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STM32G0B1VBT7

STMicroelectronics

STM32G0B1VBT7 by STMicroelectronics

STM32G0B1VBT7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for industrial applications, it supports various connectivity options like CAN and USB. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,534 parts In-Stock

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4,534

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Digiode

USA . 3,246 parts In-Stock

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3,246

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Anansix

USA . 2,528 parts In-Stock

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2,528

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Distributors (Availability)

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Microchip USA

USA . 3,234 parts In-Stock

1+ parts

$14.583

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-

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3,234

$14.583

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AZTECH Wire

Italy . 1,197 parts In-Stock

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$16.060

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1,197

$16.060

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IDEA Electronic Components Group

UK . 1,089 parts In-Stock

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$44.144

100+ parts

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$39.730

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1,089

$44.144

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$39.730

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MKK Technologies

India . 1,512 parts In-Stock

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$83.011

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1,512

$83.011

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DigiPath Technology Company

USA . 1,512 parts In-Stock

1+ parts

$83.011

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1,512

$83.011

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Corphita

USA . 4,255 parts In-Stock

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4,255

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Parana Technologies

USA . 801 parts In-Stock

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$52.781

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801

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$52.781

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Overview

Unlock limitless possibilities with the STM32G0B1VBT7 microcontroller from STMicroelectronics, renowned for its commitment to quality and innovation. This versatile, low-power solution is perfect for a variety of applications, from industrial automation to IoT devices. With built-in connectivity options and robust performance, it empowers developers to create smart, efficient products that stand out in today’s competitive market, enhancing user experiences while driving business success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable body material ensures reliability and longevity in various applications.

Integrated Cache: YES

Integrated cache improves data access speed, enhancing overall performance of the microcontroller.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration onto PCBs.

Maximum Supply Voltage: 3.6 V

Supports flexible power supply designs suitable for a wide range of applications.

On Chip Data RAM Width: 8

An 8-bit RAM width enables efficient processing for common data sizes.

Package Shape: SQUARE

Square package shape contributes to efficient space usage on circuit boards.

Bit Size: 32

32-bit architecture allows for more complex computations and improved processing capabilities.

DAC Channels: YES

Built-in Digital-to-Analog Convertors enable easier audio and signal processing applications.

No. of Terminals: 100

A higher number of terminals provides extensive connectivity options for peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile design aids in compact assembly and effective thermal management.

Minimum Supply Voltage: 1.7 V

Low minimum voltage requirement ensures operation in low-power applications.

Maximum Operating Temperature: 105 °C

High operating temperature tolerance makes it suitable for industrial applications.

CPU Family: CORTEX-M0

Cortex-M0 core is energy-efficient, making it well-suited for battery-powered devices.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the microcontroller to perform reliably in harsh environments.

ADC Channels: YES

Integrated Analog-to-Digital Convertors simplify sensor data acquisition.

DMA Channels: YES

Direct Memory Access support minimizes CPU load, enhancing processing efficiency.

Terminal Position: QUAD

Quad terminal positioning allows efficient routing in designs and better performance.

ROM Words: 131072

Large ROM capacity supports extensive firmware or application storage.

Maximum Seated Height: 1.6 mm

Compact seated height enhances compatibility with low-profile applications.

Digital To Analog Convertors: 2-Ch 12-Bit

With 12-bit resolution, offers high-quality signal performance for various applications.

Width: 4 mm

Compact width supports space-constrained designs.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Rich peripheral set enhances versatility, making it suitable for various projects.

Maximum Clock Frequency: 48 MHz

Provides sufficient processing speed for a range of applications.

Length: 14 mm

Compact length facilitates integration into smaller devices.

Temperature Grade: INDUSTRIAL

Designed for industrial grade applications, ensuring durability and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing efficiency, making it ideal for embedded applications.

No. of Timers: 13

Multiple timers provide flexibility for time-based operations and event management.

RAM Bytes: 147456

Significant RAM capacity supports complex applications and multitasking.

Technology: CMOS

CMOS technology ensures low power consumption, ideal for energy-conscious designs.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and handling during PCB assembly.

Analog To Digital Convertors: 16-Ch 12-Bit

16-channel ADC provides high-resolution inputs for diverse sensor applications.

Maximum Supply Current: 100 mA

Limited supply current ensures low thermal output, enhancing device longevity.

Nominal Supply Voltage: 3 V

Nominal voltage aligns with standard low-voltage systems, simplifying power supply design.

No. of DMA Channels: 12

A high number of DMA channels boosts data transfer efficiency, improving overall system performance.

No. of Serial I/Os: 10

Offers numerous serial interfaces for effective communication with various devices.

PWM Channels: YES

Pulse Width Modulation capability enables control of motors and other actuators.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options increase versatility in communication protocols.

ROM Programmability: FLASH

Flash programmable ROM simplifies firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density designs and maximization of PCB real estate.

Format: FIXED-POINT

Fixed-point format suits applications requiring precise numerical calculations without floating-point overhead.

Speed: 64 rpm

Adequate speed rating supports a variety of low-speed, high-torque applications.

Low Power Mode: YES

Low power mode extends battery life in portable applications, enhancing usability.

On Chip Program ROM Width: 8

An 8-bit ROM width optimizes data handling for embedded applications.

No. of I/O Lines: 94

A large number of I/O lines supports rich interfacing capabilities for diverse sensors and actuators.

Technical Specifications

Microcontrollers STM32G0B1VBT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

94

No. of Serial I/Os:

10

No. of Terminals:

100

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1VBT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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