this microcontroller can monitor and interact with multiple analog signals simultaneously.

Maximum Supply Current: 9.4 mA

The low maximum supply current ensures efficient operation, prolonging battery life in portable applications.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V fits well within common low-power design requirements.

No. of DMA Channels: 12

Having 12 DMA channels significantly enhances data transfer capabilities, boosting system performance.

No. of Serial I/Os: 8

With 8 serial I/O lines, this microcontroller supports various communication protocols, enhancing connectivity.

PWM Channels: YES

PWM channels enable the control of motors and other devices, making it versatile for various applications.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options ensure that the microcontroller can interface with a wide array of devices and networks.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware, enhancing usability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density layouts, making it suitable for intricate designs.

Format: FIXED POINT

Fixed point format helps simplify mathematical computations, easing development for critical real-time applications.

Speed: 64 rpm

Speed capability allows efficient processing for applications that require lower operational speeds.

Low Power Mode: YES

Low power mode ensures that the microcontroller can conserve energy during inactive periods, vital for battery-powered devices.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM facilitates efficient storage and retrieval of code.

No. of I/O Lines: 74

74 I/O lines provide ample connection points for peripherals, sensors, and actuators, expanding its utility.

Technical Specifications

Microcontrollers STM32G0C1MCT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

8

No. of Terminals:

80

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

9.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

19-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0C1MCT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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