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STM32F410TBY3TR

STMicroelectronics

STM32F410TBY3TR by STMicroelectronics

STM32F410TBY3TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at 1.8-3.6V, and supports up to 26 MHz clock frequency. With 23 I/O lines and integrated ADC/DMA channels, it's ideal for compact embedded applications. Its thin profile design ensures efficient space utilization in modern electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,113 parts In-Stock

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8,113

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Digiode

USA . 1,597 parts In-Stock

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1,597

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Anansix

USA . 399 parts In-Stock

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399

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Distributors (Availability)

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Vigor

Singapore . 4,240 parts In-Stock

1+ parts

$2.810

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4,240

$2.810

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AZTECH Wire

Italy . 1,155 parts In-Stock

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$9.860

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1,155

$9.860

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Microchip USA

USA . 6,874 parts In-Stock

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$20.918

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6,874

$20.918

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IDEA Electronic Components Group

UK . 946 parts In-Stock

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$42.560

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$38.304

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946

$42.560

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$38.304

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MKK Technologies

India . 990 parts In-Stock

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$80.032

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990

$80.032

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DigiPath Technology Company

USA . 990 parts In-Stock

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$80.032

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990

$80.032

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Corphita

USA . 3,897 parts In-Stock

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3,897

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Parana Technologies

USA . 1,847 parts In-Stock

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$50.887

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1,847

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$50.887

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Overview

Unlock limitless potential with the STM32F410TBY3TR microcontroller from STMicroelectronics, a leader in innovation and quality. This compact powerhouse delivers exceptional performance for your embedded applications, enhancing efficiency while reducing power consumption. Its versatility makes it perfect for everything from IoT devices to industrial automation. Experience reliability and cutting-edge technology that propels your projects to success, ensuring you stay ahead in a competitive market. Elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for a compact design, facilitating easier integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications, enhancing energy efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCBs, making it suitable for various layouts.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle more complex computations and larger data sets, making it ideal for sophisticated applications.

No. of Terminals: 36

Having 36 terminals allows for a higher number of connections, providing flexibility in interfacing with multiple peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch design contribute to a small footprint, perfect for portable devices where space is at a premium.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables operation in battery-powered applications, extending battery life and operational time.

ADC Channels: YES

The inclusion of ADC channels allows the microcontroller to convert analog signals to digital, making it suitable for sensor applications.

DMA Channels: YES

With DMA channels, data transfer can occur without CPU intervention, enhancing performance and efficiency in data-intensive tasks.

Terminal Position: BOTTOM

Bottom terminal positioning can provide more robust connections in compact assemblies, improving reliability in device performance.

Width: 2.57 mm

The narrow width makes it an excellent choice for devices requiring minimal space, such as wearables and IoT gadgets.

Maximum Clock Frequency: 26 MHz

A maximum clock frequency of 26 MHz allows for faster processing speeds, making it suitable for higher-performance applications.

Peak Reflow Temperature °C: 260

The ability to withstand a peak reflow temperature of 260 °C ensures compatibility with standard PCB soldering processes.

Length: 2.668 mm

The length contributes to the compact nature of the microcontroller, facilitating integration into tight spaces in electronic designs.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from a simple instruction set, leading to efficient performance and lower power consumption.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form aids in efficient compact designs and reliable connections, ensuring robustness in application.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V supports standard logic levels, making it compatible with a wide array of components.

PWM Channels: YES

PWM channels enable precise control of motors and other devices, making it suitable for applications involving control systems.

Terminal Pitch: 0.4 mm

The 0.4 mm terminal pitch allows for high-density packaging, which is crucial for modern compact applications.

Speed: 100 rpm

Supports applications with moderate speed requirements, enhancing versatility in industrial and robotics applications.

No. of I/O Lines: 23

With 23 I/O lines, this microcontroller provides ample connectivity options for interfacing with various external devices and sensors.

Technical Specifications

Microcontrollers STM32F410TBY3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

2.668 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

23

No. of Terminals:

36

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.57 mm

Peripheral IC Type:

Trade Compliance

STM32F410TBY3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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