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STM32F302K8U7

STMicroelectronics

STM32F302K8U7 by STMicroelectronics

STM32F302K8U7 by STMicroelectronics is a 32-bit microcontroller with 32 MHz max clock freq. It features 16384 bytes of RAM, 65536 ROM words, and 8-Ch 12-Bit ADC. Ideal for industrial applications requiring CAN, I2C, SPI connectivity and PWM channels for precise control.

Median Price

$4.220

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$4.220

-

-

-

Vyrian

USA . 7,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,875

-

-

-

-

Anansix

USA . 1,168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,168

-

-

-

-

Digiode

USA . 1,162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,162

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,503 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

-

10k+ parts

-

1,503

$2.840

-

-

-

Continental Prestige Electronics

USA . 6,109 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

$4.136

6,109

$4.220

-

-

$4.136

Argo Parts USA

USA . 539 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

-

539

$4.220

-

-

-

AZTECH Wire

Italy . 398 parts In-Stock

1+ parts

$16.714

100+ parts

-

1k+ parts

-

10k+ parts

-

398

$16.714

-

-

-

Ampacity Inc.

Singapore . 536 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

536

$28.000

-

-

-

IDEA Electronic Components Group

UK . 716 parts In-Stock

1+ parts

$42.869

100+ parts

-

1k+ parts

$38.582

10k+ parts

-

716

$42.869

-

$38.582

-

MKK Technologies

India . 1,802 parts In-Stock

1+ parts

$80.613

100+ parts

-

1k+ parts

-

10k+ parts

-

1,802

$80.613

-

-

-

DigiPath Technology Company

USA . 1,802 parts In-Stock

1+ parts

$80.613

100+ parts

-

1k+ parts

-

10k+ parts

-

1,802

$80.613

-

-

-

GreenTree Electronics

Israel . 2,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,450

-

-

-

-

Parana Technologies

USA . 1,955 parts In-Stock

1+ parts

-

100+ parts

$51.257

1k+ parts

-

10k+ parts

-

1,955

-

$51.257

-

-

Corphita

USA . 683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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683

-

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.136

1k+ parts

$4.009

10k+ parts

$3.925

500

-

$4.136

$4.009

$3.925

Overview

Experience the next level of innovation with the STM32F302K8U7 by STMicroelectronics. This high-quality microcontroller offers unmatched performance and reliability for a wide range of applications. With advanced features like multiple ADC and DMA channels, as well as connectivity options like CAN and USB, this product provides exceptional value and flexibility to customers. Trust in STMicroelectronics' reputation for excellence and unlock endless possibilities with the STM32F302K8U7.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy installation on PCBs.

Maximum Supply Voltage:

3.6 V - Provides flexibility in power supply options.

Package Shape:

SQUARE - Helps in efficient use of space on the PCB.

Bit Size:

32 - Offers high processing power for various applications.

Power Supplies (V):

2.5/3.3 - Supports a wide range of power input options.

No. of Terminals:

32 - Enables connection to multiple peripheral devices.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Ensures efficient heat dissipation and compact design.

Minimum Supply Voltage:

2 V - Allows for operation in low voltage conditions.

Maximum Operating Temperature:

105 °C - Suitable for industrial environments with high temperatures.

CPU Family:

CORTEX-M4F - Provides high-performance processing capabilities.

Minimum Operating Temperature:

40 °C - Ideal for use in extreme cold conditions.

Terminal Finish:

MATTE TIN - Ensures good electrical conductivity and corrosion resistance.

ADC Channels:

YES - Enables analog signal conversion for accurate measurements.

DMA Channels:

YES - Facilitates efficient data transfer without CPU intervention.

Terminal Position:

QUAD - Simplifies PCB layout and connectivity.

ROM Words:

65536 - Offers ample memory storage for firmware and data.

Digital To Analog Convertors:

1-Ch 12-Bit - Allows for precise analog signal generation.

Width:

5 mm - Enables compact and space-efficient designs.

Peripherals:

COMPARATOR(2), DMA(7), POR, RTC, TIMER(9) - Provides a variety of peripheral options for enhanced functionality.

Maximum Clock Frequency:

32 MHz - Allows for high-speed processing of data.

Peak Reflow Temperature °C:

260 - Ensures reliable soldering during assembly.

Length:

5 mm - Contributes to the overall compact design of the microcontroller.

Temperature Grade:

INDUSTRIAL - Suitable for rugged industrial applications.

Peripheral IC Type:

MICROCONTROLLER, RISC - Utilizes efficient RISC architecture for optimized performance.

RAM Bytes:

16384 - Offers sufficient memory for data storage and processing.

Technology:

CMOS - Provides low power consumption and high noise immunity.

Terminal Form:

NO LEAD - Ensures environmental friendliness and compliance with regulations.

Analog To Digital Convertors:

8-Ch 12-Bit - Enables conversion of multiple analog signals with high resolution.

Maximum Supply Current:

52 mA - Supports power-efficient operation.

Nominal Supply Voltage:

3.3 V - Standard voltage supply for wide compatibility.

PWM Channels:

YES - Provides options for precise control of digital signals.

Connectivity:

CAN, I2C(3), I2S(2), SPI(2), USART(2), USB - Offers versatile communication interfaces for external devices.

ROM Programmability:

FLASH - Facilitates easy reprogramming of firmware.

Terminal Pitch:

0.5 mm - Allows for fine pitch connections for space-saving layouts.

Moisture Sensitivity Level (MSL):

3 - Indicates resistance to moisture during storage and handling.

Speed:

72 rpm - Offers efficient processing speed for various applications.

On Chip Program ROM Width:

8 - Provides additional storage for firmware.

No. of I/O Lines:

15 - Offers flexibility in interfacing with external devices.

Technical Specifications

Microcontrollers STM32F302K8U7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

15

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

52 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), I2S(2), SPI(2), USART(2), USB

Peripherals:

COMPARATOR(2), DMA(7), POR, RTC, TIMER(9)

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32F302K8U7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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