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STM32F303VCY6TR

STMicroelectronics

STM32F303VCY6TR by STMicroelectronics

STM32F303VCY6TR by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.6V and operates at up to 32 MHz. It features ADC and PWM channels, making it ideal for embedded applications in automation and control systems. Its compact design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,521 parts In-Stock

1+ parts

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3,521

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Digiode

USA . 2,565 parts In-Stock

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2,565

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Anansix

USA . 764 parts In-Stock

1+ parts

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764

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,812 parts In-Stock

1+ parts

$5.250

100+ parts

-

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1,812

$5.250

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AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$19.320

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525

$19.320

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IDEA Electronic Components Group

UK . 804 parts In-Stock

1+ parts

$73.222

100+ parts

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$65.900

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804

$73.222

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$65.900

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MKK Technologies

India . 1,573 parts In-Stock

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$137.689

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1,573

$137.689

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DigiPath Technology Company

USA . 1,573 parts In-Stock

1+ parts

$137.689

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1,573

$137.689

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 1,446 parts In-Stock

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1,446

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Parana Technologies

USA . 1,254 parts In-Stock

1+ parts

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100+ parts

$87.548

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1,254

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$87.548

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Overview

Unlock endless possibilities with the STM32F303VCY6TR microcontroller from STMicroelectronics. Renowned for its quality and innovation, STMicroelectronics delivers unmatched reliability and performance, perfect for diverse applications like IoT devices, industrial automation, and consumer electronics. Experience enhanced efficiency and versatility as this 32-bit powerhouse seamlessly integrates advanced features, empowering your projects to thrive in today’s competitive market. Elevate your designs with the trusted excellence of ST!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs and easier integration into modern PCB layouts.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller offers compatibility with a wide range of low voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient space utilization on PCBs, making it suitable for dense applications.

Bit Size: 32

The 32-bit architecture allows for handling complex calculations and a larger memory address space, enhancing processing power.

No. of Terminals: 100

The 100 terminals provide ample connections to peripherals and other components, allowing for extensive functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This thin profile and fine pitch design facilitate high-density mounting, which is ideal for compact and efficient circuit designs.

Minimum Supply Voltage: 2 V

Operating at a minimum supply voltage of 2 V enhances the microcontroller's versatility in low-power applications.

ADC Channels: YES

The presence of ADC channels allows for direct interaction with analog signals, making it suitable for sensor applications.

DMA Channels: YES

DMA channels improve data handling efficiency by offloading tasks from the CPU, resulting in faster performance and lower power consumption.

Terminal Position: BOTTOM

Bottom terminal positioning provides easy access for mounting and enhanced electrical contact, improving reliability.

Width: 4.201 mm

A compact width of 4.201 mm makes it an excellent choice for space-constrained applications.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz offers sufficient speed for most applications, balancing performance with power efficiency.

Length: 4.663 mm

The length of 4.663 mm contributes to the overall compactness of the design, making this microcontroller suitable for miniaturized devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from a reduced instruction set that enhances processing speed and efficiency.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal design facilitates better thermal and electrical performance while simplifying mounting on PCBs.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V maximizes compatibility with other modern digital circuits.

PWM Channels: YES

The inclusion of PWM channels allows for precise control of motors and other actuators, broadening application possibilities.

Terminal Pitch: 0.4 mm

The 0.4 mm terminal pitch allows for high-density connections, critical for compact designs in advanced electronic devices.

Speed: 72 rpm

A speed of 72 rpm indicates suitability for low-speed applications, efficiently handling tasks without excessive energy usage.

No. of I/O Lines: 77

With 77 I/O lines, this microcontroller can interface with a wide variety of external components and sensors, making it extremely versatile.

Technical Specifications

Microcontrollers STM32F303VCY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

4.663 mm

No. of I/O Lines:

77

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.201 mm

Peripheral IC Type:

Trade Compliance

STM32F303VCY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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