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STM32G031K4T3

STMicroelectronics

STM32G031K4T3 by STMicroelectronics

STM32G031K4T3 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. With low power modes and multiple connectivity options, it's ideal for IoT applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,479 parts In-Stock

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6,479

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Digiode

USA . 1,898 parts In-Stock

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1,898

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Anansix

USA . 1,288 parts In-Stock

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1,288

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 3,985 parts In-Stock

1+ parts

$11.339

100+ parts

-

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3,985

$11.339

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AZTECH Wire

Italy . 911 parts In-Stock

1+ parts

$18.290

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911

$18.290

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Component Stockers USA

USA . 7,169 parts In-Stock

1+ parts

$20.820

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7,169

$20.820

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IDEA Electronic Components Group

UK . 1,822 parts In-Stock

1+ parts

$47.148

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$42.433

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1,822

$47.148

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$42.433

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MKK Technologies

India . 897 parts In-Stock

1+ parts

$88.659

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897

$88.659

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DigiPath Technology Company

USA . 897 parts In-Stock

1+ parts

$88.659

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897

$88.659

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Parana Technologies

USA . 2,371 parts In-Stock

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$56.373

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2,371

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$56.373

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Corphita

USA . 2,171 parts In-Stock

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2,171

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Overview

Unlock endless possibilities with the STM32G031K4T3 microcontroller from STMicroelectronics! Renowned for their cutting-edge technology, STMicroelectronics delivers unmatched quality and reliability. This versatile microcontroller is perfect for IoT applications, smart home devices, and industrial automation, offering low power consumption and robust performance. Elevate your projects with seamless connectivity and advanced features that ensure superior efficiency, making it your go-to solution for innovative designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it an excellent choice for various applications.

Surface Mount: YES

Surface mount technology allows for smaller circuit designs and easier assembly processes, ensuring compact and efficient product development.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power supply systems, enhancing flexibility in design.

On Chip Data RAM Width: 8

8-bit RAM width strikes a balance between performance and resource utilization, making it suitable for various application needs.

Package Shape: SQUARE

The square package shape facilitates symmetrical layout designs, which can improve PCB design and space utilization.

Bit Size: 32

A 32-bit architecture allows for more efficient processing and better performance in complex computations.

No. of Terminals: 32

32 terminals provide ample connectivity options for interfacing with other components, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile design is ideal for applications where space is limited, ensuring compatibility with compact devices.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage enables operation in battery-powered applications, making it energy efficient.

Maximum Operating Temperature: 125 °C

The high operating temperature rating ensures reliable performance in harsh environments, expanding its potential use cases.

CPU Family: CORTEX-M0

The Cortex-M0 family is known for its energy efficiency and high performance, making it ideal for low-power applications.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures increases the microcontroller's range of applications, particularly in outdoor or industrial settings.

ADC Channels: YES

Integrated ADC channels allow for easy integration in applications requiring analog signal processing, enhancing functionality.

DMA Channels: YES

DMA channels improve data handling efficiency, allowing the CPU to focus on other tasks and enhancing overall system performance.

Terminal Position: QUAD

A quad terminal position ensures optimal placement on PCBs, facilitating better connectivity and performance.

ROM Words: 16384

A sizable ROM provides ample storage for program code, allowing for complex applications without memory constraints.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for space-constrained applications, contributing to compact design solutions.

Width: 7 mm

The compact width is advantageous for denser PCB layouts, making it suitable for portable and space-sensitive devices.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

A rich set of peripherals adds functionality for various applications, improving flexibility and reducing additional component need.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz enables swift processing capabilities, suitable for real-time applications.

Length: 7 mm

The short length allows for easy integration into various designs, enhancing the overall usability of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture results in efficient processing, which is crucial for performance-critical applications.

No. of Timers: 9

Having multiple timers allows for managing several time-dependent tasks simultaneously, improving overall efficiency.

RAM Bytes: 8192

8KB of RAM supports more complex computations and data handling in applications, ensuring smoother operation.

Technology: CMOS

CMOS technology offers lower power consumption and better heat dissipation, which is valuable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form provides excellent solderability and mechanical stability on PCBs.

Analog To Digital Convertors: 16-Ch 12-Bit

A high-resolution ADC allows precise event capturing from analog inputs, expanding the range of applications.

Maximum Supply Current: 7.6 mA

Low supply current enhances energy efficiency, making this microcontroller suitable for battery-powered designs.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is beneficial for low-power applications, extending battery life.

No. of DMA Channels: 5

Having 5 DMA channels enhances data processing efficiency, allowing for high-performance application design.

No. of Serial I/Os: 3

Multiple serial I/O options ensure versatility in communication, making it easier to interface with other devices.

PWM Channels: YES

The inclusion of PWM channels is ideal for applications involving motor control and signal modulation, enhancing functionality.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Diverse connectivity options expand the microcontroller's interoperability with various devices and protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, enhancing the device's adaptability to changing requirements.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is suitable for modern PCB designs, ensuring compatibility with standard assembly processes.

Format: FIXED POINT

Fixed-point format support simplifies arithmetic operations, making it suitable for various embedded applications.

Speed: 64 rpm

The microcontroller's speed rating allows it to handle tasks efficiently, making it appropriate for real-time processing needs.

Low Power Mode: YES

Low power mode extends battery life and reduces energy consumption, making it ideal for portable device applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates efficient data management and processing, suitable for a variety of control tasks.

No. of I/O Lines: 30

30 I/O lines provide extensive interfacing capabilities, making the microcontroller versatile for many application demands.

Technical Specifications

Microcontrollers STM32G031K4T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32G031K4T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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