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STM32F401CDU6TR

STMicroelectronics

STM32F401CDU6TR by STMicroelectronics

STM32F401CDU6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words. It operates at a max clock frequency of 50 MHz and has 36 I/O lines. Ideal for applications requiring high-speed processing, such as industrial automation and IoT devices.

Median Price

$2.872

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

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$2.650

30,000

-

-

-

$2.650

Arrow

USA . 12,500 parts In-Stock

1+ parts

-

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$2.872

12,500

-

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-

$2.872

Verical

USA . 12,500 parts In-Stock

1+ parts

-

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$2.872

12,500

-

-

-

$2.872

Chip1Stop

Japan . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

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$3.990

12,500

-

-

-

$3.990

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 92 parts In-Stock

1+ parts

$3.400

100+ parts

-

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92

$3.400

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IBS Electronics

USA . 37,500 parts In-Stock

1+ parts

-

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10k+ parts

$4.011

37,500

-

-

-

$4.011

Vyrian

USA . 4,861 parts In-Stock

1+ parts

-

100+ parts

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4,861

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-

-

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Digiode

USA . 4,823 parts In-Stock

1+ parts

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4,823

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Anansix

USA . 773 parts In-Stock

1+ parts

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773

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 16,864 parts In-Stock

1+ parts

$2.440

100+ parts

-

1k+ parts

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-

16,864

$2.440

-

-

-

Semicontronic

India . 16,600 parts In-Stock

1+ parts

$2.440

100+ parts

$2.379

1k+ parts

$2.367

10k+ parts

-

16,600

$2.440

$2.379

$2.367

-

Continental Prestige Electronics

USA . 4,946 parts In-Stock

1+ parts

$3.400

100+ parts

-

1k+ parts

-

10k+ parts

$3.332

4,946

$3.400

-

-

$3.332

Argo Parts USA

USA . 3,045 parts In-Stock

1+ parts

$3.400

100+ parts

-

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3,045

$3.400

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Vigor

Singapore . 6,000 parts In-Stock

1+ parts

$3.980

100+ parts

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6,000

$3.980

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AZTECH Wire

Italy . 1,046 parts In-Stock

1+ parts

$14.470

100+ parts

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1,046

$14.470

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Microchip USA

USA . 4,106 parts In-Stock

1+ parts

$29.559

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4,106

$29.559

-

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$36.266

100+ parts

$34.453

1k+ parts

$34.453

10k+ parts

-

5,000

$36.266

$34.453

$34.453

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Corohmni

South Africa . 156 parts In-Stock

1+ parts

$54.321

100+ parts

-

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156

$54.321

-

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Aztec Data Supply Inc.

USA . 1,314 parts In-Stock

1+ parts

$66.950

100+ parts

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1,314

$66.950

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IDEA Electronic Components Group

UK . 41 parts In-Stock

1+ parts

$77.665

100+ parts

-

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$69.899

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41

$77.665

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$69.899

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MKK Technologies

India . 618 parts In-Stock

1+ parts

$146.045

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-

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618

$146.045

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DigiPath Technology Company

USA . 618 parts In-Stock

1+ parts

$146.045

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618

$146.045

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GreenTree Electronics

Israel . 32,500 parts In-Stock

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32,500

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Futuretech Components

Singapore . 12,500 parts In-Stock

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12,500

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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$3.332

1k+ parts

$3.230

10k+ parts

$3.162

2,000

-

$3.332

$3.230

$3.162

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,284 parts In-Stock

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1,284

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Parana Technologies

USA . 427 parts In-Stock

1+ parts

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$92.861

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427

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$92.861

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Overview

Unleash the power of innovation with the STM32F401CDU6TR microcontroller from STMicroelectronics. Renowned for their high-quality products, STMicroelectronics delivers cutting-edge technology in a compact package that is perfect for a wide range of applications. This microcontroller offers unmatched value, benefits, and advantages to customers looking to enhance their projects with reliable performance and efficiency. Explore the endless possibilities with the STM32F401CDU6TR and revolutionize your designs today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and compact integration onto printed circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options and compatibility with a wide range of applications.

Package Shape: SQUARE

Square shape allows for easier placement and alignment on a PCB, simplifying the design process.

Bit Size: 32

32-bit architecture allows for higher performance and more complex processing capabilities compared to smaller bit sizes.

No. of Terminals: 48

Ample number of terminals for connecting to external components and peripherals, enabling versatile functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Diverse package styles provide options for different application requirements, such as heat dissipation and space constraints.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage allows for operation in low-power and battery-powered devices.

ADC Channels: YES

Built-in ADC channels enable analog sensing and conversion, expanding the range of input signals that can be processed.

DMA Channels: YES

Support for DMA channels improves data transfer efficiency and reduces CPU workload for faster and more responsive operation.

Terminal Position: QUAD

Quad terminal position allows for easy connection to external components and peripherals in a standardized layout.

ROM Words: 393216

Large ROM capacity provides ample storage for program code and data, supporting complex applications and algorithms.

Width: 7 mm

Compact width size enables integration into tight spaces and small form factor designs.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for fast processing and response times, suitable for applications requiring real-time operations.

Length: 7 mm

Compact length size complements the width dimension for efficient use of board space.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller configuration offers efficient instruction execution and reduced power consumption for optimized performance.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages.

Terminal Form: NO LEAD

Leadless terminal form factor improves thermal performance, reduces solder joint stress, and simplifies manufacturing processes.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable operation across varying operating conditions.

PWM Channels: YES

Support for PWM channels enables precise control of motor speed, LED brightness, and other analog functions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density integration and fine-pitch SMT assembly for compact and miniaturized designs.

Speed: 84 rpm

Operating speed of 84 revolutions per minute indicates fast data processing and execution capabilities for efficient performance.

No. of I/O Lines: 36

Sufficient number of I/O lines for connecting to external devices and peripherals, supporting a wide range of input and output functionalities.

Technical Specifications

Microcontrollers STM32F401CDU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

36

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

393216

Speed:

84 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F401CDU6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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