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STM32G0B1CEU7

STMicroelectronics

STM32G0B1CEU7 by STMicroelectronics

STM32G0B1CEU7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 105 °C, and supports up to 48 MHz clock speed. It includes integrated DAC and ADC channels for versatile applications. Ideal for industrial automation, IoT devices, and low-power systems.

Median Price

$3.240

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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EBV Elektronik

Germany . 1,300 parts In-Stock

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1,300

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Vyrian

USA . 4,911 parts In-Stock

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4,911

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TME

Poland . 1,300 parts In-Stock

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$3.240

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1,300

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$3.240

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Anansix

USA . 548 parts In-Stock

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548

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Digiode

USA . 434 parts In-Stock

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434

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Distributors (Availability)

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AZTECH Wire

Italy . 645 parts In-Stock

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$17.100

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645

$17.100

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IDEA Electronic Components Group

UK . 1,235 parts In-Stock

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$30.486

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$27.437

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1,235

$30.486

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$27.437

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MKK Technologies

India . 414 parts In-Stock

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$57.327

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414

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DigiPath Technology Company

USA . 414 parts In-Stock

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$57.327

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414

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Parana Technologies

USA . 1,368 parts In-Stock

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$36.451

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Corphita

USA . 682 parts In-Stock

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682

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Overview

Elevate your projects with the STM32G0B1CEU7 microcontroller from STMicroelectronics, a leader in innovation and reliability. This versatile chip delivers exceptional performance for a wide range of applications—from industrial automation to smart home devices. With low power consumption and robust connectivity options, it unlocks endless possibilities while ensuring durability in demanding environments. Experience unmatched quality that empowers your designs today!

Feature Benefit Bullets

Integrated Cache: YES

The presence of an integrated cache enhances the processing speed and efficiency of the microcontroller, making it suitable for performance-critical applications.

Surface Mount: YES

This microcontroller's surface mount design allows for compact circuit board layouts, which is ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can efficiently operate within a safe voltage range, ensuring reliability and longevity.

On Chip Data RAM Width: 8

The 8-bit data RAM width provides a balance between memory efficiency and processing speed, making it suitable for a wide range of embedded applications.

Package Shape: SQUARE

The square package shape simplifies PCB layout and design, facilitating easier integration into various applications.

Bit Size: 32

The 32-bit architecture allows for efficient processing of complex calculations and tasks, enabling the microcontroller to handle demanding applications.

DAC Channels: YES

The inclusion of DAC channels enables the microcontroller to convert digital signals to analog form, useful for audio and sensor applications.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for peripherals and I/O operations, enhancing the versatility of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style aids in efficient thermal management while maintaining a low profile, suitable for compact designs.

Minimum Supply Voltage: 1.7 V

Operating down to 1.7 V ensures that this microcontroller can be used in low-power applications, making it energy-efficient.

Maximum Operating Temperature: 105 °C

The robust maximum operating temperature rating allows this microcontroller to be used in high-temperature environments, increasing its reliability.

CPU Family: CORTEX-M0

The CORTEX-M0 CPU family offers a high performance-per-watt ratio, making it energy-efficient and effective for low-power applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is suitable for industrial and outdoor applications that experience extreme conditions.

ADC Channels: YES

The availability of ADC channels allows for analog signal processing, making it suitable for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels facilitate fast data transfer without CPU intervention, enhancing overall system performance and efficiency.

Terminal Position: QUAD

The quad terminal positioning improves connectivity and stability while keeping the design compact.

ROM Words: 524288

A substantial ROM size of 524288 words allows for extensive program storage, proving advantageous for complex applications.

Maximum Seated Height: 0.6 mm

The low seated height of 0.6 mm is beneficial for reducing overall board height in compact designs.

Digital To Analog Converters: 2-Ch 12-Bit

With two 12-bit DACs, this microcontroller can provide high-resolution analog output, ideal for audio and signal processing applications.

Width: 7 mm

The 7 mm width allows for efficient space usage and flexibility in design layouts.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Diverse peripherals expand functionality, supporting a myriad of application requirements along with improved control and timing mechanisms.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures fast execution of instructions, making the microcontroller capable of handling real-time tasks.

Length: 7 mm

The compact 7 mm length supports a small footprint, suitable for mobile and portable devices.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this microcontroller is suitable for demanding environments with high reliability requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it offers simplicity in instruction set architecture, leading to improved performance and efficiency.

No. of Timers: 13

Having 13 timers allows for multiple timing operations and event management, essential for real-time applications.

RAM Bytes: 147456

A substantial RAM size of 147456 bytes enhances the microcontroller’s ability to handle complex data processing tasks efficiently.

Technology: CMOS

CMOS technology contributes to low power consumption while maintaining high performance, which is critical for battery-operated devices.

Terminal Form: NO LEAD

The no-lead terminal form reduces manufacturing costs and improves soldering quality in automated assembly processes.

Analog To Digital Convertors: 14-Ch 12-Bit

Fourteen channels of 12-bit ADCs provide extensive input capability for high-resolution measurement applications.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA allows for flexible operation while maintaining low power consumption.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V optimizes power efficiency, making it suitable for battery-powered devices.

No. of DMA Channels: 12

Twelve DMA channels enhance data handling capabilities, reducing CPU load and allowing for smoother operations.

No. of Serial I/Os: 10

Ten serial I/Os provide connectivity options for communication with various devices, enhancing flexibility.

PWM Channels: YES

The presence of PWM channels allows for control of motors and LEDs, increasing the application versatility.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Wide connectivity options ensure compatibility with various devices and protocols, making the microcontroller highly versatile for various projects.

ROM Programmability: FLASH

Flash programmability allows for easy firmware upgrades and modifications, enhancing the product's adaptability to changing requirements.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density packing and contributes to the miniaturization of electronic devices.

Format: FIXED-POINT

The fixed-point format offers efficient processing for applications requiring consistent data representation, such as control systems.

Speed: 64 rpm

Operating at 64 rpm indicates suitability for various time-sensitive applications, enhancing control and timing accuracy.

Low Power Mode: YES

The low power mode feature allows the microcontroller to conserve energy during idle periods, leading to longer battery life in portable devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width balances storage requirements with processing efficiency, making it effective for a wide range of applications.

No. of I/O Lines: 44

Having 44 I/O lines allows for extensive control and interfacing options, making it highly adaptable for various applications.

Technical Specifications

Microcontrollers STM32G0B1CEU7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

44

No. of Serial I/Os:

10

No. of Terminals:

48

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1CEU7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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