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STM32F103VEH7

STMicroelectronics

STM32F103VEH7 by STMicroelectronics

STM32F103VEH7 by STMicroelectronics is a 32-bit microcontroller with 2.5/3.3V power supplies, 16MHz max clock frequency, and 65536 bytes of RAM. Ideal for industrial applications, it features CAN, I2C(2), SPI(3), USART(5) connectivity and DMA(12) peripherals for efficient data transfer.

Median Price

$8.265

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7,626 parts In-Stock

1+ parts

$6.780

100+ parts

-

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7,626

$6.780

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Verical

USA . 7,626 parts In-Stock

1+ parts

$6.780

100+ parts

-

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7,626

$6.780

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Mouser Electronics

USA . 621 parts In-Stock

1+ parts

$9.750

100+ parts

$7.500

1k+ parts

$7.180

10k+ parts

$7.110

621

$9.750

$7.500

$7.180

$7.110

Chip1Stop

Japan . 5,520 parts In-Stock

1+ parts

$11.582

100+ parts

$7.366

1k+ parts

$7.110

10k+ parts

-

5,520

$11.582

$7.366

$7.110

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$9.985

100+ parts

-

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500

$9.985

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Digiode

USA . 4,739 parts In-Stock

1+ parts

$10.128

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-

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4,739

$10.128

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Vyrian

USA . 8,637 parts In-Stock

1+ parts

-

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8,637

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Anansix

USA . 2,449 parts In-Stock

1+ parts

-

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2,449

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,842 parts In-Stock

1+ parts

$8.390

100+ parts

-

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3,842

$8.390

-

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Semicontronic

India . 3,808 parts In-Stock

1+ parts

$8.390

100+ parts

$8.180

1k+ parts

$8.138

10k+ parts

-

3,808

$8.390

$8.180

$8.138

-

Corphita

USA . 971 parts In-Stock

1+ parts

$9.595

100+ parts

-

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-

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971

$9.595

-

-

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Continental Prestige Electronics

USA . 5,264 parts In-Stock

1+ parts

$9.985

100+ parts

-

1k+ parts

-

10k+ parts

$9.785

5,264

$9.985

-

-

$9.785

Netroflash

USA . 100 parts In-Stock

1+ parts

$9.985

100+ parts

-

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100

$9.985

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Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$11.300

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3,000

$11.300

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IDEA Electronic Components Group

UK . 345 parts In-Stock

1+ parts

$36.154

100+ parts

-

1k+ parts

$32.539

10k+ parts

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345

$36.154

-

$32.539

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Aztec Data Supply Inc.

USA . 1,423 parts In-Stock

1+ parts

$43.990

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-

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1,423

$43.990

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Corohmni

South Africa . 102 parts In-Stock

1+ parts

$67.593

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102

$67.593

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MKK Technologies

India . 310 parts In-Stock

1+ parts

$67.986

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310

$67.986

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DigiPath Technology Company

USA . 310 parts In-Stock

1+ parts

$67.986

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310

$67.986

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$87.023

100+ parts

$82.672

1k+ parts

$82.672

10k+ parts

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500

$87.023

$82.672

$82.672

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Lixinc

USA . 14,349 parts In-Stock

1+ parts

-

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14,349

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iodParts Technologies Inc.

India . 13,070 parts In-Stock

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13,070

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 2,597 parts In-Stock

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2,597

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Parana Technologies

USA . 2,115 parts In-Stock

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$43.228

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2,115

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$43.228

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GreenTree Electronics

Israel . 1,108 parts In-Stock

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1,108

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Glotronic Ltd.

UK . 378 parts In-Stock

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378

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Kepictronics

USA . 294 parts In-Stock

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294

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Argo Parts USA

USA . 51 parts In-Stock

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51

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Overview

Elevate your projects with the STM32F103VEH7 microcontroller by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering advanced features like DAC and ADC channels, DMA capabilities, and a powerful 32-bit CPU family. With a compact design and industrial-grade temperature tolerance, the STM32F103VEH7 provides exceptional value and performance for your innovative creations. Upgrade your projects today with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 32

Offers higher processing capabilities and performance for demanding tasks.

DAC Channels: YES

Enables the microcontroller to output analog signals with high precision.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for efficient and optimized performance.

ADC Channels: YES

Allows the microcontroller to accurately convert analog signals into digital data for processing.

Maximum Clock Frequency: 16 MHz

Provides high-speed processing capabilities for quick and efficient operation.

Connectivity: CAN, I2C(2), I2S(2), IRDA, LIN, SDMMC, SPI(3), USART(5), USB

Offers a wide range of communication options for integration with various devices and systems.

Technical Specifications

Microcontrollers STM32F103VEH7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

80

No. of Terminals:

100

No. of Timers:

11

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), IRDA, LIN, SDMMC, SPI(3), USART(5), USB

Peripherals:

DMA(12), POR, RTC, TIMER(11)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F103VEH7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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