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STM32F303VDH6

STMicroelectronics

STM32F303VDH6 by STMicroelectronics

STM32F303VDH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 39 ADC channels, and 2 DACs. It operates at up to 32 MHz, has 65536 bytes of RAM, and supports various peripherals like CAN, I2C, SPI, UART. Ideal for industrial applications requiring high-speed processing and extensive connectivity options.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 1,664 parts In-Stock

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1,664

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Chip Stock

USA . 3,797 parts In-Stock

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3,797

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Digiode

USA . 3,791 parts In-Stock

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Anansix

USA . 2,108 parts In-Stock

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Vyrian

USA . 1,936 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Vigor

Singapore . 4,432 parts In-Stock

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$5.320

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4,432

$5.320

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Ampacity Inc.

Singapore . 1,240 parts In-Stock

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$9.000

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$9.000

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AZTECH Wire

Italy . 638 parts In-Stock

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$10.896

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638

$10.896

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Microchip USA

USA . 3,636 parts In-Stock

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$18.372

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3,636

$18.372

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IDEA Electronic Components Group

UK . 852 parts In-Stock

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$26.333

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$23.700

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852

$26.333

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$23.700

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Aztec Data Supply Inc.

USA . 7,372 parts In-Stock

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$36.590

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$36.590

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MKK Technologies

India . 1,051 parts In-Stock

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$49.518

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$49.518

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DigiPath Technology Company

USA . 1,051 parts In-Stock

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$49.518

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Corohmni

South Africa . 185 parts In-Stock

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$66.481

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Lixinc

USA . 12,417 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,285 parts In-Stock

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Argo Parts USA

USA . 923 parts In-Stock

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Corphita

USA . 700 parts In-Stock

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700

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Parana Technologies

USA . 688 parts In-Stock

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$31.485

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Bastille Electronics

Australia . 34 parts In-Stock

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Overview

Discover the STM32F303VDH6 by STMicroelectronics, a high-quality microcontroller designed to bring innovation and efficiency to your projects. With a powerful Cortex-M4F CPU family, this product offers an array of peripherals including comparators, DMA, RTC, and more. Ideal for industrial applications, this microcontroller boasts a maximum clock frequency of 32MHz and a wide range of connectivity options such as CAN, USB, and UART. Trust in STMicroelectronics' reputation for excellence and choose the STM32F303VDH6 for all your next-generation designs. Unlock your potential with this versatile and reliable microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring long-term reliability in various operating conditions.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input range, making it suitable for a wide range of applications.

CPU Family: CORTEX-M4F

The Cortex-M4F processor offers high performance and efficiency for processing tasks, making this microcontroller suitable for complex applications.

Maximum Clock Frequency: 32 MHz

The high clock frequency allows for fast processing and response times, ideal for applications that require real-time data processing.

ROM Programmability: FLASH

Flash programmability enables easy firmware updates and modifications, ensuring flexibility and adaptability for different application requirements.

Connectivity: CAN, I2C(3), I2S(2), IRDA, LIN, SPI(4), UART(2), USART(3), USB

Multiple connectivity options allow for seamless integration with various devices and communication protocols, enhancing the microcontroller's versatility and compatibility.

Technical Specifications

Microcontrollers STM32F303VDH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of I/O Lines:

40

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

76.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), I2S(2), IRDA, LIN, SPI(4), UART(2), USART(3), USB

Peripherals:

COMPARATOR(7), DMA(12), POR, RTC, TIMER(14)

Analog To Digital Convertors:

39-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F303VDH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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