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STM32F103VBH6

STMicroelectronics

STM32F103VBH6 by STMicroelectronics

STM32F103VBH6 by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words and 20480 RAM bytes. It features 16-Ch 12-Bit ADC channels, PWM channels, and connectivity options like CAN, I2C(2), SPI(2), USART(3), USB. Ideal for industrial applications requiring a max clock frequency of 16 MHz.

Median Price

$6.146

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 83 parts In-Stock

1+ parts

$4.672

100+ parts

-

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-

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-

83

$4.672

-

-

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Chip1Stop

Japan . 3,201 parts In-Stock

1+ parts

$7.620

100+ parts

$4.680

1k+ parts

$4.370

10k+ parts

-

3,201

$7.620

$4.680

$4.370

-

EBV Elektronik

Germany . 3,496 parts In-Stock

1+ parts

-

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3,496

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Avnet

USA . 368 parts In-Stock

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368

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Distributors (In-Stock)

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Digiode

USA . 4,886 parts In-Stock

1+ parts

$5.453

100+ parts

-

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-

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4,886

$5.453

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$6.720

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-

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-

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500

$6.720

-

-

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Vyrian

USA . 8,162 parts In-Stock

1+ parts

-

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8,162

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Anansix

USA . 1,841 parts In-Stock

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-

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1,841

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ComSIT Distribution GmbH

Germany . 1,104 parts In-Stock

1+ parts

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1,104

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Amalfi Trading

USA . 528 parts In-Stock

1+ parts

-

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528

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Connector Distribution Corp

USA . 67 parts In-Stock

1+ parts

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67

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Right Parts Inc.

USA . 67 parts In-Stock

1+ parts

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67

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,368 parts In-Stock

1+ parts

$4.880

100+ parts

-

1k+ parts

-

10k+ parts

-

1,368

$4.880

-

-

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Semicontronic

India . 1,276 parts In-Stock

1+ parts

$4.880

100+ parts

$4.758

1k+ parts

$4.734

10k+ parts

-

1,276

$4.880

$4.758

$4.734

-

Corphita

USA . 174 parts In-Stock

1+ parts

$5.166

100+ parts

-

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174

$5.166

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$6.870

100+ parts

-

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208

$6.870

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Vigor

Singapore . 1,424 parts In-Stock

1+ parts

$7.920

100+ parts

-

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1,424

$7.920

-

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Continental Prestige Electronics

USA . 19 parts In-Stock

1+ parts

$8.740

100+ parts

$6.210

1k+ parts

-

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19

$8.740

$6.210

-

-

IDEA Electronic Components Group

UK . 1,306 parts In-Stock

1+ parts

$18.816

100+ parts

-

1k+ parts

$16.934

10k+ parts

-

1,306

$18.816

-

$16.934

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Microchip USA

USA . 5,467 parts In-Stock

1+ parts

$25.760

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-

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5,467

$25.760

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Aztec Data Supply Inc.

USA . 1,382 parts In-Stock

1+ parts

$32.460

100+ parts

-

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1,382

$32.460

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MKK Technologies

India . 1,385 parts In-Stock

1+ parts

$35.382

100+ parts

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1,385

$35.382

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DigiPath Technology Company

USA . 1,385 parts In-Stock

1+ parts

$35.382

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1,385

$35.382

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Lixinc

USA . 13,582 parts In-Stock

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13,582

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Argo Parts USA

USA . 4,944 parts In-Stock

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4,944

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Futuretech Components

Singapore . 4,500 parts In-Stock

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4,500

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Kepictronics

USA . 3,140 parts In-Stock

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3,140

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Perfect Parts

USA . 2,205 parts In-Stock

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2,205

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iodParts Technologies Inc.

India . 1,104 parts In-Stock

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1,104

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A-Z Elektronik GmbH

Germany . 960 parts In-Stock

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960

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Parana Technologies

USA . 461 parts In-Stock

1+ parts

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$22.497

1k+ parts

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461

-

$22.497

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-

Overview

Unlock endless possibilities with the STM32F103VBH6 microcontroller by STMicroelectronics. Designed with precision and reliability, this Cortex-M3 CPU family member offers advanced peripherals like DMA, RTC, and POR for seamless integration into industrial applications. With its low profile, fine pitch package style and 32-bit architecture, this microcontroller delivers high performance at a maximum clock frequency of 16 MHz. Experience efficient connectivity with CAN, USB, I2C, SPI, and USART interfaces, making it ideal for a wide range of projects. Trust in STMicroelectronics to provide cutting-edge technology that empowers innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material provides durability and reliability for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy assembly and integration into electronic devices, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher voltage levels and provide stable operation in various environments.

Package Shape: SQUARE

Square package shape makes it easier to mount and secure the microcontroller on a circuit board, ensuring proper alignment and connection.

Bit Size: 32

32-bit architecture provides higher computational power and efficiency, enabling the microcontroller to handle complex tasks and calculations with ease.

Power Supplies (V): 2.5/3.3

Multiple power supply options (2.5V and 3.3V) allow flexibility in design and compatibility with different power sources, enhancing the versatility of the microcontroller.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for peripherals and external components, enabling seamless integration and communication with other devices.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2V ensures the microcontroller can operate efficiently even at lower power levels, extending its usability in low-energy consumption applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this microcontroller can withstand elevated heat levels and operate reliably in harsh environmental conditions.

CPU Family: CORTEX-M3

Based on the Cortex-M3 architecture, this microcontroller offers high performance, low power consumption, and advanced features for a wide range of embedded applications.

Technical Specifications

Microcontrollers STM32F103VBH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), SPI(2), USART(3), USB

Peripherals:

DMA(7), POR, RTC, TIMER(7)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F103VBH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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