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STM32G0B1KEU7

STMicroelectronics

STM32G0B1KEU7 by STMicroelectronics

STM32G0B1KEU7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 105 °C, and supports up to 48 MHz clock speed. It includes integrated DAC and ADC channels for versatile applications. Ideal for industrial automation and IoT devices, it offers low power modes and extensive connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,239 parts In-Stock

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7,239

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Anansix

USA . 2,349 parts In-Stock

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2,349

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Digiode

USA . 659 parts In-Stock

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659

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,068 parts In-Stock

1+ parts

$20.860

100+ parts

-

1k+ parts

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1,068

$20.860

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Microchip USA

USA . 4,518 parts In-Stock

1+ parts

$25.150

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4,518

$25.150

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IDEA Electronic Components Group

UK . 123 parts In-Stock

1+ parts

$38.391

100+ parts

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$34.552

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123

$38.391

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$34.552

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MKK Technologies

India . 1,067 parts In-Stock

1+ parts

$72.191

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1,067

$72.191

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DigiPath Technology Company

USA . 1,067 parts In-Stock

1+ parts

$72.191

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1,067

$72.191

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Corphita

USA . 3,489 parts In-Stock

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3,489

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Parana Technologies

USA . 1,059 parts In-Stock

1+ parts

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$45.902

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1,059

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$45.902

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Overview

Unlock your project's potential with the STM32G0B1KEU7 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for diverse applications, this compact powerhouse combines energy efficiency with robust performance to drive your designs forward. Its versatility ensures seamless integration into industrial automation, consumer electronics, and IoT devices, delivering exceptional value and reliability that keeps you ahead of the competition. Experience the difference with STMicroelectronics – where excellence meets innovation.

Feature Benefit Bullets

Integrated Cache: YES

The inclusion of an integrated cache enhances the microcontroller's performance by improving data access speed, making it suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount technology allows for a compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V enables compatibility with a wide range of power sources while maintaining low power consumption.

On Chip Data RAM Width: 8

An 8-bit RAM width allows efficient data manipulation and processing, aiding in complex calculations without significant overhead.

Package Shape: SQUARE

The square package shape allows for a more efficient layout on a PCB, optimizing space and signal integrity.

Bit Size: 32

A 32-bit architecture provides greater processing power and the ability to handle larger data types and instructions, improving overall performance.

DAC Channels: YES

With Digital-to-Analog converters integrated, this microcontroller can easily interface with analog devices, making it versatile for various applications.

No. of Terminals: 32

Having 32 terminals offers sufficient connectivity options for interfacing with multiple peripherals and sensors, enhancing its utility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style supports better thermal management, making it suitable for high-performance applications while also providing a thin form factor.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage allows the microcontroller to operate in low power environments, extending battery life for portable applications.

Maximum Operating Temperature: 105 °C

This temperature rating makes the microcontroller suitable for industrial applications, ensuring reliability in higher temperature settings.

CPU Family: CORTEX-M0

Based on the power-efficient ARM Cortex-M0 architecture, this microcontroller delivers a balance of performance and low power consumption.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes it ideal for harsh environments, ensuring reliability in extreme conditions.

ADC Channels: YES

The presence of Analog-to-Digital converters allows for precise measurement of analog signals, making it suitable for sensor interfacing.

DMA Channels: YES

DMA channels enable efficient data transfers without CPU intervention, improving overall system performance and responsiveness.

Terminal Position: QUAD

The quad terminal position facilitates easier PCB routing and assembly, ensuring reliable connections.

ROM Words: 524288

With 524288 ROM words, there is ample space to store complex programs and firmware, suitable for elaborate applications.

Maximum Seated Height: 0.6 mm

A low seated height allows for fitment in tight spaces, making it versatile for various compact electronic designs.

Digital To Analog Convertors: 2-Ch 12-Bit

12-bit resolution for the DAC channels allows for precise control of analog outputs, enhancing application fidelity.

Width: 5 mm

A compact width of just 5 mm ensures it fits easily into small form factor designs.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Extensive peripherals enable diverse functionalities, allowing for complex applications in various fields.

Maximum Clock Frequency: 48 MHz

Operating at 48 MHz ensures sufficient processing speed for most embedded applications, enhancing performance.

Length: 5 mm

A short profile of 5 mm contributes to the overall compactness, perfect for space-limited designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade assures durability and reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient instruction execution, optimizing performance.

No. of Timers: 13

Having 13 timers provides flexibility in managing time-sensitive tasks and operations within a project.

RAM Bytes: 147456

A substantial amount of RAM allows for the storage of large data sets and smooth operation of complex algorithms.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-powered applications.

Terminal Form: NO LEAD

The no-lead terminal form allows for advanced mounting techniques, promoting better thermal and electrical performance.

Analog To Digital Convertors: 11-Ch 12-Bit

With multiple ADC channels available, this microcontroller can handle multiple sensor inputs, providing great flexibility in applications.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA indicates adequate power support for various peripherals and functions without overheating.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V allows for power efficiency while maintaining functionality across numerous applications.

No. of DMA Channels: 12

Availability of 12 DMA channels enhances the ability to handle multiple data streams efficiently, boosting performance.

No. of Serial I/Os: 10

Ten serial I/O channels provide versatile connectivity options for various communication protocols, increasing application compatibility.

PWM Channels: YES

The presence of PWM channels allows for efficient control of motors and other devices, making it suitable for automation projects.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

With multiple connectivity options, this microcontroller is adaptable for a variety of applications including automotive and communications.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications to the firmware, providing flexibility during the development cycle.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is ideal for high-density PCB designs, allowing for more components in a smaller area.

Format: FIXED-POINT

Fixed-point format is advantageous for applications requiring fast arithmetic operations, thereby facilitating real-time processing.

Speed: 64 rpm

Speed rating of 64 rpm is particularly useful for robotics and automated systems where controlled movement is critical.

Low Power Mode: YES

The ability to enter low power mode is essential for battery-operated devices, prolonging their operational life.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient processing and execution of tasks in embedded systems.

No. of I/O Lines: 30

With 30 I/O lines, the microcontroller provides ample interfaces for connecting various peripherals and components, enhancing system capabilities.

Technical Specifications

Microcontrollers STM32G0B1KEU7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

2-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

30

No. of Serial I/Os:

10

No. of Terminals:

32

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1KEU7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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