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STM32G031F8P3TR

STMicroelectronics

STM32G031F8P3TR by STMicroelectronics

STM32G031F8P3TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU, offering 48 MHz clock frequency and 8192 bytes of RAM. It features 14-Ch 12-Bit ADC channels, 5 DMA channels, and peripherals like BOR, RTC, and timers. Ideal for applications requiring low power consumption and high-performance computing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,587 parts In-Stock

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6,587

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Anansix

USA . 1,423 parts In-Stock

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1,423

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Digiode

USA . 1,279 parts In-Stock

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1,279

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Vigor

Singapore . 2,388 parts In-Stock

1+ parts

$1.440

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-

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2,388

$1.440

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AZTECH Wire

Italy . 594 parts In-Stock

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$11.553

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594

$11.553

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Semicontronic

India . 1,276 parts In-Stock

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$21.000

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$20.475

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$20.370

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1,276

$21.000

$20.475

$20.370

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Ampacity Inc.

Singapore . 986 parts In-Stock

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$32.000

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986

$32.000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$54.171

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$51.462

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$51.462

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$54.171

$51.462

$51.462

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IDEA Electronic Components Group

UK . 1,609 parts In-Stock

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$66.552

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$59.897

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$59.897

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Corohmni

South Africa . 236 parts In-Stock

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$66.598

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Aztec Data Supply Inc.

USA . 115 parts In-Stock

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$71.810

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115

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MKK Technologies

India . 1,951 parts In-Stock

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$125.146

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1,951

$125.146

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DigiPath Technology Company

USA . 1,951 parts In-Stock

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$125.146

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Argo Parts USA

USA . 4,533 parts In-Stock

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Continental Prestige Electronics

USA . 4,315 parts In-Stock

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Corphita

USA . 2,050 parts In-Stock

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2,050

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Parana Technologies

USA . 1,952 parts In-Stock

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$79.573

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$79.573

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Elevate your projects with the STM32G031F8P3TR by STMicroelectronics, a cutting-edge microcontroller that combines top-notch quality with unmatched performance. Designed by a trusted manufacturer in the industry, this device offers a wide range of applications in various fields. With its advanced features and high-speed capabilities, it provides customers with exceptional value and benefits, making it the perfect choice for any project requiring precision and efficiency. Experience the advantage of seamless connectivity, low power consumption, and reliable performance with the STM32G031F8P3TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6 V gives flexibility in power supply options for the microcontroller.

CPU Family: CORTEX-M0

CORTEX-M0 CPU family ensures efficient processing and performance for the microcontroller.

ADC Channels: YES

Availability of ADC channels allows for analog to digital conversion, enabling precise measurement and control in applications.

PWM Channels: YES

PWM channels facilitate pulse width modulation for controlling various devices and components connected to the microcontroller.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Multiple connectivity options such as I2C, SPI, and USART enhance communication capabilities of the microcontroller with other devices.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can efficiently store and manipulate data during operation.

Maximum Clock Frequency: 48 MHz

High maximum clock frequency of 48 MHz allows for fast processing and response times in real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures streamlined and efficient execution of instructions, making the microcontroller suitable for performance-critical tasks.

Technical Specifications

Microcontrollers STM32G031F8P3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

18

No. of Serial I/Os:

3

No. of Terminals:

20

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

STM32G031F8P3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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