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STM32F303ZDT6

STMicroelectronics

STM32F303ZDT6 by STMicroelectronics

STM32F303ZDT6 by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at up to 32 MHz. It features 40-Ch 12-Bit ADCs and offers connectivity options like CAN, I2C, SPI, and USB. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

$12.980

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 425 parts In-Stock

1+ parts

$12.980

100+ parts

$8.670

1k+ parts

$8.080

10k+ parts

-

425

$12.980

$8.670

$8.080

-

DigiKey

USA . 236 parts In-Stock

1+ parts

$12.980

100+ parts

$8.995

1k+ parts

$8.142

10k+ parts

$7.979

236

$12.980

$8.995

$8.142

$7.979

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,296 parts In-Stock

1+ parts

$8.256

100+ parts

-

1k+ parts

-

10k+ parts

-

4,296

$8.256

-

-

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$8.695

100+ parts

-

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-

10k+ parts

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700

$8.695

-

-

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Flip Electronics

USA . 16,472 parts In-Stock

1+ parts

-

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16,472

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Vyrian

USA . 9,160 parts In-Stock

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9,160

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Component Sense

UK . 2,160 parts In-Stock

1+ parts

-

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2,160

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Anansix

USA . 1,815 parts In-Stock

1+ parts

-

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1,815

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North Shore Components

USA . 39 parts In-Stock

1+ parts

-

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39

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

1+ parts

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3

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ComSIT USA

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$6.430

100+ parts

-

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784

$6.430

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-

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Ampacity Inc.

Singapore . 198 parts In-Stock

1+ parts

$7.390

100+ parts

-

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198

$7.390

-

-

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Semicontronic

India . 106 parts In-Stock

1+ parts

$7.390

100+ parts

$7.205

1k+ parts

$7.168

10k+ parts

-

106

$7.390

$7.205

$7.168

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Corphita

USA . 2,599 parts In-Stock

1+ parts

$7.821

100+ parts

-

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2,599

$7.821

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Continental Prestige Electronics

USA . 6,942 parts In-Stock

1+ parts

$8.695

100+ parts

-

1k+ parts

-

10k+ parts

$8.521

6,942

$8.695

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-

$8.521

Netroflash

USA . 50 parts In-Stock

1+ parts

$8.695

100+ parts

-

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50

$8.695

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Corohmni

South Africa . 763 parts In-Stock

1+ parts

$9.598

100+ parts

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763

$9.598

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$9.886

100+ parts

$9.392

1k+ parts

$9.392

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20

$9.886

$9.392

$9.392

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Vigor

Singapore . 367 parts In-Stock

1+ parts

$11.210

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-

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367

$11.210

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IDEA Electronic Components Group

UK . 411 parts In-Stock

1+ parts

$60.898

100+ parts

-

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$54.808

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411

$60.898

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$54.808

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Aztec Data Supply Inc.

USA . 13,789 parts In-Stock

1+ parts

$81.829

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13,789

$81.829

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MKK Technologies

India . 851 parts In-Stock

1+ parts

$114.514

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851

$114.514

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DigiPath Technology Company

USA . 851 parts In-Stock

1+ parts

$114.514

100+ parts

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851

$114.514

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Argo Parts USA

USA . 3,116 parts In-Stock

1+ parts

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3,116

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Lixinc

USA . 2,718 parts In-Stock

1+ parts

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2,718

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Parana Technologies

USA . 691 parts In-Stock

1+ parts

-

100+ parts

$72.812

1k+ parts

-

10k+ parts

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691

-

$72.812

-

-

Overview

Unlock the power of innovation with the STM32F303ZDT6 by STMicroelectronics, a cutting-edge microcontroller designed to elevate your projects to new heights. With a reputation for excellence in manufacturing, STMicroelectronics delivers reliable and high-quality components that you can trust. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits, providing customers with a versatile solution that enhances performance and efficiency. Experience the advantages of the STM32F303ZDT6 and bring your ideas to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material offers good durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount capability allows for easy mounting on PCBs, making the integration process simpler and more efficient.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V provides flexibility in power supply options while ensuring safe operation within specified limits.

Address Bus Width: 24

A 24-bit address bus width allows for access to a large memory space, enabling the microcontroller to handle complex tasks and run multiple applications simultaneously.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the PCB and allowing for more efficient board layout.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle data processing and computations more effectively, resulting in faster and more reliable performance.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages (2.5V and 3.3V) provides flexibility in the design and operation of the microcontroller, allowing for compatibility with different system requirements.

No. of Terminals: 144

Having 144 terminals allows for easy connectivity to external components, peripherals, and power sources, enabling versatile functionality and expandability.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style offers a compact and lightweight design, suitable for applications where space is limited and high-density integration is required.

Minimum Supply Voltage: 2 V

Operating at a minimum supply voltage of 2V ensures efficient power consumption while maintaining stable operation, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The microcontroller can operate at temperatures up to 85°C, allowing for use in industrial environments or applications where higher temperatures may be encountered.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high-performance processing capabilities, enabling the microcontroller to handle complex tasks and real-time processing requirements efficiently.

Minimum Operating Temperature: -40 °C

The microcontroller can operate at temperatures as low as -40°C, making it suitable for use in cold environments or applications with extended temperature ranges.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connectivity and long-term performance of the microcontroller.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its functionality for diverse application requirements.

DMA Channels: YES

Direct memory access (DMA) channels enhance data transfer efficiency and reduce CPU overhead, optimizing the microcontroller's performance for tasks that require high-speed data processing.

Terminal Position: QUAD

The quad terminal position offers easy accessibility and connectivity to external components, contributing to a more streamlined and organized PCB layout.

ROM Words: 393216

The large ROM capacity of 393216 words allows for storing and executing extensive program code and data, supporting complex applications and firmware requirements.

Digital To Analog Convertors: 2-Ch 12-Bit

2-channel 12-bit digital-to-analog converters enable the microcontroller to generate analog output signals with precision and accuracy, suitable for various control and signal processing applications.

Width: 20 mm

With a width of 20mm, this microcontroller offers a compact form factor, making it suitable for applications where space is limited and compact design is essential.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient data transfer between the microcontroller and external memory devices, enhancing overall system performance and data throughput.

Peripherals: COMPARATOR(7), DMA(12), POR, RTC, TIMER(14)

A wide range of peripherals including comparators, DMA, power-on-reset (POR), real-time clock (RTC), and timers make the microcontroller versatile and suitable for diverse application requirements.

Maximum Clock Frequency: 32 MHz

Operating at a maximum clock frequency of 32MHz enables fast and efficient processing of instructions, data, and control signals, enhancing overall system performance and responsiveness.

Peak Reflow Temperature °C: 260

The microcontroller can withstand peak reflow temperatures of 260°C, ensuring reliable soldering and assembly processes during manufacturing and rework operations.

Length: 20 mm

With a length of 20mm, this microcontroller maintains a compact and space-efficient design, suitable for applications with size constraints and limited board space.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller can operate under harsh environmental conditions, offering reliability and durability in demanding settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high computational efficiency and performance, making it suitable for real-time control, embedded systems, and IoT applications.

RAM Bytes: 65536

With a RAM capacity of 65536 bytes, the microcontroller can store and access a large amount of data and variables, supporting multitasking and memory-intensive applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation, making it suitable for battery-powered devices, portable electronics, and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form offers reliable solder joints and easy assembly during PCB manufacturing, ensuring robust electrical connections for stable performance.

Analog To Digital Convertors: 40-Ch 12-Bit

40-channel 12-bit analog-to-digital converters enable the microcontroller to interface with a large number of analog sensors and signals, supporting data acquisition and measurement applications.

Maximum Supply Current: 76.9 mA

Operating with a maximum supply current of 76.9mA ensures efficient power consumption and thermal management, suitable for applications with power constraints and energy efficiency requirements.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V provides a stable power source for the microcontroller, ensuring consistent performance and reliable operation in various operating conditions.

PWM Channels: YES

Pulse-width modulation (PWM) channels allow the microcontroller to generate precise and variable output signals, suitable for motor control, power regulation, and LED dimming applications.

Connectivity: CAN, I2C(3), I2S(2), IRDA, LIN, SPI(4), UART(2), USART(3), USB

Support for a wide range of communication interfaces such as CAN, I2C, I2S, IRDA, LIN, SPI, UART, USART, and USB, enables seamless connectivity with external devices, sensors, and networks for data exchange and control.

ROM Programmability: FLASH

Flash ROM programmability allows for in-system programming and updating of firmware, enabling flexibility and scalability in application development, testing, and maintenance.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller offers high-density integration and efficient use of board space, suitable for compact and miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the microcontroller can withstand multiple reflow soldering cycles without degradation, ensuring robust manufacturing processes and product reliability.

Technical Specifications

Microcontrollers STM32F303ZDT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

76.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), I2S(2), IRDA, LIN, SPI(4), UART(2), USART(3), USB

Peripherals:

COMPARATOR(7), DMA(12), POR, RTC, TIMER(14)

Analog To Digital Convertors:

40-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F303ZDT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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