Loading...

STM32G0B1CCU3

STMicroelectronics

STM32G0B1CCU3 by STMicroelectronics

STM32G0B1CCU3 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 125 °C, and supports up to 48 MHz clock speed. It includes integrated DAC/ADC channels and offers low power modes for automotive applications. With a compact design and multiple connectivity options, it's ideal for efficient embedded systems.

Median Price

$2.240

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 870 parts In-Stock

1+ parts

-

100+ parts

$2.240

1k+ parts

$2.160

10k+ parts

-

870

-

$2.240

$2.160

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,004

-

-

-

-

Digiode

USA . 4,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,565

-

-

-

-

Anansix

USA . 2,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,251

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 978 parts In-Stock

1+ parts

$16.590

100+ parts

-

1k+ parts

-

10k+ parts

-

978

$16.590

-

-

-

IDEA Electronic Components Group

UK . 2,206 parts In-Stock

1+ parts

$70.050

100+ parts

-

1k+ parts

$63.045

10k+ parts

-

2,206

$70.050

-

$63.045

-

MKK Technologies

India . 878 parts In-Stock

1+ parts

$131.724

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$131.724

-

-

-

DigiPath Technology Company

USA . 878 parts In-Stock

1+ parts

$131.724

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$131.724

-

-

-

Parana Technologies

USA . 2,242 parts In-Stock

1+ parts

-

100+ parts

$83.755

1k+ parts

-

10k+ parts

-

2,242

-

$83.755

-

-

Corphita

USA . 2,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,029

-

-

-

-

Overview

Unlock endless possibilities with the STM32G0B1CCU3 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for automotive and industrial applications, it offers unmatched quality and reliability, ensuring your projects run smoothly even in extreme conditions. With integrated features like low-power modes and versatile connectivity options, this microcontroller empowers you to innovate with confidence, saving time and costs while delivering exceptional performance.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache improves processing speed and system performance, making the microcontroller a great choice for high-speed applications.

Surface Mount: YES

The surface mount design enables compact PCB layouts, allowing for space-efficient integration in various applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V allows for compatibility with a range of power sources while ensuring reliable operation.

On Chip Data RAM Width: 8

The 8-bit RAM width facilitates efficient data processing and allows for a balance between performance and resource usage.

Package Shape: SQUARE

The square package shape is suitable for various circuit board layouts, providing versatility in design.

Bit Size: 32

The 32-bit architecture delivers enhanced performance and allows the microcontroller to handle more complex computations.

DAC Channels: YES

Inclusion of digital-to-analog converters (DAC) allows for audio and signal generation applications, expanding the device's usability.

No. of Terminals: 48

The availability of 48 terminals enables numerous connectivity options and peripheral integrations, enhancing functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style supports efficient heat dissipation in demanding applications, ensuring reliable operation under extreme conditions.

Minimum Supply Voltage: 1.7 V

The lower minimum supply voltage allows for operation in battery-powered applications, contributing to energy efficiency.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this microcontroller suitable for automotive and industrial applications, ensuring durability in harsh environments.

CPU Family: CORTEX-M0

The Cortex-M0 architecture is designed for low power consumption and efficient processing, perfect for energy-sensitive applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures expands the microcontroller's applicability in cold environments commonly found in automotive settings.

ADC Channels: YES

The presence of analog-to-digital converters (ADC) extends functionality for various sensing applications, from environmental monitoring to control systems.

DMA Channels: YES

Direct Memory Access (DMA) capability enhances data transfer speeds and reduces CPU workload, which is crucial for high-performance applications.

Terminal Position: QUAD

Quad terminal positions allow for improved routing on PCBs, enhancing design flexibility and performance.

ROM Words: 262144

The ample ROM space facilitates complex programs and algorithms, enhancing the microcontroller's capability for larger applications.

Maximum Seated Height: 0.6 mm

The low profile allows for integration into compact devices, making it ideal for space-constrained applications.

Digital To Analog Converters: 2-Ch 12-Bit

Having dual 12-bit DACs enriches the microcontroller's ability to produce high-quality analog signals, beneficial for audio and sensor applications.

Width: 7 mm

A compact width enables space-efficient assembly on circuit boards, beneficial for miniaturized electronics.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

A wide range of peripherals enhances the microcontroller’s adaptability in various applications, allowing for complex functionality.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock speed provides efficient processing capability for applications requiring timely data processing.

Length: 7 mm

The small length supports compact designs, enabling integration into small or portable devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade specifications ensure reliability and performance under the most demanding conditions typical in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture promotes simplicity and efficiency in instruction execution, leading to improved performance.

No. of Timers: 13

Having 13 timers provides numerous timing and task management options, which is beneficial for real-time applications.

RAM Bytes: 147456

A high RAM capacity enables the execution of larger programs and data handling, crucial for sophisticated applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller reliable in various conditions.

Terminal Form: NO LEAD

No-lead terminals improve soldering performance and provide more reliable connections in various assembly processes.

Analog To Digital Convertors: 14-Ch 12-Bit

With 14 ADC channels, the microcontroller is well-suited for applications requiring extensive sensor input and data acquisition.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA allows adequate power distribution to peripherals while maintaining low energy consumption.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V makes this microcontroller compatible with common power supplies, ensuring ease of use in various applications.

No. of DMA Channels: 12

Having 12 DMA channels enhances efficiency for data transfers and reduces the burden on the CPU, improving overall system performance.

No. of Serial I/Os: 10

The presence of 10 serial I/O lines facilitates easy communication with other devices, enhancing connectivity options.

PWM Channels: YES

The inclusion of PWM channels allows for control of motors and other devices requiring variable power, expanding application possibilities.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

A diverse range of connectivity options facilitates seamless integration with various peripheral devices and networks.

ROM Programmability: FLASH

With flash ROM programmability, the microcontroller supports easier code updates and modifications, enhancing long-term usability.

Terminal Pitch: 0.5 mm

A compact terminal pitch enables tighter PCB designs, making the microcontroller fit for modern, dense electronic applications.

Format: FIXED-POINT

Using a fixed-point format allows efficient arithmetic operations while reducing resource demands, ideal for many embedded applications.

Speed: 64 rpm

With a speed of 64 rpm, the microcontroller is suitable for applications that require controlled rotational speeds, such as motor control.

Low Power Mode: YES

The low power mode capability allows for energy-efficient operation, making it ideal for battery-powered designs.

On Chip Program ROM Width: 8

An 8-bit ROM width offers efficient processing of instruction sets, supporting the microcontroller's performance in computing tasks.

No. of I/O Lines: 44

The 44 I/O lines provide extensive interfacing potential with various peripherals, enhancing the microcontroller's flexibility in application design.

Technical Specifications

Microcontrollers STM32G0B1CCU3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

44

No. of Serial I/Os:

10

No. of Terminals:

48

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1CCU3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20