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STM32G0B1RBI3N

STMicroelectronics

STM32G0B1RBI3N by STMicroelectronics

STM32G0B1RBI3N by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU, 48 MHz clock frequency, and 147456 bytes of RAM. Ideal for automotive applications, it features 13 timers, CAN/I2C/SPI connectivity, and low power mode for efficient operation. With integrated cache and DAC/ADC channels, this microcontroller offers high performance in a compact package.

Median Price

$4.540

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$4.540

100+ parts

-

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450

$4.540

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Digiode

USA . 3,017 parts In-Stock

1+ parts

-

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3,017

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Vyrian

USA . 2,321 parts In-Stock

1+ parts

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2,321

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Anansix

USA . 303 parts In-Stock

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303

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.540

100+ parts

$4.449

1k+ parts

-

10k+ parts

-

1,000

$4.540

$4.449

-

-

Continental Prestige Electronics

USA . 770 parts In-Stock

1+ parts

$4.540

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-

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-

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$4.449

770

$4.540

-

-

$4.449

Ampacity Inc.

Singapore . 1,437 parts In-Stock

1+ parts

$8.000

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-

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1,437

$8.000

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AZTECH Wire

Italy . 775 parts In-Stock

1+ parts

$16.384

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775

$16.384

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Microchip USA

USA . 7,225 parts In-Stock

1+ parts

$23.916

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7,225

$23.916

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IDEA Electronic Components Group

UK . 1,449 parts In-Stock

1+ parts

$56.961

100+ parts

-

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$51.265

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1,449

$56.961

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$51.265

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MKK Technologies

India . 471 parts In-Stock

1+ parts

$107.111

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471

$107.111

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DigiPath Technology Company

USA . 471 parts In-Stock

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$107.111

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471

$107.111

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Argo Parts USA

USA . 5,369 parts In-Stock

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5,369

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Parana Technologies

USA . 1,845 parts In-Stock

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$68.105

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1,845

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$68.105

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Corphita

USA . 1,814 parts In-Stock

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1,814

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Overview

Unlock the potential of your electronic projects with the STM32G0B1RBI3N microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics has crafted a powerful microcontroller that offers seamless integration and advanced performance. Ideal for a wide range of applications, this microcontroller boasts integrated cache, multiple ADC channels, DAC channels, and a variety of peripherals. With a low power mode, maximum clock frequency of 48 MHz, and a wide operating temperature range, this microcontroller delivers exceptional value to customers seeking reliability and efficiency in their designs. Elevate your next project with the STM32G0B1RBI3N microcontroller from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection to the microcontroller, making it ideal for use in various environments.

Integrated Cache: YES

Integrated cache helps in improving the speed and efficiency of the microcontroller by storing frequently accessed data, enhancing the overall performance.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows the microcontroller to be compatible with a wide range of power sources, increasing its versatility for different applications.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and higher data precision, making the microcontroller suitable for complex tasks and calculations.

DAC Channels: YES

Digital-to-Analog Convertor channels enable the microcontroller to convert digital signals into analog outputs, facilitating interfacing with external analog devices.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the microcontroller to operate in harsh environments or extreme conditions without compromising on performance or reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller enables faster execution of instructions, efficient use of resources, and streamlined processing, making it a preferred choice for high-performance applications.

Maximum Clock Frequency: 48 MHz

High clock frequency enables the microcontroller to execute instructions at a faster rate, ensuring quick response times and enhanced overall performance.

Analog To Digital Convertors: 14-Ch 12-Bit

Multiple Analog-to-Digital Convertor channels with 12-bit resolution provide accurate conversion of analog signals to digital data, enabling precise measurements and sensor interfacing.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Versatile connectivity options such as CAN, I2C, SPI, and USB make the microcontroller compatible with a wide range of devices and peripherals, enhancing its flexibility and usability.

Technical Specifications

Microcontrollers STM32G0B1RBI3N attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

58

No. of Serial I/Os:

10

No. of Terminals:

64

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1RBI3N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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