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STM32F205ZET7TR

STMicroelectronics

STM32F205ZET7TR by STMicroelectronics

STM32F205ZET7TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 144 terminals, and 131072 bytes of RAM. It features 24-Ch 12-Bit ADCs, 2-Ch 12-Bit DACs, and operates at a max clock frequency of 26 MHz. Ideal for industrial applications requiring high-speed data processing and multiple I/O interfaces.

Median Price

$8.752

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,500 parts In-Stock

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$8.752

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1,500

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$8.752

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Verical

USA . 1,500 parts In-Stock

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$8.752

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1,500

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$8.752

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 23,540 parts In-Stock

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$11.318

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$11.318

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Chip Stock

USA . 6,300 parts In-Stock

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Vyrian

USA . 4,952 parts In-Stock

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4,952

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Anansix

USA . 2,203 parts In-Stock

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2,203

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Digiode

USA . 1,099 parts In-Stock

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1,099

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,427 parts In-Stock

1+ parts

$8.240

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-

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1,427

$8.240

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Vigor

Singapore . 1,503 parts In-Stock

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$9.140

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$9.140

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AZTECH Wire

Italy . 494 parts In-Stock

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$12.420

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494

$12.420

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IDEA Electronic Components Group

UK . 1,939 parts In-Stock

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$17.883

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$16.095

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1,939

$17.883

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$16.095

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Microchip USA

USA . 2,135 parts In-Stock

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$29.990

100+ parts

$29.570

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$29.350

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$29.140

2,135

$29.990

$29.570

$29.350

$29.140

MKK Technologies

India . 1,469 parts In-Stock

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$33.628

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1,469

$33.628

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DigiPath Technology Company

USA . 1,469 parts In-Stock

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$33.628

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$33.628

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Lixinc

USA . 12,670 parts In-Stock

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12,670

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Parana Technologies

USA . 1,881 parts In-Stock

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$21.382

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$21.382

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Corphita

USA . 1,430 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,310 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Overview

Discover the cutting-edge STM32F205ZET7TR microcontroller by STMicroelectronics, a leader in innovative technology. With integrated cache and a wide range of peripherals including ADC and DAC channels, this powerful microcontroller is perfect for industrial applications. Benefit from its low power mode, high-speed performance, and extensive connectivity options. Elevate your projects with the reliable quality and advanced features of the STM32F205ZET7TR, setting you apart from the competition. Unlock endless possibilities and unleash your creativity with this exceptional microcontroller.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply options and compatibility with a variety of power sources.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures high performance and energy efficiency, making it suitable for a wide range of applications.

ADC Channels: YES

Analog to Digital Convertors help in converting real-world signals into digital values for processing, enabling the microcontroller to interact with external sensors and devices.

ROM Words: 524288

With a large ROM capacity, the microcontroller can store a significant amount of program data and instructions for complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computer) microcontroller allows for efficient and fast execution of instructions, enhancing overall performance.

Technical Specifications

Microcontrollers STM32F205ZET7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

114

No. of Serial I/Os:

8

No. of Terminals:

144

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

93 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), SPI(3), UART(2), USART(4), USB(2)

Peripherals:

BOR, DMA(16), POR, RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F205ZET7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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