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STM32G031K4U6TR

STMicroelectronics

STM32G031K4U6TR by STMicroelectronics

STM32G031K4U6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 8KB RAM. With low power modes and multiple connectivity options, it's ideal for IoT applications. Its compact design suits space-constrained environments.

Median Price

$0.804

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 6,000 parts In-Stock

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$0.804

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$0.804

Verical

USA . 6,000 parts In-Stock

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$0.804

6,000

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$0.804

Distributors (In-Stock)

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Vyrian

USA . 4,044 parts In-Stock

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4,044

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Digiode

USA . 1,403 parts In-Stock

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Anansix

USA . 184 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 6,263 parts In-Stock

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$9.325

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$9.325

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AZTECH Wire

Italy . 134 parts In-Stock

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$9.520

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134

$9.520

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IDEA Electronic Components Group

UK . 2,160 parts In-Stock

1+ parts

$19.279

100+ parts

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$17.351

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$19.279

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$17.351

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Component Stockers USA

USA . 6,243 parts In-Stock

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$23.340

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$23.340

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MKK Technologies

India . 1,941 parts In-Stock

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$36.252

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$36.252

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DigiPath Technology Company

USA . 1,941 parts In-Stock

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$36.252

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1,941

$36.252

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Corphita

USA . 1,252 parts In-Stock

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1,252

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Parana Technologies

USA . 1,014 parts In-Stock

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$23.050

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1,014

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$23.050

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Overview

Unlock endless possibilities with the STM32G031K4U6TR microcontroller from STMicroelectronics, a leader in innovative solutions. This compact powerhouse seamlessly balances performance and efficiency, making it ideal for applications ranging from IoT devices to consumer electronics. Experience exceptional reliability at low power levels, ensuring your projects run smoothly even in the most demanding conditions. Elevate your designs with ST's commitment to quality and cutting-edge technology!

Feature Benefit Bullets

Surface Mount: YES

The surface mount configuration allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can easily interface with low-voltage systems, enhancing its flexibility.

On Chip Data RAM Width: 8

An 8-bit data RAM width provides effective data handling capabilities for a variety of applications.

Package Shape: SQUARE

The square package shape optimizes the layout for thermal performance and usability in various designs.

Bit Size: 32

As a 32-bit microcontroller, it offers enhanced processing power suitable for complex applications.

No. of Terminals: 32

With 32 terminals, it provides ample I/O capability for interfacing with multiple peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style enhances dissipative capabilities, making it suitable for high-performance applications.

Minimum Supply Voltage: 1.7 V

The low minimum voltage allows it to operate in battery-powered devices, ensuring energy efficiency.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C makes it viable for use in a variety of environments, including industrial settings.

CPU Family: CORTEX-M0

Based on the energy-efficient Cortex-M0 architecture, it offers low power consumption while maintaining good performance.

Minimum Operating Temperature: -40 °C

The capability to work at low temperatures makes it suitable for outdoor and harsh environment applications.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, enhancing versatility.

DMA Channels: YES

DMA support allows for efficient data transfer, reducing CPU load and improving performance.

Terminal Position: QUAD

Quad terminal positioning aids in easier board layout and better connection integrity.

ROM Words: 16384

With 16KB of ROM, it provides sufficient storage for a variety of firmware applications.

Maximum Seated Height: 0.6 mm

A low seated height allows for ultra-thin devices, catering to modern design trends.

Width: 5 mm

A compact width makes this microcontroller a perfect fit for space-constrained applications.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

The rich set of peripherals enhances the functionality and adaptability of the microcontroller.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz enables the microcontroller to handle higher processing tasks efficiently.

Length: 5 mm

The overall compact dimension contributes to its suitability for dense circuit designs.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from high performance and efficiency in executing instructions.

No. of Timers: 9

Having 9 timers allows for varied timing applications, making it ideal for real-time tasks.

RAM Bytes: 8192

With 8KB of RAM, it can efficiently manage data and buffering requirements for multiple applications.

Technology: CMOS

CMOS technology enhances power efficiency, which is crucial for battery-operated devices.

Terminal Form: NO LEAD

No lead design reduces the risk of corrosion and enhances reliability in various environments.

Analog To Digital Converters: 6-Ch 12-Bit

The presence of 6-channel, 12-bit ADCs allows for high-resolution analog input processing.

Maximum Supply Current: 6.9 mA

With a maximum supply current of just 6.9 mA, it indicates low power consumption ideal for portable applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V enhances compatibility with a range of low-power devices.

No. of DMA Channels: 5

5 DMA channels allow for efficient data handling between peripherals, minimizing CPU intervention.

No. of Serial I/Os: 3

Having 3 serial I/O lines enables versatile communication options with other components.

PWM Channels: YES

PWM capability makes it suitable for control applications like motor drives or LED dimming.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Multiple connectivity options offer flexibility for integrating with various sensors and controllers.

ROM Programmability: FLASH

Flash programmability allows for in-field updates and easy reprogramming of the device.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density connections, which is ideal for miniaturized applications.

Format: FIXED POINT

Fixed point processing is efficient for many control applications, especially in embedded systems.

Speed: 64 rpm

At 64 rpm, the microcontroller can effectively manage operational tasks without compromising performance.

Low Power Mode: YES

Low power mode support is crucial for prolonging battery life in portable applications.

On Chip Program ROM Width: 8

The 8-bit program ROM width is effective for firmware that does not require extensive data handling.

No. of I/O Lines: 30

With 30 I/O lines, this microcontroller provides significant versatility for different applications.

Technical Specifications

Microcontrollers STM32G031K4U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

6.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

STM32G031K4U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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