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STM32F101RGT6TR

STMicroelectronics

STM32F101RGT6TR by STMicroelectronics

STM32F101RGT6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 16 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 18,500 parts In-Stock

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18,500

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Chip Stock

USA . 7,460 parts In-Stock

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7,460

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Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

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6,000

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Digiode

USA . 4,719 parts In-Stock

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4,719

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Vyrian

USA . 4,176 parts In-Stock

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4,176

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Pegasus Components GmbH

Germany . 1,000 parts In-Stock

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Anansix

USA . 102 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 1,345 parts In-Stock

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$6.450

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$6.450

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AZTECH Wire

Italy . 186 parts In-Stock

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$16.910

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186

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Microchip USA

USA . 3,731 parts In-Stock

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$21.603

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$21.603

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

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$26.938

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$24.244

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MKK Technologies

India . 1,084 parts In-Stock

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$50.654

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DigiPath Technology Company

USA . 1,084 parts In-Stock

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$50.654

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Infinite Electronics LLP (Excess)

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Corphita

USA . 3,551 parts In-Stock

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GreenTree Electronics

Israel . 400 parts In-Stock

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400

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Parana Technologies

USA . 190 parts In-Stock

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$32.208

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190

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$32.208

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Overview

Unlock the potential of your next project with the STM32F101RGT6TR microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability. This versatile microcontroller offers a wide range of applications, providing customers with unparalleled value and benefits. With advanced features like DAC channels, ADC channels, and DMA channels, this product is perfect for industrial-grade projects that require high performance and precision. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape helps in efficient use of board space and facilitates easy placement on PCB layouts.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance for handling complex tasks efficiently.

DAC Channels: YES

The presence of DAC channels enables accurate analog output control, making it suitable for applications requiring precise voltage output.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages offers flexibility in design and compatibility with different power sources.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for interfacing with external devices and peripherals, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style helps in achieving compact designs and efficient heat dissipation.

Minimum Supply Voltage: 2 V

The low minimum supply voltage allows for operation in low-power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the product suitable for industrial and harsh environments.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers a balance between performance and power efficiency, making it ideal for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable operation even in extreme cold conditions.

ADC Channels: YES

The presence of ADC channels allows for accurate analog input conversion, enabling precise measurement and control capabilities.

DMA Channels: YES

The availability of DMA channels enhances data transfer speeds and offloads the CPU, improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers a secure and stable connection, reducing the risk of signal interference or disconnection.

ROM Words: 1048576

The large ROM size provides ample space for program storage, accommodating complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The low seated height allows for slim and compact designs, making it suitable for space-constrained applications.

Width: 10 mm

The compact width dimension enables easy integration into tight spaces or small form factor devices.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency allows for fast processing speeds and real-time responsiveness in applications.

Length: 10 mm

The small length dimension contributes to the overall compact footprint of the product, making it ideal for size-sensitive applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in extreme temperature conditions typically found in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller-based peripheral IC offers high performance and efficiency in executing instructions.

RAM Bytes: 81920

The large RAM size provides ample memory for data storage and processing, enabling efficient multitasking and data handling.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form provides a reliable solder connection and facilitates ease of soldering during assembly processes.

Maximum Supply Current: 41 mA

The low maximum supply current ensures efficient power usage and minimizes heat generation, contributing to energy efficiency.

Nominal Supply Voltage: 2.4 V

The nominal supply voltage offers a stable operating voltage for consistent performance and reliability in various operating conditions.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog signals, enabling applications such as motor control and LED dimming.

ROM Programmability: FLASH

The use of flash ROM programmability enables easy and fast reprogramming of the device for firmware updates or system enhancements.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on PCBs, enabling more compact and space-efficient designs.

Speed: 36 rpm

The specified speed parameter may not directly apply to a microcontroller product, as it is more relevant for motors or mechanical devices.

No. of I/O Lines: 51

The 51 I/O lines provide ample connectivity options for interfacing with external devices and sensors, offering flexibility in system design.

Technical Specifications

Microcontrollers STM32F101RGT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

81920

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32F101RGT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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